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LWS6016A4

Lewa Micro · MOSFETs · TO-252

LWS6016A4 from Lewa Micro, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS rated ±20 V and a threshold VGS(TH) of -1.3 V typ (-1.0 V min, -2.3 V max per the electrical table).
2 D passive Drain, shared with the exposed tab; VDSS -60 V, continuous ID -55 A at TC=25℃ and pulsed IDM -220 A.
3 S passive Source; connects to the body diode anode, with continuous diode forward current IS of -55 A.

Key specifications

Parameter Value
Manufacturer Lewa Micro
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS -60 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -55 A TC=25°C 1
Continuous Drain Current ID -35 A TC=100°C 1
Pulsed Drain Current IDM -220 A 1
Power Dissipation PD 100 W 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 ℃ 1
Maximum Temperature for Soldering TL 260 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 1.25 ℃/W 1
Thermal Resistance, Junction-to-Ambient RθJA 60 ℃/W Surface mounted on FR4 board, t ≤ 10 sec 1
Drain-to-Source Breakdown Voltage V(BR)DSS -60 V VGS=0V, ID=-250µA 2
Drain-to-Source Leakage Current IDSS -1 μA VDS=-60V, VGS=0V 2
Gate-to-Source Forward Leakage IGSS(F) 100 nA VGS=+20V, VDS=0V 2
Gate-to-Source Reverse Leakage IGSS(R) -100 nA VGS=-20V, VDS=0V 2
Gate Threshold Voltage VGS(TH) -1.2 -1.8 -2.3 V VDS=VGS, ID=-250µA 2
Drain-to-Source On-Resistance RDS(ON)2 14 20 mΩ VGS=-10V, ID=-20A 2
Diode Forward Current IS -55 A 2
Diode Pulse Current ISM -220 A 2
Diode Forward Voltage VSD -1.3 V IS=-20A, VGS=0V 2

CAD (KiCad official)

  • Symbol: LWS6016A4
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: lws6016a4-etched.step / lws6016a4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lws6016a4.step / lws6016a4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Lewa Micro datasheet (10 pp, sha256 0f931354ff03956b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF