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LTM4625EY#PBF
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Analog Devices DC-DC Converters, BGA-25. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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PCB Footprint
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Datasheet
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Contents
README
markdownLTM4625EY#PBF
Analog Devices · DC-DC Converters · BGA-25
LTM4625EY#PBF from Analog Devices, in a BGA-25. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| A1 | COMP | output | Current control threshold and error amplifier compensation point with normal range 0.3V to 1.8V; internally compensated, strictly an output, do not drive; tie COMP pins together for parallel operation. |
| A2 | TRACK/SS | input | Output tracking and soft-start input; a voltage below 0.6V servos FB to TRACK/SS, and an internal 2µA pull-up from INTVCC allows a capacitor to set soft-start. |
| A3 | RUN | input | Run control input that enables the regulator above 1.2V and shuts it down below 1.1V; do not leave floating (absolute max 22V). |
| A4 | FREQ | input | Frequency set internally to 1MHz; a resistor to SGND increases frequency or a resistor to INTVCC reduces it. |
| A5 | CLKIN | input | External synchronization input to the phase detector, internally terminated to SGND with 20k; PLL locks top NMOS turn-on to the CLKIN rising edge. |
| B1 | FB | input | Negative input of the error amplifier, internally connected to VOUT through a 60.4k resistor; add a resistor to SGND to program output voltage, and tie FB pins together for parallel operation. |
| B2 | PHMODE | input | Phase selector control input: tie to INTVCC for 2-phase, SGND for 3-phase, INTVCC/2 for 4-phase operation. |
| B3 | GND | power_in | Power ground for both input and output returns. |
| B4 | SGND | power_in | Signal ground connection; tie to GND with minimum distance and connect FREQ resistor, COMP component, MODE, TRACK/SS component and FB resistor to it as needed. |
| B5 | CLKOUT | output | Output clock signal for PolyPhase operation with peak-to-peak amplitude INTVCC to GND, phase relative to CLKIN set by PHMODE; do not drive. |
| C1 | VOUT | power_out | Power output pin; apply the load between VOUT and GND pins with output decoupling capacitance directly between them. |
| C2 | PGOOD | output | Open-drain power good output pulled to ground when FB is not within ±10% of the internal 0.6V reference. |
| C3 | GND | power_in | Power ground for both input and output returns. |
| C4 | MODE | input | Operation mode select: tie to INTVCC for forced continuous operation, or to SGND for discontinuous mode at light loads; do not leave floating. |
| C5 | SVIN | power_in | Signal VIN, filtered input to the on-chip 3.3V regulator; tie to VIN or to an external supply of at least 4V that must exceed VOUT (absolute max 22V). |
| D1 | VOUT | power_out | Power output pin; apply the load between VOUT and GND pins with output decoupling capacitance directly between them. |
| D2 | VOUT | power_out | Power output pin; apply the load between VOUT and GND pins with output decoupling capacitance directly between them. |
| D3 | GND | power_in | Power ground for both input and output returns. |
| D4 | GND | power_in | Power ground for both input and output returns. |
| D5 | VIN | power_in | Power input pin; apply input voltage (4V to 20V, absolute max 22V) between VIN and GND pins with input decoupling capacitance directly between them. |
| E1 | VOUT | power_out | Power output pin; apply the load between VOUT and GND pins with output decoupling capacitance directly between them. |
| E2 | VOUT | power_out | Power output pin; apply the load between VOUT and GND pins with output decoupling capacitance directly between them. |
| E3 | GND | power_in | Power ground for both input and output returns. |
| E4 | INTVCC | power_out | Internal regulator output (3.1V to 3.3V) powering the internal drivers and control circuits, internally decoupled with 1µF to GND; do not drive. |
| E5 | VIN | power_in | Power input pin; apply input voltage (4V to 20V, absolute max 22V) between VIN and GND pins with input decoupling capacitance directly between them. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | BGA-25 |
| Category | Power Management ICs |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input DC Voltage | VIN | 4 | 20 | V | SVIN = VIN | 2 | |
| Output Voltage Range | VOUT | 0.6 | 5.5 | V | 2 | ||
| Output Voltage, Total Variation with Line and Load | VOUT(DC) | 1.477 | 1.5 | 1.523 | V | CIN = 22µF, COUT = 100µF Ceramic, RFB = 40.2k, MODE = INTVCC, IOUT = 0A to 5A, -40°C to 125°C | 2 |
| RUN Pin On Threshold | VRUN | 1.1 | 1.2 | 1.3 | V | VRUN Rising | 2 |
| Input Supply Bias Current (MODE = INTVCC) | IQ(SVIN) | 6 | mA | VIN = 12V, VOUT = 1.5V, MODE = INTVCC | 2 | ||
| Input Supply Bias Current (MODE = GND) | IQ(SVIN) | 2 | mA | VIN = 12V, VOUT = 1.5V, MODE = GND | 2 | ||
| Input Supply Bias Current (Shutdown) | IQ(SVIN) | 11 | µA | Shutdown, RUN = 0, VIN = 12V | 2 | ||
| Input Supply Current | IS(VIN) | 0.75 | A | VIN = 12V, VOUT = 1.5V, IOUT = 5A | 2 | ||
| Output Continuous Current Range | IOUT(DC) | 0 | 5 | A | VIN = 12V, VOUT = 1.5V | 3 | |
| Line Regulation Accuracy | ΔVOUT(Line)/VOUT | 0.04 | 0.15 | %/V | VOUT = 1.5V, VIN = 4V to 20V, IOUT = 0A | 3 | |
| Load Regulation Accuracy | ΔVOUT(Load)/VOUT | 0.5 | 1.5 | % | VOUT = 1.5V, IOUT = 0A to 5A | 3 | |
| Output Current Limit | IOUTPK | 6 | 7 | A | VIN = 12V, VOUT = 1.5V | 3 | |
| Voltage at FB Pin | VFB | 0.593 | 0.6 | 0.607 | V | IOUT = 0A, VOUT = 1.5V, -40°C to 125°C | 3 |
| Resistor Between VOUT and FB Pins | RFBHI | 60.05 | 60.4 | 60.75 | kΩ | 3 | |
| Current at FB Pin | IFB | -30 | 30 | nA | Note 4 | 3 | |
| Track Pin Soft-Start Pull-Up Current | ITRACK/SS | 2 | 4 | µA | TRACK/SS = 0V | 3 | |
| VIN Undervoltage Lockout | VIN(UVLO) | 2.4 | 2.6 | 2.8 | V | VIN Falling | 3 |
| VIN UVLO Hysteresis | VIN(UVLO) | 350 | mV | VIN Hysteresis | 3 | ||
| PGOOD Trip Level (Negative) | VPGOOD | -15 | -10 | -7 | % | VFB With Respect to Set Output, VFB Ramping Negative | 3 |
| PGOOD Trip Level (Positive) | VPGOOD | 7 | 10 | 15 | % | VFB With Respect to Set Output, VFB Ramping Positive | 3 |
| PGOOD Leakage | IPGOOD | 2 | µA | 3 | |||
| PGOOD Voltage Low | VPGL | 0.02 | 0.1 | V | IPGOOD = 1mA | 3 | |
| Internal VCC Voltage | VINTVCC | 3.1 | 3.2 | 3.3 | V | SVIN = 4V to 20V | 3 |
| Output Ripple Voltage | VOUT(AC) | 5 | mV | IOUT = 0A, COUT = 100µF Ceramic, VIN = 12V, VOUT = 1.5V | 3 | ||
| Turn-On Overshoot | ΔVOUT(START) | 30 | mV | IOUT = 0A, COUT = 100µF Ceramic, VIN = 12V, VOUT = 1.5V | 3 | ||
| Turn-On Time | tSTART | 2.5 | ms | COUT = 100µF Ceramic, No Load, TRACK/SS = 0.01µF, VIN = 12V, VOUT = 1.5V | 3 | ||
| Peak Deviation for Dynamic Load | ΔVOUTLS | 160 | mV | Load: 0% to 50% to 0% of Full Load, COUT = 47µF Ceramic, VIN = 12V, VOUT = 1.5V | 3 | ||
| Settling Time for Dynamic Load Step | tSETTLE | 40 | µs | Load: 0% to 50% to 0% of Full Load, COUT = 47µF Ceramic, VIN = 12V, VOUT = 1.5V | 3 | ||
| Minimum On-Time | tON(MIN) | 40 | ns | Note 4 | 3 | ||
| Minimum Off-Time | tOFF(MIN) | 70 | ns | Note 4 | 3 | ||
| Oscillator Frequency | fOSC | 1 | MHz | 3 | |||
| VIN, SVIN Voltage | VIN, SVIN | -0.3 | 22 | V | 2 | ||
| RUN Voltage | RUN | -0.3 | 22 | V | 2 | ||
| PGOOD, MODE, TRACK/SS, FREQ, PHMODE, CLKIN Voltage | -0.3 | 3.3 | V | -0.3V to INTVCC (INTVCC is 3.3V max per VINTVCC) | 2 | ||
| Internal Operating Temperature Range | -40 | 125 | °C | Notes 2, 5 | 2 | ||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Peak Solder Reflow Body Temperature | 245 | °C | 2 | ||||
| Maximum Junction Temperature | TJMAX | 125 | °C | 2 | |||
| Thermal Resistance Junction-to-Case (Top) | θJCtop | 17 | °C/W | JESD51-12 | 2 | ||
| Thermal Resistance Junction-to-Case (Bottom) | θJCbottom | 11 | °C/W | JESD51-12 | 2 | ||
| Thermal Resistance Junction-to-Board plus Board-to-Ambient | θJB + θBA | 22 | °C/W | JESD51-12 | 2 | ||
| Thermal Resistance Junction-to-Ambient | θJA | 22 | °C/W | Derived from 95mm × 76mm PCB with 4 layers | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | • Use a separated SGND ground copper area for components connected to signal pins. Connect the SGND | 20 |
CAD (KiCad official)
- Symbol:
LTM4625EY#PBF - Footprint:
Package_BGA:BGA-25_6.35x6.35mm_Layout5x5_P1.27mm - 3D model: BGA-25 (KiCad packages3D, STEP)
- 3D model files:
ltm4625ey-pbf-etched.step/ltm4625ey-pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ltm4625ey-pbf.step/ltm4625ey-pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (26 pp, sha256
85df67ba0803249b, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).