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LTM4624IY#PBF

Analog Devices · Power Modules · BGA-25(6.2x6.2)

LTM4624IY#PBF from Analog Devices, in a BGA-25(6.2x6.2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
A1 COMP passive Current control threshold and error amplifier compensation point; its normal range is 0.3V to 1.8V, and COMP pins are tied together for parallel operation.
A2 TRACK/SS input Output tracking and soft-start input; a voltage below 0.6V servos FB to the TRACK/SS voltage, above 0.6V the internal reference resumes control, and an internal 2.5µA pull-up from INTVCC makes a capacitor here set soft-start.
A3 RUN input Run control input that enables the regulator when tied above 1.25V and shuts it down when pulled below 1.1V; do not leave floating.
A4 FREQ input Frequency pin where the switching frequency is set internally to 1MHz; an external resistor to SGND increases frequency and a resistor to INTVCC reduces it.
A5 NC unconnected No connect pin, not connected internally; float or ground it.
B1 FB input Negative input of the error amplifier, internally connected to VOUT through a 60.4k precision resistor, with output voltage programmed by an additional resistor between FB and SGND.
B2 NC unconnected No connect pin, not connected internally; float or ground it.
B3 GND power_in Power ground pin for both input and output returns.
B4 SGND power_in Signal ground connection that must be tied to GND with minimum distance, and to which the FREQ, COMP, MODE, TRACK/SS and FB components connect as needed.
B5 NC unconnected No connect pin, not connected internally; float or ground it.
C1 VOUT power_out Power output pin; apply the load between VOUT and GND pins and place output decoupling capacitance directly between them.
C2 PGOOD output Open-drain power good output that is pulled to ground when the FB voltage is not within ±10% of the internal 0.6V reference.
C3 GND power_in Power ground pin for both input and output returns.
C4 MODE input Operation mode select; tie to INTVCC to force continuous synchronous operation at all loads, or to SGND for discontinuous mode at light loads; do not leave floating.
C5 SVIN power_in Signal VIN that is the filtered input to the on-chip 3.3V regulator; connect to an external supply of at least 4V that must also be greater than VOUT, normally tied to VIN.
D1 VOUT power_out Power output pin; apply the load between VOUT and GND pins and place output decoupling capacitance directly between them.
D2 VOUT power_out Power output pin; apply the load between VOUT and GND pins and place output decoupling capacitance directly between them.
D3 GND power_in Power ground pin for both input and output returns.
D4 GND power_in Power ground pin for both input and output returns.
D5 VIN power_in Power input pin; apply the input voltage between VIN and GND pins and place input decoupling capacitance directly between VIN and GND pins.
E1 VOUT power_out Power output pin; apply the load between VOUT and GND pins and place output decoupling capacitance directly between them.
E2 VOUT power_out Power output pin; apply the load between VOUT and GND pins and place output decoupling capacitance directly between them.
E3 GND power_in Power ground pin for both input and output returns.
E4 INTVCC power_out Internal 3.3V regulator output that powers the internal power drivers and control circuits and is internally decoupled to GND with a 1µF low ESR ceramic capacitor.
E5 VIN power_in Power input pin; apply the input voltage between VIN and GND pins and place input decoupling capacitance directly between VIN and GND pins.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package BGA-25(6.2x6.2)
Category Power Management ICs
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input DC Voltage VIN 4 14 V SVIN = VIN 2
Output Voltage Range VOUT(RANGE) 0.6 5.5 V 2
Output Voltage, Total Variation with Line and Load VOUT(DC) 1.47 1.5 1.53 V CIN = 22µF, COUT = 100µF Ceramic, RFB = 40.2k, MODE = INTVCC, VIN = 4V to 14V, IOUT = 0A to 4A (Note 3); -40°C to 125°C 2
RUN Pin On Threshold VRUN 1.1 1.2 1.3 V VRUN Rising 2
Line Regulation Accuracy ΔVOUT (Line)/VOUT 0.04 0.15 %/V VOUT = 1.5V, VIN = 4V to 14V, IOUT = 0A 3
Load Regulation Accuracy ΔVOUT (Load)/VOUT 1 1.5 % VOUT = 1.5V, IOUT = 0A to 4A 3
Output Continuous Current Range IOUT(DC) 0 4 A VIN = 12V, VOUT = 1.5V 2
Output Current Limit IOUTPK 5 7 A VIN = 12V, VOUT = 1.5V 3
Voltage at FB Pin VFB 0.594 0.6 0.606 V IOUT = 0A, VOUT = 1.5V 3
Voltage at FB Pin VFB 0.591 0.6 0.609 V IOUT = 0A, VOUT = 1.5V, -40°C to 125°C 3
Current at FB Pin IFB -30 30 nA Note 4 3
Resistor Between VOUT and FB Pins RFBHI 60.05 60.4 60.75 kΩ 3
Track Pin Soft-Start Pull-Up Current ITRACK/SS 2.5 4 µA TRACK/SS = 0V 3
VIN Undervoltage Lockout VIN(UVLO) 2.4 2.6 2.8 V VIN Falling 3
PGOOD Trip Level, VFB Ramping Negative VPGOOD -13 -10 -7 % VFB with respect to set output; VFB ramping negative 3
PGOOD Trip Level, VFB Ramping Positive VPGOOD 7 10 13 % VFB with respect to set output; VFB ramping positive 3
PGOOD Voltage Low VPGL 0.02 0.1 V IPGOOD = 1mA 3
Internal VCC Voltage VINTVCC 3.2 3.3 3.4 V SVIN = 4V to 14V 3
Input Voltage (VIN, SVIN) VIN, SVIN -0.3 15 V 2
Output Voltage VOUT -0.3 V Note 4; upper limit printed as SVIN or 6V 2
RUN Pin Voltage RUN -0.3 V Upper limit printed as 15VIN 2
INTVCC Voltage INTVCC -0.3 3.6 V 2
Digital Pin Voltage (PGOOD, MODE, TRACK/SS, FREQ) PGOOD, MODE, TRACK/SS, FREQ -0.3 V Upper limit printed as INTVCC 2
Feedback Pin Voltage (COMP, FB) COMP, FB -0.3 V Note 4; upper limit printed as INTVCC 2
Internal Operating Junction Temperature Range -40 125 °C Notes 2, 5 2
Storage Temperature Range -55 125 °C 2
Peak Solder Reflow Body Temperature 245 °C Note 1 2
Junction-to-Ambient Thermal Resistance θJA 22 °C/W Derived from 95mm × 76mm PCB with 4 layers; JESD 51-12 2
Junction-to-Case (Top) Thermal Resistance θJCtop 17 °C/W JESD 51-12 2
Junction-to-Case (Bottom) Thermal Resistance θJCbottom 11 °C/W JESD 51-12 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper • Use a separated SGND ground copper area for com￾ponents connected to signal pins. Connect the SGND 20

CAD (KiCad official)

  • Symbol: LTM4624IY#PBF
  • Footprint: Package_BGA:BGA-25_6.35x6.35mm_Layout5x5_P1.27mm
  • 3D model: BGA-25(6.2x6.2) (KiCad packages3D, STEP)
  • 3D model files: ltm4624iy-pbf-etched.step / ltm4624iy-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ltm4624iy-pbf.step / ltm4624iy-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (26 pp, sha256 6cae4b5c5ec234fe, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF