component
LTC8582XV8
Public Made by Adomby adom
Linearin(先积集成) , MSOP-8L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 5d ago |
| viewers | 5d ago |
| ltc8582xv8-etched.glb | 5d ago |
| ltc8582xv8-etched.step | 5d ago |
| ltc8582xv8-hero.glb | 5d ago |
| ltc8582xv8-hero.overlay.json | 5d ago |
| ltc8582xv8.glb | 5d ago |
| ltc8582xv8.kicad_mod | 5d ago |
| ltc8582xv8.kicad_sym | 5d ago |
| ltc8582xv8.lbr | 5d ago |
| ltc8582xv8.step | 5d ago |
| package.json | 5d ago |
| page.json | 5d ago |
| README.md | 5d ago |
LTC8582XV8
Linearin(先积集成) · IC · MSOP-8L
LTC8582XV8 from Linearin(先积集成), in a MSOP-8L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Amplifier A output. |
| 2 | -INA | input | Inverting input of amplifier A. |
| 3 | +INA | input | Non-inverting input of amplifier A. |
| 4 | -VS | power_in | Negative (lowest) power supply. |
| 5 | +INB | input | Non-inverting input of amplifier B. |
| 6 | -INB | input | Inverting input of amplifier B. |
| 7 | OUTB | output | Amplifier B output. |
| 8 | +VS | power_in | Positive (highest) power supply; 1.8 V to 5.5 V supply range, 10 V absolute maximum. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Linearin(先积集成) |
| Package | MSOP-8L |
| Category | |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input signal terminal current (±10 mA printed) | -10 | 10 | mA | 2 | |||
| Storage temperature range | Tstg | -65 | 150 | ℃ | 2 | ||
| Junction temperature | TJ | 150 | ℃ | 2 | |||
| Lead temperature range (soldering) | 260 | ℃ | Soldering 10 sec | 2 | |||
| Supply voltage, VS+ to VS- | 10 | V | 2 | ||||
| ESD human body model (HBM) | -5000 | 5000 | V | Human body model (HBM), per MIL-STD-883J / Method 3015.9 | 2 | ||
| ESD charged device model (CDM) | -2000 | 2000 | V | Charged device model (CDM), per ESDA/JEDEC JS-002-2014 | 2 | ||
| ESD machine model (MM) | -250 | 250 | V | Machine model (MM), per JESD22-A115C | 2 | ||
| Input offset voltage | VOS | -40 | 10 | 40 | μV | 3 | |
| Offset voltage drift | VOS TC | -0.5 | 0.1 | 0.5 | μV/℃ | TA = −40 to +125 ℃ | 3 |
| Power supply rejection ratio | PSRR | 106 | 120 | dB | VS = 2.0 to 5.5 V, VCM < VS+ − 2V | 3 | |
| Power supply rejection ratio over temperature | PSRR | 97 | dB | TA = −40 to +125 ℃ | 3 | ||
| Input bias current at +85 ℃ | IB | 250 | pA | TA = +85 ℃ | 3 | ||
| Input bias current at +125 ℃ | IB | 800 | pA | TA = +125 ℃ | 3 | ||
| Common-mode rejection ratio | CMRR | 100 | 120 | dB | VS = 5.5 V, VCM = −0.1 to 5.5 V | 3 | |
| Common-mode rejection ratio over temperature | CMRR | 96 | dB | VCM = 0 to 5.3 V, TA = −40 to +125 ℃ | 3 | ||
| Common-mode rejection ratio at 2.0 V supply | CMRR | 90 | 109 | dB | VS = 2.0 V, VCM = −0.1 to 2.0 V | 3 | |
| Common-mode rejection ratio at 2.0 V supply over temperature | CMRR | 87 | dB | VCM = 0 to 1.8 V, TA = −40 to +125 ℃ | 3 | ||
| Open-loop voltage gain | AVOL | 106 | 128 | dB | RL = 25 kΩ, VO = 0.05 to 3.5 V | 3 | |
| Open-loop voltage gain over temperature (RL = 25 kΩ) | AVOL | 100 | dB | TA = −40 to +125 ℃ | 3 | ||
| Open-loop voltage gain (RL = 2 kΩ) | AVOL | 98 | 115 | dB | RL = 2 kΩ, VO = 0.15 to 3.5 V | 3 | |
| Open-loop voltage gain over temperature (RL = 2 kΩ) | AVOL | 92 | dB | TA = −40 to +125 ℃ | 3 | ||
| Short-circuit current | ISC | -45 | 45 | mA | 4 | ||
| Operating supply voltage | VS | 1.8 | 5.5 | V | TA = 0 to +70 ℃ | 4 | |
| Operating supply voltage | VS | 2 | 5.5 | V | TA = −40 to +125 ℃ | 4 | |
| Quiescent current (per amplifier) | IQ | 150 | 210 | μA | 4 | ||
| Operating temperature range | TA | -40 | 125 | ℃ | 4 | ||
| Package thermal resistance, junction-to-ambient (MSOP-8L) | θJA | 216 | ℃/W | MSOP-8L | 4 |
CAD (KiCad official)
- Symbol:
LTC8582XV8 - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8L (KiCad packages3D, STEP)
- 3D model files:
ltc8582xv8-etched.step/ltc8582xv8-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ltc8582xv8.step/ltc8582xv8.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Linearin(先积集成) datasheet (22 pp, sha256
df239dddb4e70016, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).