component
LTC8581XS8
Public Made by Adomby adom
Linearin(先积集成) , SOIC-8L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLTC8581XS8
Linearin(先积集成) · IC · SOIC-8L
LTC8581XS8 from Linearin(先积集成), in a SOIC-8L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection. |
| 2 | -IN | input | Inverting input of the amplifier; input common-mode range extends 100 mV below the negative supply to the positive supply. |
| 3 | +IN | input | Non-inverting input of the amplifier; input common-mode range extends 100 mV below the negative supply to the positive supply. |
| 4 | -VS | power_in | Negative (lowest) power supply. |
| 5 | NC | unconnected | No internal connection. |
| 6 | OUT | output | Amplifier output with rail-to-rail swing and short-circuit current of ±45 mA typical. |
| 7 | +VS | power_in | Positive (highest) power supply, 1.8 V to 5.5 V operating range (2.0 V to 5.5 V over -40 to +125 °C), 10 V absolute maximum between supplies. |
| 8 | NC | unconnected | No internal connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Linearin(先积集成) |
| Package | SOIC-8L |
| Category | |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, VS+ to VS- (absolute maximum) | 10 | V | 2 | ||||
| Signal input current | -10 | 10 | mA | Signal input terminals, printed as ±10 mA | 2 | ||
| Storage temperature range, Tstg | Tstg | -65 | 150 | ℃ | 2 | ||
| Junction temperature, TJ | TJ | 150 | ℃ | 2 | |||
| Lead temperature range (soldering) | 260 | ℃ | Soldering 10 sec | 2 | |||
| ESD human body model (HBM) | -5000 | 5000 | V | Per MIL-STD-883J / Method 3015.9, printed as ±5 000 V | 2 | ||
| ESD charged device model (CDM) | -2000 | 2000 | V | Per ESDA/JEDEC JS-002-2014, printed as ±2 000 V | 2 | ||
| ESD machine model (MM) | -250 | 250 | V | Per JESD22-A115C, printed as ±250 V | 2 | ||
| Input offset voltage | VOS | -40 | 10 | 40 | μV | 3 | |
| Offset voltage drift | VOS TC | -0.5 | 0.1 | 0.5 | μV/℃ | TA = −40 to +125 ℃ | 3 |
| Power supply rejection ratio | PSRR | 106 | 120 | dB | VS = 2.0 to 5.5 V, VCM < VS+ − 2V | 3 | |
| Power supply rejection ratio (hot) | PSRR | 97 | dB | TA = −40 to +125 ℃ | 3 | ||
| Input bias current | IB | 250 | pA | TA = +85 ℃ | 3 | ||
| Input bias current (hot) | IB | 800 | pA | TA = +125 ℃ | 3 | ||
| Common-mode rejection ratio | CMRR | 100 | 120 | dB | VS = 5.5 V, VCM = −0.1 to 5.5 V | 3 | |
| Common-mode rejection ratio (hot, 5 V) | CMRR | 96 | dB | VCM = 0 to 5.3 V, TA = −40 to +125 ℃ | 3 | ||
| Common-mode rejection ratio (2 V) | CMRR | 90 | 109 | dB | VS = 2.0 V, VCM = −0.1 to 2.0 V | 3 | |
| Common-mode rejection ratio (hot, 1.8 V) | CMRR | 87 | dB | VCM = 0 to 1.8 V, TA = −40 to +125 ℃ | 3 | ||
| Open-loop voltage gain | AVOL | 106 | 128 | dB | RL = 25 kΩ, VO = 0.05 to 3.5 V | 3 | |
| Open-loop voltage gain (hot, RL = 25 kΩ block) | AVOL | 100 | dB | TA = −40 to +125 ℃ | 3 | ||
| Open-loop voltage gain (RL = 2 kΩ) | AVOL | 98 | 115 | dB | RL = 2 kΩ, VO = 0.15 to 3.5 V | 3 | |
| Open-loop voltage gain (hot, RL = 2 kΩ block) | AVOL | 92 | dB | TA = −40 to +125 ℃ | 3 | ||
| Operating supply voltage | VS | 1.8 | 5.5 | V | TA = 0 to +70 ℃ | 4 | |
| Operating supply voltage (hot) | VS | 2 | 5.5 | V | TA = −40 to +125 ℃ | 4 | |
| Quiescent current (per amplifier) | IQ | 150 | 210 | μA | 4 | ||
| Operating temperature range | TA | -40 | 125 | ℃ | 4 | ||
| Package thermal resistance, junction to ambient (SOIC-8L) | θJA | 125 | ℃/W | SOIC-8L | 4 |
CAD (KiCad official)
- Symbol:
LTC8581XS8 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8L (KiCad packages3D, STEP)
- 3D model files:
ltc8581xs8-etched.step/ltc8581xs8-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ltc8581xs8.step/ltc8581xs8.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Linearin(先积集成) datasheet (22 pp, sha256
df239dddb4e70016, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).