component
LTC7001EMSE#TRPBF
Public Made by Adomby adom
Analog Devices Gate Drivers, MSOP-10-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 7d ago |
| viewers | 7d ago |
| ltc7001emse-trpbf-etched.glb | 7d ago |
| ltc7001emse-trpbf-etched.step | 7d ago |
| ltc7001emse-trpbf-hero.glb | 7d ago |
| ltc7001emse-trpbf-hero.overlay.json | 7d ago |
| ltc7001emse-trpbf.glb | 7d ago |
| ltc7001emse-trpbf.kicad_mod | 7d ago |
| ltc7001emse-trpbf.kicad_sym | 7d ago |
| ltc7001emse-trpbf.lbr | 7d ago |
| ltc7001emse-trpbf.step | 7d ago |
| package.json | 7d ago |
| page.json | 7d ago |
| README.md | 7d ago |
LTC7001EMSE#TRPBF
Analog Devices · Gate Drivers · MSOP-10-EP
LTC7001EMSE#TRPBF from Analog Devices, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Main supply pin, with a bypass capacitor of at least 0.1µF tied between this pin and GND; the gate driver supply operates from 3.5V to 15V (VCC absolute maximum -0.3V to 15V). |
| 2 | VCCUV | input | Sets the VCC undervoltage lockout for the gate driver through a resistor to GND, where 0.5V to 1.5V on this pin is multiplied by seven; shorting to GND sets 3.5V and leaving it open sets 7.0V, with an absolute maximum of -0.3V to 6V. |
| 3 | GND | power_in | Ground reference for the device, and the exposed pad (pin 11) must be soldered to the PCB for rated electrical and thermal performance. |
| 4 | INP | input | CMOS-compatible input referenced to GND that sets the state of TGDN and TGUP, with an internal 1MΩ pull-down to GND and an absolute maximum range of -6V to 15V. |
| 5 | OVLO | input | Overvoltage lockout input driven through a resistor divider from the input supply, where a voltage above 1.21V pulls TGDN to TS and normal operation resumes below 1.11V; absolute maximum is -0.3V to 6V, and it should be tied to GND when not used. |
| 6 | TGDN | output | High current gate driver pull-down to TS; for the fastest turn-off it should be tied directly to the gate of the external high side MOSFET, and it must drive capacitive loads only (no applied voltage or current source). |
| 7 | TGUP | output | High current gate driver pull-up to BST; tie it to TGDN for maximum transition speed or add a resistor to the MOSFET gate to control turn-on inrush current, and it must drive capacitive loads only. |
| 8 | TS | power_in | Top (high side) source connection, or GND in ground-referenced applications; the TS voltage range is -6V to 150V absolute maximum and the operating range is 0V to 135V. |
| 9 | BST | power_out | High side bootstrapped supply, with an external capacitor of at least 0.1µF tied between BST and TS; the voltage swings from 12V to (VTS + 12V) and the BST voltage absolute maximum is -0.3V to 150V. |
| 10 | NC | unconnected | No connect pin that should be left floating. |
| 11 | GND | power_in | Exposed pad, internally GND, which must be soldered to the PCB for rated electrical and thermal performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | MSOP-10-EP |
| Category | Motor Driver ICs |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| TS Operating Voltage Range | 0 | 135 | V | 3 | |||
| VCC Supply Current, ON Mode | 27 | 50 | µA | VBST-TS = 13V, VINP = 4V | 3 | ||
| VCC Supply Current, Sleep Mode | 27 | 50 | µA | VBST-TS = 13V, VINP = 0.4V | 3 | ||
| VCC UVLO Rising | 6.5 | 7 | 7.5 | V | VCCUV = OPEN, VCC Rising | 3 | |
| VCC UVLO Falling | 5.8 | 6.4 | 6.9 | V | VCCUV = OPEN, VCC Falling | 3 | |
| VCC UVLO Rising | 3.1 | 3.5 | 3.7 | V | VCCUV = 0V, VCC Rising | 3 | |
| VCC UVLO Falling | 2.8 | 3.2 | 3.4 | V | VCCUV = 0V, VCC Falling | 3 | |
| VCC UVLO Rising | 9.7 | 10.5 | 10.9 | V | VCCUV = 1.5V, VCC Rising | 3 | |
| VCC UVLO Falling | 9.1 | 9.9 | 10.3 | V | VCCUV = 1.5V, VCC Falling | 3 | |
| VBST-TS Gate Drive Voltage Above VTS | VBST-TS | 9 | 10 | 14 | V | VCC = VTS = 7V, IBST = 0µA | 3 |
| VBST-TS Gate Drive Voltage Above VTS | VBST-TS | 10 | 11 | 14 | V | VCC = VTS = 10V, IBST = 0µA | 3 |
| VBST-TS Gate Drive Voltage Above VTS | VBST-TS | 12 | 12 | 14 | V | VTS = 135V, IBST = 0µA | 3 |
| Charge Pump Output Current | -15 | -30 | µA | VTS = 20V, VBST-TS = 10V | 3 | ||
| TG Pull-Up Resistance | 2.2 | 7 | Ω | VCC = VBST = 12V | 3 | ||
| TG Pull-Down Resistance | 1 | 4 | Ω | VCC = VBST = 12V | 3 | ||
| Input to Output Propagation Delay, Rising | tPLH | 35 | 70 | ns | VINP Rising, CL = 1nF | 3 | |
| Input to Output Propagation Delay, Falling | tPHL | 35 | 70 | ns | VINP Falling, CL = 1nF | 3 | |
| Input Threshold Voltage, Rising | VIH | 1.7 | 2 | 2.2 | V | VINP Rising | 3 |
| Input Threshold Voltage, Falling | VIL | 1.3 | 1.6 | 1.8 | V | VINP Falling | 3 |
| OVLO Pin Threshold Voltage, Rising | 1.16 | 1.21 | 1.26 | V | Rising | 3 | |
| OVLO Pin Threshold Voltage, Falling | 1.05 | 1.1 | 1.15 | V | Falling | 3 | |
| OVLO Pin Leakage Current | -100 | 0 | 100 | nA | VOVLO = 1.3V | 3 | |
| VCCUV Pull-Up Current | VVCCUV | -11.3 | -10 | 8.7 | µA | VVCCUV = 1V | 3 |
| BST-TS Voltage | -0.3 | 15 | V | 2 | |||
| VCC Voltage | VCC | -0.3 | 15 | V | 2 | ||
| TS Voltage | TS | -6 | 150 | V | 2 | ||
| BST Voltage | BST | -0.3 | 150 | V | 2 | ||
| INP Voltage | INP | -6 | 15 | V | 2 | ||
| VCCUV Voltage | VCCUV | -0.3 | 6 | V | 2 | ||
| OVLO Voltage | OVLO | -0.3 | 6 | V | 2 | ||
| Operating Junction Temperature Range | TJ | -40 | 125 | °C | LTC7001E | 2 | |
| Storage Temperature Range | TSTG | -65 | 150 | °C | 2 | ||
| Lead Temperature (Soldering, 10 sec), MSOP Package | 300 | °C | 10 sec soldering | 2 | |||
| Maximum Junction Temperature | TJMAX | 150 | °C | 2 | |||
| Thermal Resistance, Junction to Ambient | θJA | 45 | °C/W | 2 | |||
| Thermal Resistance, Junction to Case | θJC | 10 | °C/W | 2 |
CAD (KiCad official)
- Symbol:
LTC7001EMSE#TRPBF - Footprint:
Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm - 3D model: MSOP-10-EP (KiCad packages3D, STEP)
- 3D model files:
ltc7001emse-trpbf-etched.step/ltc7001emse-trpbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ltc7001emse-trpbf.step/ltc7001emse-trpbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (18 pp, sha256
3b2666e0063a6722, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).