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LTC6652BHMS8-4.096#PBF
Public Made by Adomby adom
Analog Devices Pre-ordered Chips, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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LTC6652BHMS8-4.096#PBF
Analog Devices · Pre-ordered Chips · MSOP-8
LTC6652BHMS8-4.096#PBF from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do Not Connect; this pin must be left unconnected. |
| 2 | VIN | power_in | Power supply input; the minimum supply is VOUT + 300mV or 2.7V, whichever is higher, and the maximum is 13.2V, with a 0.1µF bypass capacitor to GND recommended to improve PSRR. |
| 3 | SHDN | input | Active-low shutdown input that powers the device down to <2µA; tie to VIN for normal operation, and SHDN should be at least 2.0V for normal operation. |
| 4 | GND | power_in | Device ground. |
| 5 | GND | power_in | Internal function pin; ground this pin, connected to device GND (pin 4). |
| 6 | VOUT | power_out | Output voltage; an output capacitor is not required, but a capacitor between 0.1µF and 10µF can be beneficial for some applications. |
| 7 | GND | power_in | Internal function pin; ground this pin, connected to device GND (pin 4). |
| 8 | GND | power_in | Internal function pin; ground this pin, connected to device GND (pin 4). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | MSOP-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (LTC6652B accuracy) | -0.1 | 0.1 | % | LTC6652B; TA = 25°C, VIN = VOUT + 0.5V | 3 | ||
| Output Voltage Temperature Coefficient | 4 | 10 | ppm/°C | LTC6652BMS8; l (full operating temperature range) | 3 | ||
| Line Regulation | 2 | 80 | ppm/V | VOUT + 0.5V ≤ VIN ≤ 13.2V, SHDN = VIN; l | 3 | ||
| Load Regulation (sourcing) | 20 | 200 | ppm/mA | ISOURCE = 5mA, LTC6652-4.096; l | 4 | ||
| Load Regulation (sinking) | 50 | 450 | ppm/mA | ISINK = 5mA, LTC6652-4.096; l | 4 | ||
| Shutdown Pin Logic High Input Voltage | 2 | V | SHDN; l | 4 | |||
| Shutdown Pin Logic High Input Current | 0.1 | 1 | µA | SHDN; l | 4 | ||
| Shutdown Pin Logic Low Input Voltage | 0.8 | V | SHDN; l | 4 | |||
| Shutdown Pin Logic Low Input Current | 0.1 | 1 | µA | SHDN; l | 4 | ||
| Supply Current | 350 | 560 | µA | No load; l | 4 | ||
| Shutdown Current | 0.1 | 2 | µA | SHDN tied to GND; l | 4 | ||
| Output Short-Circuit Current | 16 | mA | Short VOUT to GND | 4 | |||
| Output Voltage Noise (LTC6652-4.096) | 2.3 | ppmP-P | 0.1Hz ≤ f ≤ 10Hz | 4 | |||
| Turn-On Time | 100 | µs | 0.1% settling, CLOAD = 0 | 4 | |||
| Long-Term Drift of Output Voltage (MS8) | 60 | ppm/√kHr | LTC6652MS8 | 4 | |||
| Hysteresis | 80 | ppm | ΔT = -40°C to 125°C, LTC6652MS8 | 4 | |||
| Hysteresis | 75 | ppm | ΔT = -40°C to 85°C, LTC6652MS8 | 4 | |||
| Hysteresis | 45 | ppm | ΔT = 0°C to 70°C, LTC6652MS8 | 4 | |||
| VIN to GND | VIN | -0.3 | 13.2 | V | Absolute maximum | 2 | |
| SHDN to GND | SHDN | -0.3 | V | Absolute maximum; upper limit printed as (VIN + 0.3V) | 2 | ||
| Output Voltage | VOUT | -0.3 | V | Absolute maximum; upper limit printed as (VIN + 0.3V) | 2 | ||
| Operating Temperature Range | -40 | 125 | °C | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Maximum Junction Temperature | TJMAX | 150 | °C | MS8 package | 2 | ||
| Thermal Resistance, Junction to Ambient | θJA | 200 | °C/W | MS8 package | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs | Plastic mould compounds absorb water. With changes | 14 |
CAD (KiCad official)
- Symbol:
LTC6652BHMS8-4.096#PBF - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
ltc6652bhms8-4-096-pbf-etched.step/ltc6652bhms8-4-096-pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ltc6652bhms8-4-096-pbf.step/ltc6652bhms8-4-096-pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (20 pp, sha256
cb57839f236ed0a6, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# LTC6652BHMS8-4.096#PBF
**Analog Devices** · Pre-ordered Chips · MSOP-8
LTC6652BHMS8-4.096#PBF from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do Not Connect; this pin must be left unconnected. |
| 2 | VIN | power_in | Power supply input; the minimum supply is VOUT + 300mV or 2.7V, whichever is higher, and the maximum is 13.2V, with a 0.1µF bypass capacitor to GND recommended to improve PSRR. |
| 3 | SHDN | input | Active-low shutdown input that powers the device down to <2µA; tie to VIN for normal operation, and SHDN should be at least 2.0V for normal operation. |
| 4 | GND | power_in | Device ground. |
| 5 | GND | power_in | Internal function pin; ground this pin, connected to device GND (pin 4). |
| 6 | VOUT | power_out | Output voltage; an output capacitor is not required, but a capacitor between 0.1µF and 10µF can be beneficial for some applications. |
| 7 | GND | power_in | Internal function pin; ground this pin, connected to device GND (pin 4). |
| 8 | GND | power_in | Internal function pin; ground this pin, connected to device GND (pin 4). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | MSOP-8 |
| Category | Interface ICs |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (LTC6652B accuracy) | | -0.1 | | 0.1 | % | LTC6652B; TA = 25°C, VIN = VOUT + 0.5V | 3 |
| Output Voltage Temperature Coefficient | | | 4 | 10 | ppm/°C | LTC6652BMS8; l (full operating temperature range) | 3 |
| Line Regulation | | | 2 | 80 | ppm/V | VOUT + 0.5V ≤ VIN ≤ 13.2V, SHDN = VIN; l | 3 |
| Load Regulation (sourcing) | | | 20 | 200 | ppm/mA | ISOURCE = 5mA, LTC6652-4.096; l | 4 |
| Load Regulation (sinking) | | | 50 | 450 | ppm/mA | ISINK = 5mA, LTC6652-4.096; l | 4 |
| Shutdown Pin Logic High Input Voltage | | 2 | | | V | SHDN; l | 4 |
| Shutdown Pin Logic High Input Current | | | 0.1 | 1 | µA | SHDN; l | 4 |
| Shutdown Pin Logic Low Input Voltage | | | | 0.8 | V | SHDN; l | 4 |
| Shutdown Pin Logic Low Input Current | | | 0.1 | 1 | µA | SHDN; l | 4 |
| Supply Current | | | 350 | 560 | µA | No load; l | 4 |
| Shutdown Current | | | 0.1 | 2 | µA | SHDN tied to GND; l | 4 |
| Output Short-Circuit Current | | | 16 | | mA | Short VOUT to GND | 4 |
| Output Voltage Noise (LTC6652-4.096) | | | 2.3 | | ppmP-P | 0.1Hz ≤ f ≤ 10Hz | 4 |
| Turn-On Time | | | 100 | | µs | 0.1% settling, CLOAD = 0 | 4 |
| Long-Term Drift of Output Voltage (MS8) | | | 60 | | ppm/√kHr | LTC6652MS8 | 4 |
| Hysteresis | | | 80 | | ppm | ΔT = -40°C to 125°C, LTC6652MS8 | 4 |
| Hysteresis | | | 75 | | ppm | ΔT = -40°C to 85°C, LTC6652MS8 | 4 |
| Hysteresis | | | 45 | | ppm | ΔT = 0°C to 70°C, LTC6652MS8 | 4 |
| VIN to GND | VIN | -0.3 | | 13.2 | V | Absolute maximum | 2 |
| SHDN to GND | SHDN | -0.3 | | | V | Absolute maximum; upper limit printed as (VIN + 0.3V) | 2 |
| Output Voltage | VOUT | -0.3 | | | V | Absolute maximum; upper limit printed as (VIN + 0.3V) | 2 |
| Operating Temperature Range | | -40 | | 125 | °C | | 2 |
| Storage Temperature Range | | -65 | | 150 | °C | | 2 |
| Maximum Junction Temperature | TJMAX | | | 150 | °C | MS8 package | 2 |
| Thermal Resistance, Junction to Ambient | θJA | | 200 | | °C/W | MS8 package | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs | | Plastic mould compounds absorb water. With changes | 14 |
## CAD (KiCad official)
- Symbol: `LTC6652BHMS8-4.096#PBF`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `ltc6652bhms8-4-096-pbf-etched.step` / `ltc6652bhms8-4-096-pbf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ltc6652bhms8-4-096-pbf.step` / `ltc6652bhms8-4-096-pbf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Analog Devices datasheet](https://www.analog.com/media/en/technical-documentation/data-sheets/6652fg.pdf) (20 pp, sha256 `cb57839f236ed0a6`, retrieved 2026-10-30, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ltc6652bhms8-4-096-pbf-datasheet.pdf)