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LTC6652AHMS8-2.5#PBF
Public Made by Adomby adom
Analog Devices Pre-ordered Chips, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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LTC6652AHMS8-2.5#PBF
Analog Devices · Pre-ordered Chips · MSOP-8
LTC6652AHMS8-2.5#PBF from Analog Devices, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do Not Connect; this pin must be left unconnected. |
| 2 | VIN | power_in | Power supply input; the minimum supply is VOUT + 300mV or 2.7V, whichever is higher, and the maximum supply is 13.2V, with a 0.1µF bypass to GND improving PSRR. |
| 3 | SHDN | input | Active-low shutdown input that powers the device down to <2µA; tie to VIN for normal operation (SHDN should be ≥2.0V for normal operation). |
| 4 | GND | power_in | Device ground. |
| 5 | GND | power_in | Internal function pin; ground this pin (connect to device GND, pin 4). |
| 6 | VOUT | output | Voltage reference output; an output capacitor is not required, but a 0.1µF to 10µF capacitor can be beneficial, and the device sources and sinks ±5mA for the 2.5V version. |
| 7 | GND | power_in | Internal function pin; ground this pin (connect to device GND, pin 4). |
| 8 | GND | power_in | Internal function pin; ground this pin (connect to device GND, pin 4). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | MSOP-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage (LTC6652A, 2.5V) | -0.05 | 0.05 | % | 3 | |||
| Output Voltage Temperature Coefficient (LTC6652A) | 2 | 5 | ppm/°C | l (full operating temperature range), Note 3 | 3 | ||
| Line Regulation (LTC6652A) | 2 | 50 | ppm/V | VOUT + 0.5V ≤ VIN ≤ 13.2V, SHDN = VIN | 3 | ||
| Load Regulation, sourcing (LTC6652A) | 20 | 75 | ppm/mA | ISOURCE = 5mA, LTC6652-2.5 (Note 4) | 4 | ||
| Load Regulation, sinking (LTC6652A) | 50 | 150 | ppm/mA | ISINK = 5mA, LTC6652-2.5 (Note 4) | 4 | ||
| Output Short-Circuit Current | 16 | mA | Short VOUT to GND | 4 | |||
| Shutdown Pin (SHDN) Logic High Input Voltage | 2 | V | l | 4 | |||
| Shutdown Pin (SHDN) Logic High Input Current | 0.1 | 1 | µA | l | 4 | ||
| Shutdown Pin (SHDN) Logic Low Input Voltage | 0.8 | V | l | 4 | |||
| Shutdown Pin (SHDN) Logic Low Input Current | 0.1 | 1 | µA | l | 4 | ||
| Supply Current | 350 | 560 | µA | No load, l | 4 | ||
| Shutdown Current | 0.1 | 2 | µA | SHDN tied to GND, l | 4 | ||
| Hysteresis (MS8) | 80 | ppm | ΔT = -40°C to 125°C, LTC6652MS8 | 4 | |||
| Hysteresis (MS8) | 75 | ppm | ΔT = -40°C to 85°C, LTC6652MS8 | 4 | |||
| Hysteresis (MS8) | 45 | ppm | ΔT = 0°C to 70°C, LTC6652MS8 | 4 | |||
| Turn-On Time | 100 | µs | 0.1% settling, CLOAD = 0 | 4 | |||
| Output Voltage Noise (LTC6652-2.5) | 2.1 | ppmP-P | 0.1Hz ≤ f ≤ 10Hz | 4 | |||
| Long-Term Drift of Output Voltage (MS8) | 60 | ppm/√kHr | LTC6652MS8 | 4 | |||
| VIN to GND (absolute maximum) | VIN | -0.3 | 13.2 | V | 2 | ||
| Operating Temperature Range | -40 | 125 | °C | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | Note 2 | 2 | ||
| Maximum Junction Temperature | TJMAX | 150 | °C | MS8 package | 2 | ||
| Thermal Resistance, junction to ambient | θJA | 200 | °C/W | MS8 package | 2 | ||
| Supply Voltage (VIN) | VIN | 2.8 | 13.2 | V | Typical application, 2.8V ≤ VIN ≤ 13.2V | 1 | |
| SHDN Voltage for normal operation | SHDN | 2 | V | For normal operation, SHDN ≥ 2.0V | 12 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | abs | Plastic mould compounds absorb water. With changes | 14 |
CAD (KiCad official)
- Symbol:
LTC6652AHMS8-2.5#PBF - Footprint:
Package_SO:MSOP-8_3x3mm_P0.65mm - 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files:
ltc6652ahms8-2-5-pbf-etched.step/ltc6652ahms8-2-5-pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ltc6652ahms8-2-5-pbf.step/ltc6652ahms8-2-5-pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (20 pp, sha256
cb57839f236ed0a6, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).