main
Ray Publish 0.1.0 3aca932 4d ago

LTC3225EDDB#TRPBF

Analog Devices · Power Management - Specialized · DFN-10(2x3)

LTC3225EDDB#TRPBF from Analog Devices, in a DFN-10(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C+ passive Flying capacitor positive terminal; a 1μF X5R or X7R ceramic capacitor should be connected from C+ to C-.
2 C- passive Flying capacitor negative terminal, connected to C+ through the 1μF X5R or X7R flying capacitor.
3 CX passive Midpoint of the two series supercapacitors; forced to track COUT/2 during charging to balance the top and bottom supercapacitors.
4 SHDN input Active-low shutdown input; a low puts the part in low current shutdown mode and it must not be left floating.
5 PGOOD output Open-drain status output that stays low until VOUT is within 6% (typical) of its final value and pulls low if VOUT falls 7.2% (typical) below regulation; it may be pulled up through an external resistor and is Hi-Z in shutdown.
6 VSEL input Output voltage selection input; logic low sets COUT to 4.8V (LTC3225) or 4V (LTC3225-1), logic high sets COUT to 5.3V (LTC3225) or 4.5V (LTC3225-1), and it must not be left floating.
7 PROG passive Charge current programming pin; a resistor connected between this pin and GND sets the charge current.
8 GND power_in Charge pump ground that must be soldered directly to PCB ground.
9 VIN power_in Power supply input for the part, operating from 2.8V to 5.5V, to be bypassed to GND with a low ESR ceramic capacitor of more than 2.2μF.
10 COUT power_out Charge pump output connected to the top plate of the top supercapacitor; regulates the final voltage to 4.8V/5.3V (LTC3225) or 4V/4.5V (LTC3225-1).
11 GND power_in Exposed pad ground that must be soldered to a low impedance PCB ground for rated thermal performance.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package DFN-10(2x3)
Category Power Management (PMIC)
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Charge Current IOUT 125 150 175 mA VIN = 3.6V, RPROG = 12k, CTOP = CBOT, VOUT = 4.5V (LTC3225) 3
CLK Frequency fOSC 0.6 0.9 1.5 MHz 3
Input Supply Undervoltage Lockout High-to-Low Threshold VIN-UVLO 2.65 2.75 2.85 V VSEL = VIN 2
Input Supply Undervoltage Lockout High-to-Low Threshold VIN-UVLO 2.4 2.5 2.6 V VSEL = 0 2
Input Voltage Range VIN 3 5.5 V VSEL = VIN 2
Input Voltage Range VIN 2.8 5.5 V VSEL = 0V 2
VCOUT Charge Termination Voltage; Sleep Mode Threshold (Rising Edge) VCOUT 5.2 5.3 5.4 V VSEL = VIN 2
VCOUT Charge Termination Voltage; Sleep Mode Threshold (Rising Edge) VCOUT 4.7 4.8 4.9 V VSEL = 0V 2
Maximum Voltage Across Each Supercapacitor After Charging VTOP/BOT 2.75 V VSEL = VIN 2
Maximum Voltage Across Each Supercapacitor After Charging VTOP/BOT 2.5 V VSEL = 0V 2
PGOOD Low Output Voltage VPGOOD 0.4 V IPGOOD = -1.6mA 3
PGOOD High Impedance Leakage Current IPGOOD-LEAK 10 μA VPGOOD = 5V 3
PGOOD Low-to-High Threshold Relative to Output Voltage Threshold VPG 92 94 96 % 3
PGOOD Threshold Hysteresis Relative to Output Voltage Threshold VPG-HYS 0.25 1.2 2.5 % 3
Input High Voltage VIH 1.3 V 3
Input Low Voltage VIL 0.4 V 3
Input High Current IIH -1 1 μA 3
Input Low Current IIL -1 1 μA 3
No Load Operating Current at VIN IQ-VIN 20 40 μA IOUT = 0mA 3
Shutdown Current ISHDN-VIN 0.1 1 μA SHDN = 0V, VOUT = 0V 3
Input Supply Undervoltage Lockout Hysteresis VIN-UVLO-HYS 150 mV VSEL = VIN 2
Input Supply Undervoltage Lockout Hysteresis VIN-UVLO-HYS 140 mV VSEL = 0 2
Output Comparator Hysteresis VCOUT-HYS 100 mV 2
Input Charge Current IVIN 306 mA VIN = 3.6V, RPROG = 12k, CTOP = CBOT 3
Input Charge Current IVIN 55 mA VIN = 3.6V, RPROG = 60k, CTOP = CBOT 3
Output Charge Current IOUT 26 mA VIN = 3.6V, RPROG = 60k, CTOP = CBOT, VOUT = 4.5V (LTC3225) 3
Effective Open-Loop Output Impedance ROL 8 Ω VIN = 3.6V, VOUT = 4.5V (LTC3225) 3
VIN, COUT to GND Voltage VIN -0.3 6 V 2
SHDN, VSEL Voltage -0.3 V VIN + 0.3V maximum 2
IOUT Continuous Current IOUT 175 mA Note 2 2
Operating Temperature Range -40 85 °C Note 3 2
Storage Temperature Range -65 125 °C 2
Maximum Junction Temperature TJMAX 125 °C 2
Thermal Resistance, Junction to Ambient θJA 76 °C/W 2

CAD (KiCad official)

  • Symbol: LTC3225EDDB#TRPBF
  • Footprint: Package_DFN_QFN:DFN-10-1EP_2x3mm_P0.5mm_EP0.64x2.4mm
  • 3D model: DFN-10(2x3) (KiCad packages3D, STEP)
  • 3D model files: ltc3225eddb-trpbf-etched.step / ltc3225eddb-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ltc3225eddb-trpbf.step / ltc3225eddb-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (14 pp, sha256 135ab11eb5629412, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF