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LTC2481IDD#PBF

Analog Devices · Analog To Digital Converters (ADC) · DFN-10-EP(3x3)

LTC2481IDD#PBF from Analog Devices, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 REF+ input Positive differential reference input; it may be any value between GND and VCC as long as REF+ is at least 0.1V more positive than REF-.
2 VCC power_in Positive supply voltage; bypass to GND (pin 8) with a 1µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor as close to the part as possible.
3 REF- input Negative differential reference input; it must be at least 0.1V less positive than REF+ and lie between GND and VCC.
4 IN+ input Positive differential analog input that may range from GND - 0.3V to VCC + 0.3V, with a bipolar differential input range of -0.5·VREF/GAIN to 0.5·VREF/GAIN; outside this range the converter produces overrange/underrange codes.
5 IN- input Negative differential analog input that may range from GND - 0.3V to VCC + 0.3V, forming with IN+ the bipolar input range of -0.5·VREF/GAIN to 0.5·VREF/GAIN.
6 SCL input I2C serial clock input; the LTC2481 acts only as a slave, shifting data into SDA on SCL rising edges and outputting data on SDA on SCL falling edges.
7 SDA bidirectional I2C bidirectional serial data line: high impedance in data input (write) mode, and an open-drain N-channel driver in data output (read) mode that requires an external pull-up resistor or current source to VCC.
8 GND power_in Ground; connect to a ground plane through a low impedance connection.
9 CA1 input Three-state (LOW, HIGH, or Floating) chip address control pin that sets bit CA1 of the device I2C address.
10 CA0/f0 input Two-state (HIGH or Floating) chip address control pin when no transition is detected; when driven by an external clock of at least 10kHz (fEOSC), it becomes the system clock with the digital filter rejection null at fEOSC/5120 and sets CA0 internally HIGH.
11 GND power_in Exposed pad is GND and must be soldered to the PCB.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package DFN-10-EP(3x3)
Category Data Acquisition
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (VCC) to GND VCC -0.3 6 V 2
Analog Input Voltage to GND -0.3 V upper limit printed as (VCC + 0.3V) 2
Digital Input Voltage to GND -0.3 V upper limit printed as (VCC + 0.3V) 2
Operating Temperature Range -40 85 °C LTC2481I 2
Storage Temperature Range -65 125 °C 2
Resolution (No Missing Codes) 16 Bits 0.1 ≤ VREF ≤ VCC, -FS ≤ VIN ≤ +FS (Note 5) 2
Integral Nonlinearity 2 ppm of VREF 5V ≤ VCC ≤ 5.5V, VREF = 5V, VIN(CM) = 2.5V (Note 6) 2
Integral Nonlinearity 10 ppm of VREF 2.7V ≤ VCC ≤ 5.5V, VREF = 2.5V, VIN(CM) = 1.25V (Note 6) 2
Offset Error 0.5 2.5 µV 2.5V ≤ VREF ≤ VCC, GND ≤ IN+ = IN- ≤ VCC (Note 13) 2
Positive Full-Scale Error 25 ppm of VREF 2.5V ≤ VREF ≤ VCC, IN+ = 0.75VREF, IN- = 0.25VREF 2
Negative Full-Scale Error 25 ppm of VREF 2.5V ≤ VREF ≤ VCC, IN- = 0.75VREF, IN+ = 0.25VREF 2
Total Unadjusted Error 15 ppm of VREF 5V ≤ VCC ≤ 5.5V, VREF = 2.5V, VIN(CM) = 1.25V (Note 6) 2
Internal PTAT Signal 390 450 mV TA = 27°C 2
Programmable Gain 1 256 See Table 2a 2
Offset Error (2x Speed) 0.5 2 mV 2.5V ≤ VREF ≤ VCC, GND ≤ IN+ = IN- ≤ VCC (Note 13) 3
Positive Full-Scale Error (2x Speed) 25 ppm of VREF 2.5V ≤ VREF ≤ VCC, IN+ = 0.75VREF, IN- = 0.25VREF 3
Negative Full-Scale Error (2x Speed) 25 ppm of VREF 2.5V ≤ VREF ≤ VCC, IN- = 0.75VREF, IN+ = 0.25VREF 3
Programmable Gain (2x Speed) 1 128 See Table 2b 3
Reference Voltage Range (REF+, REF-) VREF 0.1 V 3
Input Common Mode Rejection DC 140 dB 2.5V ≤ VREF ≤ VCC, GND ≤ IN- = IN+ ≤ VCC (Note 5) 3
Input Common Mode Rejection 50Hz ±2% 140 dB 2.5V ≤ VREF ≤ VCC, GND ≤ IN- = IN+ ≤ VCC (Note 5) 3
Input Common Mode Rejection 60Hz ±2% 140 dB 2.5V ≤ VREF ≤ VCC, GND ≤ IN- = IN+ ≤ VCC (Note 5) 3
Input Normal Mode Rejection 50Hz ±2% 110 120 dB 2.5V ≤ VREF ≤ VCC, GND ≤ IN- = IN+ ≤ VCC (Notes 5, 7) 3
Input Normal Mode Rejection 60Hz ±2% 110 120 dB 2.5V ≤ VREF ≤ VCC, GND ≤ IN- = IN+ ≤ VCC (Notes 5, 8) 3
Input Normal Mode Rejection 50Hz/60Hz ±2% 87 dB 2.5V ≤ VREF ≤ VCC, GND ≤ IN- = IN+ ≤ VCC (Notes 5, 9) 3
Reference Common Mode Rejection DC 120 140 dB 2.5V ≤ VREF ≤ VCC, GND ≤ IN- = IN+ ≤ VCC (Note 5) 3
IN+ DC Leakage Current IDC_LEAK (IN+) -10 1 10 nA Sleep Mode, IN+ = GND 4
IN- DC Leakage Current IDC_LEAK (IN-) -10 1 10 nA Sleep Mode, IN- = GND 4
REF+, REF- DC Leakage Current IDC_LEAK (VREF) -100 1 100 nA Sleep Mode, VREF = VCC 4
Resistance from CA0/f0, CA1 to VCC to Set Chip Address Bit to 1 RINH 10 kΩ 4
Resistance from CA1 to GND to Set Chip Address Bit to 0 RINL 10 kΩ 4
Resistance from CA0/f0, CA1 to VCC or GND to Set Chip Address Bit to Float RINF 2 MΩ 4
Low Level Output Voltage VOL 0.4 V SDA I = 3mA 4
Output Fall Time from VIHMIN to VILMAX tOF 250 ns Bus Load CB 10pF to 400pF (Note 14) 4
Low Level CA0/f0 External Oscillator VIL(EXT,OSC) 0.5 V 2.7V ≤ VCC < 5.5V 4
External Capacitive Load On-Chip Address Pins (CA0/f0,CA1) for Valid Float CCAX 10 pF for Valid Float 4
Supply Voltage VCC 2.7 5.5 V 4
Supply Current ICC 160 µA Conversion Mode (Note 11) 4
Supply Current ICC 1 2 µA Sleep Mode (Note 11) 4
External Oscillator Frequency Range fEOSC 10 1000 kHz 5
External Oscillator High Period tHEO 0.125 100 µs 5
External Oscillator Low Period tLEO 0.125 100 µs 5
Conversion Time for 1x Speed Mode tCONV_1 157.2 160.3 163.5 ms 50Hz Mode 5
Conversion Time for 1x Speed Mode tCONV_1 131 133.6 136.3 ms 60Hz Mode 5
Conversion Time for 1x Speed Mode tCONV_1 144.1 146.9 149.9 ms Simultaneous 50Hz/60Hz Mode 5
Conversion Time for 2x Speed Mode tCONV_2 78.7 80.3 81.9 ms 50Hz Mode 5
Conversion Time for 2x Speed Mode tCONV_2 65.6 66.9 68.2 ms 60Hz Mode 5
Conversion Time for 2x Speed Mode tCONV_2 72.2 73.6 75.1 ms Simultaneous 50Hz/60Hz Mode 5
SCL Clock Frequency fSCL 0 400 kHz 5
Hold Time (Repeated) START Condition tHD(SDA) 0.6 µs 5
LOW Period of the SCL Clock Pin tLOW 1.3 µs 5
HIGH Period of the SCL Clock Pin tHIGH 0.6 µs 5
Data Hold Time tHD(DAT) 0 0.9 µs 5
Data Set-Up Time tSU(DAT) 100 ns 5
Rise Time for Both SDA and SCL Signals tr 300 ns 5
Fall Time for Both SDA and SCL Signals tf 300 ns 5
Maximum Junction Temperature TJMAX 125 °C 2
Thermal Resistance (DD package) θJA 43 °C/W 2

CAD (KiCad official)

  • Symbol: LTC2481IDD#PBF
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: ltc2481idd-pbf-etched.step / ltc2481idd-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ltc2481idd-pbf.step / ltc2481idd-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (40 pp, sha256 a10a2a6a86cb7e59, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF