main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 5d ago
viewers lt8471efe-trpbf: viewers · Ray 5d ago
lt8471efe-trpbf-etched.glb Publish 0.1.0 · Ray 5d ago
lt8471efe-trpbf-etched.step lt8471efe-trpbf: factory component page (tier=lcsc) · Ray 5d ago
lt8471efe-trpbf-hero.glb lt8471efe-trpbf: hero GLB from the etched model (keeps the MPN mark) · Ray 5d ago
lt8471efe-trpbf-hero.overlay.json Publish 0.1.0 · Ray 5d ago
lt8471efe-trpbf.glb Publish 0.1.0 · Ray 5d ago
lt8471efe-trpbf.kicad_mod Publish 0.1.0 · Ray 5d ago
lt8471efe-trpbf.kicad_sym Publish 0.1.0 · Ray 5d ago
lt8471efe-trpbf.lbr Publish 0.1.0 · Ray 5d ago
lt8471efe-trpbf.step Publish 0.1.0 · Ray 5d ago
package.json Publish 0.1.0 · Ray 5d ago
page.json Set visibility: public · Ray 5d ago
README.md Publish 0.1.0 · Ray 5d ago

LT8471EFE#TRPBF

Analog Devices · DC-DC Converters · HTSSOP-20-EP

LT8471EFE#TRPBF from Analog Devices, in a HTSSOP-20-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C1 output Collector of the primary channel 1 internal NPN power switch; if tied to a DC voltage it must be locally bypassed, and if it is a switching pin its trace area must be minimized to reduce EMI.
2 E1 passive Emitter of the primary channel 1 internal NPN power switch; unless grounded, its trace area must be minimized to reduce EMI.
3 VIN1 power_in Input supply 1 for primary channel 1 and the Skyhook channel, which also powers common circuitry; VIN1 must be greater than 2.6V for any channel to operate and must be locally bypassed.
4 PG1 output Open-drain power-good output for channel 1 that is pulled low when the output is more than 7.5% below target and released when the output is above 92.5% of target, requiring an external pull-up resistor.
5 FB1 input Feedback pin for primary channel 1, where a resistor divider between VOUT, FB and GND sets the output voltage.
6 OV/UV input Overvoltage/undervoltage pin that must be tied to 1.215V (typical) or more to enable the device and grounded to shut down, and can be configured as UVLO and OVLO through an external resistor divider.
7 RT passive Timing resistor pin that sets the free-running switching frequency through a resistor to ground and must not be left floating.
8 SS1 passive Soft-start pin for channel 1 that takes a soft-start capacitor and is charged nominally through 250k to about 2.15V at start-up.
9 SYNC input Synchronization input that accepts an external clock with a high level above 1.3V and a low level below 0.4V, and reverts to the internal free-running clock when driven below 0.4V.
10 GND power_in Ground pin that must be soldered directly to the local ground plane.
11 GND power_in Ground pin that must be soldered directly to the local ground plane.
12 GND power_in Ground pin that must be soldered directly to the local ground plane.
13 C3 output Collector of the Skyhook channel internal NPN power switch; if the Skyhook channel is not used this pin must be tied to GND, and if used its metal trace area must be minimized to reduce EMI.
14 SHOUT output Skyhook output voltage pin that is the cathode of the internal Schottky diode and the output of the Skyhook boost converter.
15 SS2 passive Soft-start pin for channel 2 that takes a soft-start capacitor and is charged nominally through 250k to about 2.15V at start-up.
16 FB2 input Feedback pin for primary channel 2, where a resistor divider between VOUT, FB and GND sets the output voltage.
17 PG2 output Open-drain power-good output for channel 2 that is pulled low when the output is more than 7.5% below target and released when the output is above 92.5% of target, requiring an external pull-up resistor.
18 VIN2 power_in Input supply 2 for primary channel 2 that must be greater than 2.6V when channel 2 is in use and must be locally bypassed.
19 E2 passive Emitter of the primary channel 2 internal NPN power switch; unless grounded, its trace area must be minimized to reduce EMI.
20 C2 output Collector of the primary channel 2 internal NPN power switch that must be tied to the Skyhook channel input voltage when the Skyhook channel is used, and must be bypassed or have its trace minimized as for C1.
21 GND power_in Exposed pad that is ground, must be soldered to the PCB, and provides both electrical contact to ground and thermal contact to the board.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package HTSSOP-20-EP
Category Power Supply Chip
Pins 21

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage (VIN1, VIN2) 2.6 50 V 3
Quiescent Current (VIN1, Skyhook Disabled) 2.2 3.3 mA VOV/UV = 1.3V, Not Switching 3
Quiescent Current (VIN1, Skyhook Enabled) 2.4 4 mA VOV/UV = 1.3V, C3 = 5V, Not Switching 3
Quiescent Current (VIN2) 29 42 µA VOV/UV = 1.3V, Not Switching 3
Quiescent Current in Shutdown (VIN1 + VIN2) 0.01 1 μA VOV/UV = 0V 3
Positive Feedback Voltage (FB1, FB2) 773 789 805 mV 3
Negative Feedback Voltage (FB1, FB2) -806 -788 -770 mV LT8471E,I 3
Feedback Pin Bias Current (FB1, FB2) -100 30 200 nA VFB = Positive Feedback Voltage, Current Out of Pin 3
Feedback Pin Bias Current (FB1, FB2) 0 100 nA VFB = Negative Feedback Voltage 3
Reference Line Regulation 0.008 0.05 %/V 2.6V ≤ VIN1 ≤ 50V 3
Switching Frequency, fOSC fOSC 1.55 1.8 2.05 MHz RT = 46.4k 3
Switching Frequency, fOSC fOSC 100 117 135 kHz RT = 732k 3
Switching Frequency Range Synchronizing 100 2000 kHz 3
SYNC High Level for Sync 1.3 V 3
SYNC Low Level for Sync 0.4 V 3
SYNC Clock Pulse Duty Cycle 35 65 % VSYNC = 0V to 2V 3
Switching Phase Between Primary Channels 170 200 Deg RT = 46.4k 3
Skyhook Boost Voltage VSHOUT, VC2 3 4.25 5.4 V VSHOUT, VC2, Skyhook Enabled 3
Switch Current Limit (Primary Channels) 2.1 2.55 3.2 A Minimum Duty Cycle (Note 3) 4
Switch Current Limit (Primary Channels) 1.35 1.8 2.5 A Maximum Duty Cycle (Notes 3, 4) 4
Switch Current Limit (Skyhook) 400 500 600 mA (Note 3) 4
C1, C2 Leakage Current 0.01 1 µA VC1 = VC2 = 12V, VE1 = VE2 = 0V, VOV/UV = 0V, Current into Pin 4
C3 Leakage Current 0.01 1 µA VC3 = 12V, VOV/UV = 0V 4
E1, E2 Leakage Current 0.01 1 µA VOV/UV = 0V, Current Out of Pin, VC1 = VC2 = 20V, VE1 = VE2 = 5V 4
Schottky Reverse Leakage VREVERSE 0.01 1 µA VREVERSE = 12V 4
Schottky Reverse Leakage VREVERSE 0.02 2 µA VREVERSE = 50V 4
Soft-Start Charge Current 5.5 8.5 11.5 µA VSS1, VSS2 = 50mV, Current Flows Out of SS1, SS2 Pins 4
OV/UV Current for OVLO 76 80 84 µA Current into OV/UV Pin. VOV/UV Internally Clamped to 1.37V, Current Rising 4
OV/UV Pin Bias Current 0.01 0.5 µA VOV/UV =1V 4
OV/UV Minimum Input Voltage High 1.165 1.215 1.265 V Active Mode, OV/UV Rising 4
OV/UV Minimum Input Voltage Low 1.13 1.18 1.22 V Active Mode, OV/UV Falling 4
OV/UV Input Voltage Low 0.3 V Shutdown Mode 4
FB Pin Threshold for Power Good (Positive Output Voltage) 715 740 765 mV FB Rising 4
FB Pin Threshold for Power Good (Positive Output Voltage) 708 730 752 mV FB Falling 4
FB Pin Threshold for Power Good (Negative Output Voltage) -766 -736 -706 mV FB Falling 4
FB Pin Threshold for Power Good (Negative Output Voltage) -755 -727 -699 mV FB Rising 4
PG1, PG2 Voltage Output Low 0.32 0.6 V VFB = 0.6V, IPG = 250μA 4
PG1, PG2 Leakage 0.01 1 µA VPG1, VPG2 = 12V, PG Driver Off 4
VIN1, VIN2 Voltages -0.3 50 V 2
C1, C2 Voltages -0.4 50 V 2
E1, E2 Voltages -60 50 V 2
VC1 to VE1 and VC2 to VE2 Voltages -0.4 60 V 2
VIN1 to VE1 and VIN2 to VE2 Voltages -0.4 40 V Low Side Configurations (Note 6) 2
VIN1 to VE1 and VIN2 to VE2 Voltages -0.4 60 V High Side Configurations (Note 6) 2
VIN1 to VC1 and VIN2 to VC2 Voltages -0.4 40 V High Side Configurations (Note 6) 2
C3 Voltage -0.4 50 V 2
RT Voltage -0.3 5 V 2
SYNC Voltage -0.3 5.5 V 2
SS1, SS2 -0.3 2.5 V 2
FB1, FB2 Voltages -2.5 2.5 V 2
PG1, PG2 Voltages -0.3 50 V 2
OV/UV Voltage -0.3 5 V 2
SHOUT Voltage -0.3 50 V 2
Operating Junction Temperature Range TJ -40 125 °C LT8471E (Notes 2, 5) 2
Storage Temperature Range -65 150 °C 2
Thermal Resistance, Junction to Ambient θJA 38 °C/W FE package, 20-lead TSSOP 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper switching pins small. Board layout also has a significant effect on thermal re￾sistance. The exposed package ground pad is the copper 25

CAD (KiCad official)

  • Symbol: LT8471EFE#TRPBF
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: lt8471efe-trpbf-etched.step / lt8471efe-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt8471efe-trpbf.step / lt8471efe-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (36 pp, sha256 245eb55e0302d439, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF