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LT6658AIDE-1.2#PBF

Analog Devices · Voltage References · DFN-16-EP(3x4)

LT6658AIDE-1.2#PBF from Analog Devices, in a DFN-16-EP(3x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Main ground connection that should be connected into a star ground or ground plane.
2 GND power_in Main ground connection that should be connected into a star ground or ground plane.
3 BYPASS passive Bypass pin that requires a 1µF capacitor for bandgap stability.
4 DNC unconnected Do not connect; connected internally, so keep leakage current from this pin to a minimum and do not connect external circuitry to it.
5 NR passive Noise reduction pin; a capacitor connected between this pin and ground band-limits the reference noise.
6 GND power_in Main ground connection that should be connected into a star ground or ground plane.
7 VOUT2_S input VOUT2 Kelvin sense pin that should be connected directly to the load.
8 VOUT2_F power_out VOUT2 output that requires a 1µF to 50µF output capacitor for stable operation and can source up to 50mA.
9 OD input Active-low output disable input that disables both outputs; absolute maximum is -0.3V to 38V to GND.
10 VIN2 power_in Input voltage supply for buffer amplifier 2 that should be bypassed with a 0.1µF capacitor to ground; VIN, VIN1, VIN2 absolute maximum is 38V to GND.
11 VIN1 power_in Input voltage supply for buffer amplifier 1 that should be bypassed with a 0.1µF capacitor to ground; VIN, VIN1, VIN2 absolute maximum is 38V to GND.
12 VOUT1_F power_out VOUT1 output that requires a 1µF to 50µF output capacitor for stable operation and can source up to 150mA.
13 VOUT1_S input VOUT1 Kelvin sense pin that should be connected directly to the load.
14 VIN power_in Main input voltage supply that should be bypassed with a 0.1µF capacitor to ground; absolute maximum is 38V to GND.
15 NC unconnected No connect pin.
16 DNC unconnected Do not connect; connected internally, so keep leakage current from this pin to a minimum and do not connect external circuitry to it.
17 GND power_in Exposed pad that is ground and must be soldered to the PCB for good electrical contact and rated thermal performance.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package DFN-16-EP(3x4)
Category Power Management ICs
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage Accuracy (LT6658AI, I-grade, A) -0.175 0.175 % LT6658AI 6
OD Logic High Input Voltage 2 V OD threshold, logic high input voltage 6
OD Logic Low Input Voltage 0.8 V OD threshold, logic low input voltage 6
Output Voltage Temperature Coefficient (A) 3 10 ppm/°C LT6658A 6
Line Regulation (LT6658-1.2, A) 2 5 ppm/V 4.5V ≤ VIN ≤ 36V, VIN = VIN1 = VIN2 6
Load Regulation Output 1 Sourcing 0.25 1.25 µV/mA Output 1 Sourcing, ΔILOAD = 0mA to 150mA 6
Load Regulation Output 2 Sourcing 0.25 3.25 µV/mA Output 2 Sourcing, ΔILOAD = 0mA to 50mA (Note 6) 6
Load Regulation Output 1 Sinking 0.25 3.2 µV/mA Output 1 Sinking, ΔILOAD = 0mA to 20mA 6
Load Regulation Output 2 Sinking 0.25 3.2 µV/mA Output 2 Sinking, ΔILOAD = 0mA to 20mA 6
VIN Minimum Voltage (LT6658-1.2) 3.5 4 V ΔVOUT = 0.1%, IOUT = 0mA, VIN1 = VIN2 = 4.5V 6
VIN1 Dropout Voltage at 0mA 2 2.3 V ΔVOUT1 = 0.1%, IOUT1 = 0mA, VIN = VIN2 = VOUT + 4.5V 6
VIN1 Dropout Voltage at 150mA 2.3 2.5 V ΔVOUT1 = 0.1%, IOUT1 = 150mA, VIN = VIN2 = VOUT + 4.5V 6
VIN2 Dropout Voltage at 0mA 1.8 2 V ΔVOUT2 = 0.1%, IOUT2 = 0mA, VIN = VIN1 = VOUT + 4.5V 6
VIN2 Dropout Voltage at 50mA 2.2 2.5 V ΔVOUT2 = 0.1%, IOUT2 = 50mA, VIN = VIN1 = VOUT + 4.5V 6
Supply Current (VOD = 2.0V, No Load) 2 3.2 mA LT6658-1.2, VOD = 2.0V, No Load 6
Supply Current (VOD = 0.8V, No Load) 0.7 1.1 mA LT6658-1.2, VOD = 0.8V, No Load 6
Output Short-Circuit Current Output 1 170 270 mA Short VOUT1_F to 400mV (Note 11) 7
Output Short-Circuit Current Output 2 65 120 mA Short VOUT2_F to 400mV (Note 11) 7
Output Noise Voltage (LT6658-1.2) 0.8 ppmP-P 0.1Hz ≤ f ≤ 10Hz 7
Output Noise Voltage 10Hz-1kHz, CNR = 10µF 0.5 ppmRMS 10Hz ≤ f ≤ 1kHz, COUT = 1µF, CNR = 10µF, ILOAD = Full Current (Note 10) 7
Output Noise Voltage 10Hz-1kHz, CNR open 2 ppmRMS 10Hz ≤ f ≤ 1kHz, COUT = 1µF, CNR = OPEN, ILOAD = Full Current (Note 10) 7
Output Noise Density at 10kHz 8 nV/√Hz Frequency = 10kHz, COUT1 = 1µF, CNR = 10µF, ILOAD = Full Current (Note 10) 7
Output Voltage Tracking 0.9 µV/°C Tracking = Output 1, Output 2 7
VOUT1_S Pin Current 135 nA Unity Gain 7
OD Pin Current VOD = 0V 30 45 µA VOD = 0V 7
OD Pin Current VOD = 36V 0.3 1.5 µA VOD = 36V 7
Ripple Rejection Output 1 107 dB VIN1 = VOUT1 + 3V, VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 150mA, COUT1 = 1µF, CNR = 10µF 7
Ripple Rejection Output 2 107 dB VIN2 = VOUT2 + 3V, VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 50mA, COUT2 = 1µF, CNR = 10µF 7
Turn-On Time 160 µs 0.1% Settling, CLOAD = 1µF 7
Long Term Drift 120 ppm/√kHr Note 8 7
Thermal Hysteresis (-40°C to 85°C) 30 ppm ΔT = -40°C to 85°C 7
Thermal Hysteresis (-40°C to 125°C) 45 ppm ΔT = -40°C to 125°C 7
Supply Voltage VIN, VIN1, VIN2 to GND VIN -0.3 38 V Absolute maximum rating 2
OD Input Voltage to GND OD -0.3 38 V OD to GND 2
Input Voltages VOUT1_S, VOUT2_S, NR, BYPASS to GND -0.3 6 V to GND 2
Output Voltages VOUT1_F, VOUT2_F to GND -0.3 6 V to GND 2
BYPASS Input Current -10 10 mA BYPASS, ±10mA 2
Operating Junction Temperature Range TJ -55 150 °C Operating junction temperature range 2
Storage Temperature Range -65 150 °C Note 2 2
Specified Temperature Range I-Grade TA -40 85 °C I-Grade 2
Supply Voltage VIN VIN 36 V VIN ≥ VOUT + 2.5V; VIN = VIN1 = VIN2 23
Output Capacitor COUT1, COUT2 COUT 1 50 µF Stable operation required for each output 21
Output 1 Source Current 150 mA Output 1 sourcing 1
Output 1 Sink Current 20 mA Output 1 sinking 1
Output 2 Source Current 50 mA Output 2 sourcing 1
Output 2 Sink Current 20 mA Output 2 sinking 1
Output Capacitor ESR ESR 0.15 Ω Keep ESR at or below 0.15Ω 24
Thermal Resistance Junction to Case (DE DFN) θJC 5 °C/W DE package (4mm × 3mm DFN) 2
Thermal Resistance Junction to Ambient (DE DFN) θJA 43 °C/W DE package (4mm × 3mm DFN) 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper the Kelvin sense pins should be connected close to the load to avoid any voltage drop in the copper trace on the 27

CAD (KiCad official)

  • Symbol: LT6658AIDE-1.2#PBF
  • Footprint: Package_DFN_QFN:DFN-16-1EP_3x4mm_P0.45mm_EP1.7x3.3mm
  • 3D model: DFN-16-EP(3x4) (KiCad packages3D, STEP)
  • 3D model files: lt6658aide-1-2-pbf-etched.step / lt6658aide-1-2-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt6658aide-1-2-pbf.step / lt6658aide-1-2-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (44 pp, sha256 b4b44b0ff2978879, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF