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LT6654BHS6-3.3#WTRMPBF

Analog Devices · Voltage References · TSOT-23-6

LT6654BHS6-3.3#WTRMPBF from Analog Devices, in a TSOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Internal function pin that must be tied to ground near Pin 2.
2 GND power_in Primary device ground.
3 DNC unconnected Do not connect; keep leakage current from this pin to VIN or GND to a minimum.
4 VIN power_in Power supply input operating up to 36V; bypass VIN with a 0.1µF capacitor to ground.
5 DNC unconnected Do not connect; keep leakage current from this pin to VIN or GND to a minimum.
6 VOUT power_out Output voltage; an output capacitor of 1µF minimum is required for stable operation.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package TSOT-23-6
Category Power Supply Chip
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage Accuracy (LT6654BH, H-grade, -40°C to 125°C) VOUT -0.43 0.43 % 6
Output Voltage Temperature Coefficient (LT6654B) TC 10 20 ppm/°C 6
Line Regulation (LT6654B, 3.3V) 1.2 10 ppm/V VOUT + 0.5V ≤ VIN ≤ 36V 6
Load Regulation, sourcing (LT6654B, 3.3V) 3 15 ppm/mA IOUT(SOURCE) = 10mA 6
Load Regulation, sinking (LT6654B, 3.3V) 9 30 ppm/mA IOUT(SINK) = 10mA 6
Dropout Voltage (VIN, VOUT) 55 100 mV ΔVOUT = 0.1%, IOUT = 0mA 6
Supply Current 350 600 µA No Load 6
Input Voltage VIN to GND (absolute maximum) VIN -0.3 38 V 2
Output Voltage VOUT (absolute maximum) VOUT -0.3 V Maximum is VIN + 0.3V 2
Specified Temperature Range, H-Grade TA -40 125 °C H-Grade 2
Operating Temperature Range TA -55 125 °C 2
Storage Temperature Range TSTG -65 150 °C 2
Maximum Junction Temperature TJMAX 150 °C 2
Thermal Resistance, junction to ambient (S6 TSOT-23) θJA 192 °C/W S6 6-lead TSOT-23 package 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing abs Plastic mould compounds absorb water. With changes in 18

CAD (KiCad official)

  • Symbol: LT6654BHS6-3.3#WTRMPBF
  • Footprint: Package_TO_SOT_SMD:TSOT-23-6
  • 3D model: TSOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: lt6654bhs6-3-3-wtrmpbf-etched.step / lt6654bhs6-3-3-wtrmpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt6654bhs6-3-3-wtrmpbf.step / lt6654bhs6-3-3-wtrmpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (24 pp, sha256 7793895f1475d122, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF