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LT3757IMSE#TRPBF

Analog Devices · DC-DC Converters · MSOP-10-EP

LT3757IMSE#TRPBF from Analog Devices, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VC passive Error amplifier compensation pin, used to stabilize the voltage loop with an external RC network.
2 FBX input Positive and negative feedback pin that receives the feedback voltage from the external resistor divider across the output, and also modulates the frequency during start-up and fault conditions when FBX is close to GND.
3 SS passive Soft-start pin that modulates the VC clamp, with the soft-start interval set by an external capacitor, a 10µA typical pull-up to an internal 2.5V rail, and a reset to GND on SHDN/UVLO undervoltage, INTVCC undervoltage or overvoltage, or thermal lockout.
4 RT passive Switching frequency adjustment pin, set by a resistor to GND (RT voltage 1.2V typical); do not leave this pin open.
5 SYNC input Frequency synchronization pin for an external clock, where RT must be chosen to program a switching frequency 20% slower than the SYNC pulse frequency, SYNC input must be tied to GND if unused, and SYNC is ignored when FBX is close to GND.
6 SENSE input Current sense input for the control loop, which must be Kelvin connected to the positive terminal of the N-channel MOSFET source sense resistor, with the negative terminal returned to the GND plane close to the IC.
7 GATE output N-channel MOSFET gate driver output that switches between INTVCC and GND and is driven to GND when the IC is shut down, in thermal lockout, or when INTVCC is above or below the OV or UV thresholds.
8 INTVCC power_out Regulated supply for internal loads and the gate driver, regulated to 7.2V typical, which must be bypassed with at least 4.7µF placed close to the pin and may be connected directly to VIN only if VIN is less than 17.5V.
9 SHDN/UVLO input Shutdown and undervoltage detect pin with an accurate 1.22V nominal falling threshold, which must be tied to 0.4V or less to disable the device and reduce VIN quiescent current below 1µA.
10 VIN power_in Input supply pin with an operating range of 2.9V to 40V, which must be locally bypassed with a 0.22µF or larger capacitor placed close to the pin.
11 GND power_in Exposed pad is the ground connection and also serves as the negative terminal of the current sense resistor, and it must be soldered directly to the local ground plane.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-10-EP
Category Power Management (PMIC)
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN Operating Range VIN 2.9 40 V 3
VIN Shutdown IQ IQ 0.1 1 µA SHDN/UVLO = 0V 3
VIN Shutdown IQ IQ 6 µA SHDN/UVLO = 1.15V 3
VIN Operating IQ IQ 1.6 2.2 mA VC = 0.3V, RT = 41.2k 3
VIN Operating IQ with Internal LDO Disabled IQ 280 400 µA VC = 0.3V, RT = 41.2k, INTVCC = 7.5V 3
SENSE Current Limit Threshold 100 110 120 mV 3
FBX Regulation Voltage (positive) VFBX(REG) 1.569 1.6 1.631 V VFBX > 0V (Note 3) 3
FBX Regulation Voltage (negative) VFBX(REG) -0.816 -0.8 -0.784 V VFBX < 0V (Note 3) 3
FBX Overvoltage Lockout (positive) 6 8 10 % VFBX > 0V (Note 4) 3
FBX Overvoltage Lockout (negative) 7 11 14 % VFBX < 0V (Note 4) 3
VFBX Line Regulation (positive) 0.002 0.056 %/V VFBX > 0V, 2.9V < VIN < 40V (Notes 3, 7) 3
VFBX Line Regulation (negative) 0.0025 0.05 %/V VFBX < 0V, 2.9V < VIN < 40V (Notes 3, 7) 3
INTVCC Regulation Voltage INTVCC 7 7.2 7.4 V 3
INTVCC Undervoltage Lockout Threshold (falling) 2.6 2.7 2.8 V Falling INTVCC 3
INTVCC Overvoltage Lockout Threshold 16 17.5 V 3
INTVCC Current Limit 30 40 mA VIN = 40V 3
INTVCC Current Limit 55 95 mA VIN = 15V 3
INTVCC Load Regulation ∆VINTVCC/VINTVCC -0.9 -0.5 % 0 < IINTVCC < 20mA, VIN = 8V 3
INTVCC Line Regulation ∆VINTVCC/(VINTVCC • ∆VIN) 0.008 0.03 %/V 8V < VIN < 40V 3
SHDN/UVLO Threshold Voltage (falling) 1.17 1.22 1.27 V VIN = INTVCC = 8V 4
SHDN/UVLO Pin Bias Current Low 1.7 2 2.5 µA SHDN/UVLO = 1.15V 4
SHDN/UVLO Pin Bias Current High 10 100 nA SHDN/UVLO = 1.30V 4
Switching Frequency 270 300 330 kHz RT = 41.2k to GND, VFBX = 1.6V 3
Absolute Maximum VIN VIN 40 V Note 6 2
Absolute Maximum SHDN/UVLO SHDN/UVLO 40 V Note 6 2
Absolute Maximum INTVCC INTVCC 20 V Printed as VIN + 0.3V, 20V 2
Absolute Maximum SYNC SYNC 8 V 2
Absolute Maximum VC VC 3 V 2
Absolute Maximum SS SS 3 V 2
Absolute Maximum RT RT 1.5 V 2
Absolute Maximum SENSE SENSE -0.3 0.3 V 2
Absolute Maximum FBX FBX -6 6 V 2
Storage Temperature Range (MSOP) -65 150 °C MSOP package 2
Lead Temperature (Soldering, 10 sec) MSOP 300 °C Soldering, 10 sec 2
Operating Temperature Range (LT3757I) -40 125 °C LT3757I/LT3757AI operating junction temperature range (Note 2) 2
Maximum Junction Temperature (MSE package) TJMAX 150 °C MSE package, per Pin Configuration 2
Junction-to-Ambient Thermal Resistance (MSE package) θJA 40 °C/W MSE package, exposed pad soldered to full copper plane 2
INTVCC Voltage to Bypass Internal LDO 7.5 V 4
INTVCC Dropout Voltage (VIN, VINTVCC) 400 mV VIN = 6V, IINTVCC = 20mA 3
INTVCC UVLO Hysteresis 0.1 V 3
INTVCC Current in Shutdown 16 µA SHDN/UVLO = 0V, INTVCC = 8V 3
SHDN/UVLO Input Low Voltage 0.4 V I(VIN) drops below 1µA 4
Gate Driver Output Rise Time tr 22 ns CL = 3300pF (Note 5), INTVCC = 7.5V 4
Gate Driver Output Fall Time tf 20 ns CL = 3300pF (Note 5), INTVCC = 7.5V 4
Gate VOL 0.05 V 4
Switching Frequency 100 kHz RT = 140k to GND, VFBX = 1.6V 3
Switching Frequency 1000 kHz RT = 10.5k to GND, VFBX = 1.6V 3
RT Voltage RT 1.2 V VFBX = 1.6V 3
Minimum Off-Time 220 ns 3
Minimum On-Time 220 ns 3
SYNC Input Low SYNC 0.4 V 3
SYNC Input High SYNC 1.5 V 3
SS Pull-Up Current SS -10 µA SS = 0V, current out of pin 3
Transconductance gm gm 230 µS (Note 3) 3
VC Output Impedance 5 MΩ (Note 3) 3
SENSE Input Bias Current -65 µA Current out of pin 3
VC Current Mode Gain ∆VVC/∆VSENSE 5.5 V/V 3
VC Source Current -15 µA VFBX = 0V, VC = 1.5V 3
VC Sink Current 12 µA VFBX = 1.7V 3
VC Sink Current 11 µA VFBX = -0.85V 3

CAD (KiCad official)

  • Symbol: LT3757IMSE#TRPBF
  • Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
  • 3D model: MSOP-10-EP (KiCad packages3D, STEP)
  • 3D model files: lt3757imse-trpbf-etched.step / lt3757imse-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3757imse-trpbf.step / lt3757imse-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (36 pp, sha256 1f145722dfa27e74, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF