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LT3085EMS8E#PBF

Analog Devices · Linear Voltage Regulators (LDO) · MSOP-8-EP

LT3085EMS8E#PBF from Analog Devices, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Power output of the device; a minimum load current of 1mA is required or the output may not regulate, and a minimum 2.2µF output capacitor is required for stability.
2 OUT power_out Power output of the device, to be connected in parallel with pins 1 and 3; the same 1mA minimum load and 2.2µF minimum output capacitor apply.
3 OUT power_out Power output of the device, to be connected in parallel with pins 1 and 2; the same 1mA minimum load and 2.2µF minimum output capacitor apply.
4 SET input Non-inverting input to the error amplifier and regulation set point, where a fixed 10µA flows out through a single external resistor to program the output voltage from zero up to the absolute maximum rated output voltage; a small capacitor to ground can improve transient response and reduce output noise.
5 VCONTROL power_in Supply pin for the control circuitry, which must be at least 1.2V to 1.35V above VOUT for regulation; it requires a 1µF to 10µF bypass capacitor if more than six inches from the main input filter capacitor.
6 NC unconnected No connection to internal circuitry; it may be tied to VIN, VCONTROL, VOUT, GND, or left floating.
7 IN power_in Collector of the power device through which the output load current is supplied; it must be at least 0.1V to 0.5V above VOUT for regulation and needs a 1µF to 10µF bypass capacitor if more than six inches from the main input filter capacitor.
8 IN power_in Collector of the power device, connected in parallel with pin 7 to supply the output load current; the same 0.1V to 0.5V headroom over VOUT applies.
9 OUT power_out Exposed pad connected internally to OUT; it must be tied directly to pins 1, 2 and 3 at the PCB and soldered to VOUT for thermal performance.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package MSOP-8-EP
Category Power Management ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCONTROL Pin Voltage -0.3 40 V All voltages relative to VOUT (Note 1) 2
IN Pin Voltage -0.3 40 V All voltages relative to VOUT (Note 1) 2
SET Pin Current -15 15 mA Note 7 2
SET Pin Voltage (Relative to OUT) -10 10 V Relative to OUT 2
Operating Junction Temperature Range TJ -40 125 °C E grade 2
Storage Temperature Range -65 150 °C 2
Lead Temperature (Soldering, 10 sec) 300 °C MS8E package only, 10 sec soldering 2
SET Pin Current ISET 9.9 10 10.1 µA VIN = 1V, VCONTROL = 2V, ILOAD = 1mA, TJ = 25°C 3
SET Pin Current ISET 9.8 10 10.2 µA VIN ≥ 1V, VCONTROL ≥ 2V, 1mA ≤ ILOAD ≤ 500mA (Note 9) 3
Output Offset Voltage (VOUT, VSET) VOS -1.5 1.5 mV VIN = 1V, VCONTROL = 2V, ILOAD = 1mA, TJ = 25°C 3
Output Offset Voltage (VOUT, VSET) VOS -3 3 mV VIN ≥ 1V, VCONTROL ≥ 2V, 1mA ≤ ILOAD ≤ 500mA (Note 9) 3
Load Regulation (ΔVOS) ΔVOS -0.6 -1 mV ΔILOAD = 1mA to 500mA (Note 8) 3
Line Regulation (ΔISET) ΔISET 0.1 0.5 nA/V ΔVIN = 1V to 36V, ΔVCONTROL = 2V to 36V, ILOAD = 1mA 3
Minimum Load Current 300 500 µA VIN = VCONTROL = 10V (Notes 3, 9) 3
Minimum Load Current 1 mA VIN = VCONTROL = 36V (Notes 3, 9) 3
VCONTROL Dropout Voltage 1.35 1.6 V ILOAD = 500mA (Note 4) 3
VIN Dropout Voltage 85 150 mV ILOAD = 100mA (Note 4) 3
VIN Dropout Voltage 275 450 mV ILOAD = 500mA (Note 4) 3
VCONTROL Pin Current 3 6 mA ILOAD = 100mA (Note 5) 3
VCONTROL Pin Current 8 15 mA ILOAD = 500mA (Note 5) 3
Current Limit 500 650 mA VIN = 5V, VCONTROL = 5V, VSET = 0V, VOUT = -0.1V (Note 9) 3
Maximum Junction Temperature (TJMAX) TJMAX 125 °C MS8E package 2
Junction-to-Ambient Thermal Resistance (θJA) θJA 60 °C/W MS8E package 2
Junction-to-Case Thermal Resistance (θJC) θJC 10 °C/W MS8E package 2
Junction-to-Ambient Thermal Resistance (MSOP) 55 °C/W Topside copper 2500mm2, backside copper 2500mm2, board area 2500mm2 15
Junction-to-Ambient Thermal Resistance (MSOP) 57 °C/W Topside copper 1000mm2, backside copper 2500mm2, board area 2500mm2 15
Junction-to-Ambient Thermal Resistance (MSOP) 60 °C/W Topside copper 225mm2, backside copper 2500mm2, board area 2500mm2 15
Junction-to-Ambient Thermal Resistance (MSOP) 65 °C/W Topside copper 100mm2, backside copper 2500mm2, board area 2500mm2 15

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts COPPER Table 3. MSE Package, 8-Lead MSOP COPPER AREA THERMAL RESISTANCE 15

CAD (KiCad official)

  • Symbol: LT3085EMS8E#PBF
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: lt3085ems8e-pbf-etched.step / lt3085ems8e-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3085ems8e-pbf.step / lt3085ems8e-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (28 pp, sha256 c5243716ea4c9cc7, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF