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LT3082ETS8#TRMPBF

Analog Devices · Linear Voltage Regulators (LDO) · TSOT-23-8

LT3082ETS8#TRMPBF from Analog Devices, in a TSOT-23-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection to internal circuitry; the pin may be tied to IN, OUT, GND or left floating.
2 OUT power_out Regulated power output; the LT3082 requires a 0.5mA minimum load current or the output will not regulate.
3 OUT power_out Regulated power output; the LT3082 requires a 0.5mA minimum load current or the output will not regulate.
4 OUT power_out Regulated power output; the LT3082 requires a 0.5mA minimum load current or the output will not regulate.
5 SET passive Error amplifier noninverting input with a fixed 10μA current source flowing out of the pin; a single resistor to GND programs VOUT over 0V to 38.5V.
6 NC unconnected No connection to internal circuitry; the pin may be tied to IN, OUT, GND or left floating.
7 IN power_in Supplies power to internal circuitry and output load current; it must be 1.2V to 1.4V above OUT depending on load current, and the absolute maximum is ±40V relative to SET and OUT.
8 IN power_in Supplies power to internal circuitry and output load current; it must be 1.2V to 1.4V above OUT depending on load current, and the absolute maximum is ±40V relative to SET and OUT.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package TSOT-23-8
Category Power Supply Chip
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
SET Pin Current ISET 9.9 10 10.1 μA VIN = 2V, ILOAD = 1mA 3
SET Pin Current ISET 9.8 10 10.2 μA Over full operating temperature range; 2V ≤ VIN ≤ 40V, 1mA ≤ ILOAD ≤ 200mA 3
Offset Voltage (VOUT, VSET) VOS -2 2 mV VIN = 2V, ILOAD = 1mA 3
Offset Voltage (VOUT, VSET) VOS -4 4 mV Over full operating temperature range; VIN = 2V, ILOAD = 1mA 3
Load Regulation ΔVOS -0.5 -2 mV Over full operating temperature range; ΔILOAD = 1mA to 200mA 3
Line Regulation ΔISET 0.03 0.2 nA/V ΔVIN = 2V to 40V, ILOAD = 1mA 3
Line Regulation ΔVOS 0.003 0.01 mV/V ΔVIN = 2V to 40V, ILOAD = 1mA 3
Minimum Load Current 300 500 μA Over full operating temperature range; 2V ≤ VIN ≤ 40V 3
Dropout Voltage VIN, VOUT 1.22 1.45 V ILOAD = 10mA, over full operating temperature range 3
Dropout Voltage VIN, VOUT 1.3 1.65 V ILOAD = 200mA, over full operating temperature range 3
Current Limit 200 300 mA Over full operating temperature range; VIN = 5V, VSET = 0V, VOUT = -0.1V 3
IN Pin Voltage Relative to SET, OUT -40 40 V Relative to SET, OUT 2
SET Pin Current -15 15 mA Note 6 2
SET Pin Voltage (Relative to OUT) -10 10 V Relative to OUT, Note 6 2
Storage Temperature Range -65 150 °C 2
Lead Temperature (Soldering, 10 sec) 300 °C ST, TS8 packages only; soldering 10 sec 2
Operating Junction Temperature Range (E grade) TJ -40 125 °C E grade; Notes 2, 8 2
Input Voltage Range VIN 1.2 40 V Wide input voltage range, per Features 1
Output Voltage Range VOUT 0 38.5 V Set by single resistor RSET; per Pin Functions 7
Output Capacitor COUT 2.2 μF Minimum for stability, ceramic or low ESR 9
Output Capacitor ESR ESR 0.5 Ω Minimum output capacitor of 2.2μF with ESR of 0.5Ω or less recommended 9
SET Pin Bypass Capacitor across RSET CSET 1 μF Capacitors up to 1μF can be used across voltage setting resistor 9
Maximum Junction Temperature TJMAX 125 °C TS8 package header 2
Thermal Resistance, Junction-to-Ambient (TS8) θJA 57 °C/W TS8 8-lead SOT-23 package header; device on 4-layer board per Table 4 layout 2
Thermal Resistance, Junction-to-Case (TS8) θJC 15 °C/W TS8 8-lead SOT-23 package header 2
Thermal Resistance, Junction-to-Ambient (TS8) θJA 54 °C/W Table 4: 2500mm² topside copper, 2500mm² backside, 2500mm² board area 13
Thermal Resistance, Junction-to-Ambient (TS8) θJA 57 °C/W Table 4: 225mm² topside copper, 2500mm² backside, 2500mm² board area 13
Thermal Resistance, Junction-to-Ambient (TS8) θJA 63 °C/W Table 4: 100mm² topside copper, 2500mm² backside, 2500mm² board area 13

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper pins (Pins 1, 2/Pin 2) at the PCB. The amount of copper area 7

CAD (KiCad official)

  • Symbol: LT3082ETS8#TRMPBF
  • Footprint: Package_TO_SOT_SMD:TSOT-23-8
  • 3D model: TSOT-23-8 (KiCad packages3D, STEP)
  • 3D model files: lt3082ets8-trmpbf-etched.step / lt3082ets8-trmpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3082ets8-trmpbf.step / lt3082ets8-trmpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (20 pp, sha256 dd62a34c279123c4, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF