LT3022EMSE#TRPBF from Analog Devices, in a MSOP-16-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	NC	unconnected	No connection to internal circuitry; the pin may be floated, tied to VIN or tied to GND for improved thermal performance.
2	NC	unconnected	No connection to internal circuitry; the pin may be floated, tied to VIN or tied to GND for improved thermal performance.
3	OUT	power_out	Supplies power to the load and requires a minimum 10µF output capacitor to prevent oscillations, with a 1mA minimum load current needed for regulation and stability.
4	OUT	power_out	Supplies power to the load and requires a minimum 10µF output capacitor to prevent oscillations, with a 1mA minimum load current needed for regulation and stability.
5	ADJ	input	Error amplifier inverting terminal with a 200mV reference referred to AGND and a 30nA typical input bias current flowing out of the pin.
6	AGND	power_in	Analog ground that must be tied directly to PGND (pins 10, 11) and the exposed pad GND (pin 17), with the output-setting divider returned directly to it.
7	AGND	power_in	Analog ground that must be tied directly to PGND (pins 10, 11) and the exposed pad GND (pin 17), with the output-setting divider returned directly to it.
8	NC	unconnected	No connection to internal circuitry; the pin may be floated, tied to VIN or tied to GND for improved thermal performance.
9	SHDN	input	Pulling low puts the part into a low power state and turns the output off, and the part does not function if SHDN is left unconnected, so connect it to VIN when unused.
10	PGND	power_in	Power ground carrying the majority of the ground pin current, to be tied directly to AGND (pins 6, 7) and the exposed pad GND (pin 17).
11	PGND	power_in	Power ground carrying the majority of the ground pin current, to be tied directly to AGND (pins 6, 7) and the exposed pad GND (pin 17).
12	IN	power_in	Supplies power to the device, with a minimum 10µF bypass capacitor suggested in battery-powered circuits and the pin withstanding reverse voltages with respect to ground and OUT.
13	IN	power_in	Supplies power to the device, with a minimum 10µF bypass capacitor suggested in battery-powered circuits and the pin withstanding reverse voltages with respect to ground and OUT.
14	IN	power_in	Supplies power to the device, with a minimum 10µF bypass capacitor suggested in battery-powered circuits and the pin withstanding reverse voltages with respect to ground and OUT.
15	NC	unconnected	No connection to internal circuitry; the pin may be floated, tied to VIN or tied to GND for improved thermal performance.
16	NC	unconnected	No connection to internal circuitry; the pin may be floated, tied to VIN or tied to GND for improved thermal performance.
17	GND	power_in	Exposed pad that must be tied to AGND (pins 6, 7), PGND (pins 10, 11) and the PCB ground and soldered to the PCB for thermal performance.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	MSOP-16-EP
Category	Interface ICs
Pins	17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Minimum Input Voltage		0.9		1.05	V	ILOAD = 1A, TA > 0°C	4
Minimum Input Voltage		0.9		1.1	V	ILOAD = 1A, TA ≤ 0°C	4
ADJ Pin Voltage	VADJ	196	200	204	mV	VIN = 1.5V, ILOAD = 1mA	4
ADJ Pin Voltage	VADJ	194	200	206	mV	1.15V < VIN < 10V, 1mA < ILOAD < 1A (full operating temperature range)	4
Line Regulation		-1.5	-0.1	0.5	mV	∆VIN = 1.15V to 10V, ILOAD = 1mA	4
Load Regulation		-0.5	0.1	0.5	mV	VIN = 1.15V, ∆ILOAD = 1mA to 1A	4
Load Regulation		-1		1	mV	VIN = 1.15V, ∆ILOAD = 1mA to 1A (full operating temperature range)	4
Dropout Voltage			45	75	mV	ILOAD = 10mA	4
Dropout Voltage			55	90	mV	ILOAD = 100mA	4
Dropout Voltage			110	150	mV	ILOAD = 500mA	4
Dropout Voltage			145	185	mV	ILOAD = 1A	4
GND Pin Current	IGND		400		µA	VIN = VOUT(NOMINAL) + 0.4V, ILOAD = 0mA	4
GND Pin Current	IGND		1.2	3.5	mA	VIN = VOUT(NOMINAL) + 0.4V, ILOAD = 1mA	4
GND Pin Current	IGND		3.4	8.5	mA	VIN = VOUT(NOMINAL) + 0.4V, ILOAD = 100mA	4
GND Pin Current	IGND		8.3	20	mA	VIN = VOUT(NOMINAL) + 0.4V, ILOAD = 500mA	4
GND Pin Current	IGND		18	36	mA	VIN = VOUT(NOMINAL) + 0.4V, ILOAD = 1A	4
ADJ Pin Bias Current	IADJ		30	100	nA	VADJ = 0.2V, VIN = 1.5V	4
SHDN Pin Current	ISHDN		3	9.5	µA	VSHDN = 0V, VIN = 10V	4
SHDN Pin Current	ISHDN	-1		1	µA	VSHDN = 10V, VIN = 10V	4
Quiescent Current in Shutdown	IQ		7.5	15	µA	VIN = 6V, VSHDN = 0V	4
Ripple Rejection		55	70		dB	VIN, VOUT = 1V, VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 1A	5
Current Limit			2.6		A	VIN = 10V, VOUT = 0V	5
Current Limit		1.1	1.7		A	VIN = VOUT(NOMINAL) + 0.5V, ∆VOUT ≤ -5% (full operating temperature range)	5
Input Reverse Leakage Current			4	40	µA	VIN = -10V, VOUT = 0V	5
Reverse Output Current			0.1	5	µA	VOUT = 1.2V, VIN = 0V (LT3022)	5
Input Pin Voltage	VIN	-10		10	V	IN pin voltage	2
OUT Pin Voltage	VOUT	-10		10	V	OUT pin voltage	2
Input-to-Output Differential Voltage		-10		10	V	Input-to-output differential voltage	2
ADJ/SENSE Pin Voltage		-10		10	V	ADJ/SENSE pin voltage	2
SHDN Pin Voltage		-10		10	V	SHDN pin voltage	2
Operating Junction Temperature Range	TJ	-40		125	°C	E-, I-Grades	2
Storage Temperature Range	TSTG	-65		150	°C	Storage temperature range	2
Lead Temperature (Soldering, 10 sec)				300	°C	MSOP package, 10 sec soldering	2
Input Voltage Range	VIN	0.9		10	V	VIN range	1
Output Voltage Range (Adjustable)	VOUT	0.2		9.5	V	Adjustable output range	12
Operating Junction Temperature Range	TJ	-40		125	°C	E-grade, junction temperature	2
Thermal Resistance Junction-to-Ambient (MSE package)	θJA	35		40	°C/W	Depends on copper area, still air, 4-layer FR-4 (Table 3)	14
Thermal Resistance Junction-to-Case (MSE package)	θJC	5		10	°C/W	MSE package, junction-to-case	2

CAD (KiCad official)

Symbol: LT3022EMSE#TRPBF
Footprint: Package_SO:MSOP-16-1EP_3x4.039mm_P0.5mm_EP1.651x2.845mm
3D model: MSOP-16-EP (KiCad packages3D, STEP)
3D model files: lt3022emse-trpbf-etched.step / lt3022emse-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3022emse-trpbf.step / lt3022emse-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (20 pp, sha256 1e0a90f4431b0dec, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

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LT3022EMSE#TRPBF

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