LT3021ES8#PBF from Analog Devices, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	NC	unconnected	No connect; this pin may be left floating, tied to IN, or tied to GND.
2	OUT	power_out	Supplies power to the load and requires a minimum output capacitor of 3.3μF to prevent oscillations.
3	ADJ	input	Inverting input to the error amplifier with a 200mV reference referred to GND and a typical 20nA bias current flowing out of the pin.
4	AGND	power_in	Analog ground.
5	SHDN	input	Pulling this pin low turns the output off; it can be driven by logic or an open collector/drain with a pull-up resistor, should be connected to VIN if unused, and the device does not function if it is left unconnected.
6	PGND	power_in	Power ground.
7	NC	unconnected	No connect; this pin may be left floating, tied to IN, or tied to GND.
8	IN	power_in	Supplies power to the device, withstands reverse voltages with respect to ground and OUT, and needs a 3.3μF to 10μF bypass capacitor if it is more than six inches from the main input filter capacitor.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SO-8
Category	Power Management ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
ADJ Pin Voltage (VIN = 1.5V, ILOAD = 1mA)		196	200	204	mV	VIN = 1.5V, ILOAD = 1mA	4
ADJ Pin Voltage (full range)		193	200	206	mV	Full operating temperature range (l); 1.15V < VIN < 10V, 1mA < ILOAD < 500mA	4
Minimum Input Voltage			0.9	1.05	V	ILOAD = 500mA, TJ > 0°C	4
Minimum Input Voltage			0.9	1.1	V	ILOAD = 500mA, TJ < 0°C	4
Line Regulation (LT3021)		-1.75	0	1.75	mV	Full operating temperature range (l); ΔVIN = 1.15V to 10V, ILOAD = 1mA	4
Load Regulation (LT3021)		-2	0.4	2	mV	Full operating temperature range (l); VIN = 1.15V, ΔILOAD = 1mA to 500mA	4
Dropout Voltage			45	75	mV	ILOAD = 10mA	4
Dropout Voltage				110	mV	Full operating temperature range (l); ILOAD = 10mA	4
Dropout Voltage			155	190	mV	ILOAD = 500mA	4
Dropout Voltage				285	mV	Full operating temperature range (l); ILOAD = 500mA	4
GND Pin Current			110	250	μA	VIN = VOUT(NOMINAL) + 0.4V; ILOAD = 0mA	4
GND Pin Current			920		μA	VIN = VOUT(NOMINAL) + 0.4V; ILOAD = 10mA	4
GND Pin Current			2.25		mA	VIN = VOUT(NOMINAL) + 0.4V; ILOAD = 100mA	4
GND Pin Current			6.2	10	mA	VIN = VOUT(NOMINAL) + 0.4V; ILOAD = 500mA	4
ADJ Pin Bias Current			20	50	nA	VADJ = 0.2V, VIN = 1.2V	4
SHDN Pin Current			3	9.5	μA	VSHDN = 0V, VIN = 10V	4
SHDN Pin Current		-1		1	μA	VSHDN = 10V, VIN = 10V	4
Quiescent Current in Shutdown			3	9	μA	VIN = 6V, VSHDN = 0V	4
Current Limit		550			mA	VIN = VOUT(NOMINAL) + 0.5V, ΔVOUT = -5%; full operating temperature range (l)	4
Current Limit			1.8		A	VIN = 10V, VOUT = 0V	4
Input Reverse Leakage Current			1	20	μA	VIN = -10V, VOUT = 0V	4
Reverse Output Current (LT3021)			0.5	5	μA	VOUT = 1.2V, VIN = 0V	4
IN Pin Voltage	VIN	-10		10	V		2
OUT Pin Voltage	VOUT	-10		10	V		2
Input-to-Output Differential Voltage		-10		10	V		2
ADJ/SENSE Pin Voltage		-10		10	V		2
SHDN Pin Voltage		-10		10	V		2
Lead Temperature (Soldering)				300	°C	10 sec, S8 package	2
Storage Temperature Range	TSTG	-65		150	°C	S8 package	2
Maximum Junction Temperature	TJMAX			150	°C	S8 package	2
Operating Junction Temperature Range	TJ	-40		125	°C	E and I grade	2
Input Voltage Range	VIN	0.9		10	V		1
Adjustable Output Voltage Range	VOUT	0.2		9.5	V	Adjustable output device	10
Junction-to-Ambient Thermal Resistance (S8)	θJA		125		°C/W	S8 package, *see Applications Information	2
Junction-to-Case Thermal Resistance (S8)	θJC		40		°C/W	S8 package, measured junction to pin 6	2
Junction-to-Ambient Thermal Resistance (S8, measured)	θJA		70		°C/W	Board copper 2500mm2 topside, 2500mm2 backside, 2500mm2 board area	12
Junction-to-Ambient Thermal Resistance (S8, measured)	θJA		78		°C/W	Board copper 225mm2 topside, 2500mm2 backside, 2500mm2 board area	12
Junction-to-Ambient Thermal Resistance (S8, measured)	θJA		84		°C/W	Board copper 100mm2 topside, 2500mm2 backside, 2500mm2 board area	12
Junction-to-Ambient Thermal Resistance (S8, measured)	θJA		96		°C/W	Board copper 50mm2 topside, 2500mm2 backside, 2500mm2 board area	12

CAD (KiCad official)

Symbol: LT3021ES8#PBF
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SO-8 (KiCad packages3D, STEP)
3D model files: lt3021es8-pbf-etched.step / lt3021es8-pbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt3021es8-pbf.step / lt3021es8-pbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (16 pp, sha256 9be2a2fb292e277b, retrieved 2026-10-31, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

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LT3021ES8#PBF

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