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Contents

README

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LT1763CS8#TRPBF

Analog Devices · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SO-8

LT1763CS8#TRPBF from Analog Devices, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Output supplies power to the load and requires a minimum 3.3µF output capacitor to prevent oscillations, with larger capacitors needed for large transient loads.
2 SENSE/ADJ input For fixed-voltage versions this is the SENSE input to the error amplifier, which should be connected to OUT for optimum regulation; for the LT1763 it is the ADJ input, internally clamped to ±7V, with a 30nA bias current and a 1.22V reference.
3 GND power_in Ground; the bottom of the output voltage setting resistor divider should be connected directly to the GND pins for optimum load regulation.
4 BYP passive Reference bypass pin clamped internally to ±0.6V, where a maximum 0.01µF capacitor from OUT reduces output noise, and it must be left unconnected if not used.
5 SHDN input Shutdown input that turns the output off when pulled low, may be driven by 5V logic or open-collector logic with a pull-up resistor, and must be connected to IN if unused.
6 GND power_in Ground pin that must be connected to the other GND pins and the output divider bottom for proper load regulation.
7 GND power_in Ground pin that must be connected to the other GND pins and the output divider bottom for proper load regulation.
8 IN power_in Input supply pin that tolerates reverse voltage with respect to ground and OUT, and should have a 1µF to 10µF bypass capacitor if it is more than six inches from the main input filter capacitor.

Key specifications

Parameter Value
Manufacturer Analog Devices
Package SO-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
ADJ Pin Voltage (25°C, VIN = 2.2V) 1.208 1.22 1.232 V LT1763 VIN = 2.2V, ILOAD = 1mA 4
ADJ Pin Voltage (full temperature range) 1.19 1.22 1.25 V C, I Grade: 2.3V < VIN < 20V, 1mA < ILOAD < 500mA (l) 4
Line Regulation 1 5 mV LT1763 (Note 3) C, I Grade: ΔVIN = 2V to 20V, ILOAD = 1mA (l) 4
Load Regulation (25°C) 2 6 mV LT1763 (Note 3) VIN = 2.3V, ΔILOAD = 1mA to 500mA 4
Load Regulation (full temperature range) 12 mV LT1763 (Note 3) C, I Grade: VIN = 2.3V, ΔILOAD = 1mA to 500mA (l) 4
Minimum Operating Voltage 1.8 2.3 V C, I Grade: ILOAD = 500mA (Notes 3, 11) (l) 4
Dropout Voltage 0.13 0.19 V VIN = VOUT(NOMINAL), ILOAD = 10mA (Notes 5, 6, 11) 4
Dropout Voltage (full temperature range) 0.25 V VIN = VOUT(NOMINAL), ILOAD = 10mA (Notes 5, 6, 11) (l) 4
Dropout Voltage 0.17 0.22 V VIN = VOUT(NOMINAL), ILOAD = 50mA (Notes 5, 6, 11) 4
Dropout Voltage (full temperature range) 0.32 V VIN = VOUT(NOMINAL), ILOAD = 50mA (Notes 5, 6, 11) (l) 4
Dropout Voltage 0.2 0.24 V VIN = VOUT(NOMINAL), ILOAD = 100mA (Notes 5, 6, 11) 4
Dropout Voltage (full temperature range) 0.34 V VIN = VOUT(NOMINAL), ILOAD = 100mA (Notes 5, 6, 11) (l) 4
Dropout Voltage 0.3 0.35 V VIN = VOUT(NOMINAL), ILOAD = 500mA (Notes 5, 6, 11) 4
Dropout Voltage (full temperature range) 0.45 V VIN = VOUT(NOMINAL), ILOAD = 500mA (Notes 5, 6, 11) (l) 4
GND Pin Current 30 75 µA VIN = VOUT(NOMINAL), ILOAD = 0mA (Notes 5, 7) (l) 5
GND Pin Current 65 120 µA VIN = VOUT(NOMINAL), ILOAD = 1mA (Notes 5, 7) (l) 5
GND Pin Current 1.1 1.6 mA VIN = VOUT(NOMINAL), ILOAD = 50mA (Notes 5, 7) (l) 5
GND Pin Current 2 3 mA VIN = VOUT(NOMINAL), ILOAD = 100mA (Notes 5, 7) (l) 5
GND Pin Current 5 8 mA VIN = VOUT(NOMINAL), ILOAD = 250mA (Notes 5, 7) (l) 5
GND Pin Current 11 16 mA VIN = VOUT(NOMINAL), ILOAD = 500mA (Notes 5, 7) (l) 5
Output Voltage Noise 20 µVRMS COUT = 10µF, CBYP = 0.01µF, ILOAD = 500mA, BW = 10Hz to 100kHz 5
ADJ Pin Bias Current 30 100 nA (Notes 3, 8) 5
Shutdown Threshold (Off to On) VOUT 0.25 0.8 V VOUT = Off to On (l) 5
Shutdown Threshold (On to Off) VOUT 0.65 2 V VOUT = On to Off (l) 5
SHDN Pin Current VSHDN 0.1 µA (Note 9) VSHDN = 0V 5
SHDN Pin Current VSHDN 1 µA (Note 9) VSHDN = 20V 5
Quiescent Current in Shutdown 0.1 1 µA VIN = 6V, VSHDN = 0V 5
Ripple Rejection 50 65 dB VIN, VOUT = 1.5V (Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 500mA 5
Current Limit 520 mA C, I Grade: VIN = VOUT(NOMINAL) + 1V or 2.3V (Note 12), ΔVOUT = -0.1V (l) 5
Input Reverse Leakage Current 1 mA VIN = -20V, VOUT = 0V (l) 5
Reverse Output Current 5 10 µA LT1763 (Note 3) VOUT = 1.22V, VIN < 1.22V 5
IN Pin Voltage VIN -20 20 V Absolute Maximum Ratings 2
OUT Pin Voltage VOUT -20 20 V Absolute Maximum Ratings 2
Input to Output Differential Voltage -20 20 V Absolute Maximum Ratings 2
ADJ Pin Voltage -7 7 V Absolute Maximum Ratings 2
BYP Pin Voltage -0.6 0.6 V Absolute Maximum Ratings 2
SHDN Pin Voltage -20 20 V Absolute Maximum Ratings 2
Operating Junction Temperature Range (C grade) TJ -40 125 °C C, I Grade (Note 2) 2
Storage Temperature Range (S8 package) -65 150 °C S8 Package 2
Lead Temperature (Soldering, 10 sec) (S8 package) 300 °C S8 Package, soldering 10 sec 2
Output Voltage Range (adjustable) VOUT 1.22 20 V Adjustable device, ADJ pin voltage 1.22V referenced to ground 13
Maximum Junction Temperature (S8 package) TJMAX 150 °C S8 Package 2
Thermal Resistance Junction-to-Ambient (S8, header value) θJA 70 °C/W S8 Package 2
Thermal Resistance Junction-to-Case (S8) θJC 35 °C/W S8 Package 2
Thermal Resistance Junction-to-Ambient (S8, 2500mm² topside copper) θJA 60 °C/W Table 2, SO-8: copper area topside 2500mm2, board area 2500mm2, backside 2500mm2 17
Thermal Resistance Junction-to-Ambient (S8, 1000mm² topside copper) θJA 60 °C/W Table 2, SO-8: copper area topside 1000mm2, board area 2500mm2, backside 2500mm2 17
Thermal Resistance Junction-to-Ambient (S8, 225mm² topside copper) θJA 68 °C/W Table 2, SO-8: copper area topside 225mm2, board area 2500mm2, backside 2500mm2 17
Thermal Resistance Junction-to-Ambient (S8, 100mm² topside copper) θJA 74 °C/W Table 2, SO-8: copper area topside 100mm2, board area 2500mm2, backside 2500mm2 17
Thermal Resistance Junction-to-Ambient (S8, 50mm² topside copper) θJA 86 °C/W Table 2, SO-8: copper area topside 50mm2, board area 2500mm2, backside 2500mm2 17

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts COPPER Table 1. DE Package, 12-Lead DFN COPPER AREA 16

CAD (KiCad official)

  • Symbol: LT1763CS8#TRPBF
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: lt1763cs8-trpbf-etched.step / lt1763cs8-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt1763cs8-trpbf.step / lt1763cs8-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices datasheet (22 pp, sha256 2bc1aa72821928b4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF