LT1761IS5-1.2#TRMPBF from Analog Devices, in a TSOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	IN	power_in	Input pin that supplies power to the device; a bypass capacitor of 1μF to 10μF is sufficient, and the input is designed to withstand reverse voltage relative to ground and OUT.
2	GND	power_in	Ground reference pin for the regulator.
3	SHDN	input	Shutdown pin: pulling it low turns the output off, it may be driven by 5V logic or open-collector logic with a pull-up resistor, and if unused it must be connected to VIN.
4	BYP	passive	Reference bypass pin, internally clamped to ±0.6V from ground; a capacitor of up to 0.01μF from OUT to this pin lowers output noise to a typical 20μVRMS, and if not used it must be left unconnected.
5	OUT	power_out	Regulated output that supplies the load; a minimum output capacitor of 1μF is required to prevent oscillations.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	TSOT-23-5
Category	Power Management ICs
Pins	5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Regulated Output Voltage LT1761-1.2	VOUT	1.185	1.2	1.215	V	VIN = 2V, ILOAD = 1mA	4
Regulated Output Voltage LT1761-1.2	VOUT	1.17	1.2	1.23	V	2.3V < VIN < 20V, 1mA < ILOAD < 50mA (l)	4
Regulated Output Voltage LT1761-1.2	VOUT	1.15	1.2	1.24	V	2.3V < VIN < 20V, 1mA < ILOAD < 100mA (l)	4
Minimum Input Voltage	VIN(MIN)		1.8	2.3	V	ILOAD = 100mA (l)	4
Line Regulation LT1761-1.2			1	10	mV	ΔVIN = 2V to 20V, ILOAD = 1mA	4
Dropout Voltage	VDROPOUT		0.1	0.15	V	VIN = VOUT(NOMINAL), ILOAD = 1mA	5
Dropout Voltage	VDROPOUT			0.19	V	VIN = VOUT(NOMINAL), ILOAD = 1mA (l)	5
Dropout Voltage	VDROPOUT		0.17	0.22	V	VIN = VOUT(NOMINAL), ILOAD = 10mA	5
Dropout Voltage	VDROPOUT			0.29	V	VIN = VOUT(NOMINAL), ILOAD = 10mA (l)	5
Dropout Voltage	VDROPOUT		0.24	0.28	V	VIN = VOUT(NOMINAL), ILOAD = 50mA	5
Dropout Voltage	VDROPOUT			0.38	V	VIN = VOUT(NOMINAL), ILOAD = 50mA (l)	5
Dropout Voltage	VDROPOUT		0.3	0.35	V	VIN = VOUT(NOMINAL), ILOAD = 100mA	5
Dropout Voltage	VDROPOUT			0.45	V	VIN = VOUT(NOMINAL), ILOAD = 100mA (l)	5
GND Pin Current	IGND		20	45	μA	VIN = VOUT(NOMINAL), ILOAD = 0mA (l)	6
GND Pin Current	IGND		55	100	μA	VIN = VOUT(NOMINAL), ILOAD = 1mA (l)	6
GND Pin Current	IGND		230	400	μA	VIN = VOUT(NOMINAL), ILOAD = 10mA (l)	6
GND Pin Current	IGND		1	2	mA	VIN = VOUT(NOMINAL), ILOAD = 50mA (l)	6
GND Pin Current	IGND		2.2	4	mA	VIN = VOUT(NOMINAL), ILOAD = 100mA (l)	6
Ripple Rejection		55	65		dB	VIN, VOUT = 1.5V (Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 50mA	6
Current Limit	ILIM	110		200	mA	VIN = VOUT(NOMINAL) + 1V or 2.3V, ΔVOUT = -5% (l)	6
Input Reverse Leakage Current				1	mA	VIN = -20V, VOUT = 0V (l)	6
Reverse Output Current LT1761-1.2			10	20	μA	VOUT = 1.2V, VIN < 1.2V	6
Output Voltage Noise			20		μVRMS	COUT = 10μF, CBYP = 0.01μF, ILOAD = 100mA, BW = 10Hz to 100kHz	6
Quiescent Current in Shutdown			0.01	0.1	μA	VIN = 6V, VSHDN = 0V	6
Operating Junction Temperature Range (E, I Grade)	TJ	-40		125	°C	E, I grade (Note 2)	2
IN Pin Voltage	VIN	-20		20	V		2
OUT Pin Voltage	VOUT	-20		20	V		2
Input to Output Differential Voltage		-20		20	V		2
SHDN Pin Voltage	VSHDN	-20		20	V		2
Maximum Junction Temperature	TJMAX			150	°C		2
Storage Temperature Range	TSTG	-65		150	°C		2
Lead Temperature (Soldering, 10 sec)				300	°C	Soldering, 10 sec	2
Thermal Resistance Junction-to-Ambient	θJA		250		°C/W	Per package header, S5 TSOT-23 package	2
Thermal Resistance Junction-to-Ambient	θJA		125		°C/W	Board area 2500mm2, topside copper 2500mm2, backside copper 2500mm2	17
Thermal Resistance Junction-to-Ambient	θJA		130		°C/W	Board area 2500mm2, topside copper 225mm2, backside copper 2500mm2	17
Thermal Resistance Junction-to-Ambient	θJA		135		°C/W	Board area 2500mm2, topside copper 100mm2, backside copper 2500mm2	17
Thermal Resistance Junction-to-Ambient	θJA		150		°C/W	Board area 2500mm2, topside copper 50mm2, backside copper 2500mm2	17

CAD (KiCad official)

Symbol: LT1761IS5-1.2#TRMPBF
Footprint: Package_TO_SOT_SMD:TSOT-23-5
3D model: TSOT-23-5 (KiCad packages3D, STEP)
3D model files: lt1761is5-1-2-trmpbf-etched.step / lt1761is5-1-2-trmpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt1761is5-1-2-trmpbf.step / lt1761is5-1-2-trmpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (22 pp, sha256 5e4fc36c022415d2, retrieved 2026-11-02, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

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LT1761IS5-1.2#TRMPBF

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3D Model

Symbol & Footprint

Schematic Symbol

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Datasheet

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