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LT1308BIS8#TRPBF

Analog Devices · DC-DC Converters · SOIC-8

LT1308BIS8#TRPBF from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VC	passive	Compensation pin for the error amplifier; connect a series RC from this pin to ground (typically 47kΩ and 100pF) and minimize trace area at VC.
2	FB	input	Feedback pin with a 1.22V reference; connect the resistive divider tap here with VOUT = 1.22V(1 + R1/R2), and keep FB trace area small; FB voltage is limited to VIN + 1V and current into FB to ±1mA.
3	SHDN	input	Shutdown pin: ground to turn the switcher off, tie to 1V or more to enable; it does not need to be tied to VIN, and absolute maximum voltage is 10V.
4	GND	power_in	Ground pin to be connected directly to the local ground plane, which also serves as the heat sink for the package.
5	SW	output	Switch pin that connects to the inductor and diode; minimize its trace area to reduce EMI, with the SW voltage rated from -0.4V to 36V.
6	VIN	power_in	Supply pin with an operating input range of 1V to 10V that must have a local bypass capacitor connected right at the pin to ground.
7	LBI	input	Low-battery detector input with a 200mV threshold; the voltage on LBI must stay between -100mV and 1V, and the pin should float if the detector is unused.
8	LBO	output	Open-collector low-battery detector output that can sink 50μA, with a 220kΩ pull-up recommended; it is high impedance when SHDN is grounded and absolute maximum voltage is 10V.

Key specifications

Parameter	Value
Manufacturer	Analog Devices
Package	SOIC-8
Category	Power Management (PMIC)
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Switching quiescent current (LT1308B)	IQ		2.5	4	mA	Switching, LT1308B; l; VIN = 1.2V, VSHDN = VIN	3
Quiescent current in shutdown	IQ		0.01	1	μA	VSHDN = 0V (LT1308A/LT1308B); l; VIN = 1.2V	3
Feedback voltage	VFB	1.19	1.22	1.25	V	l; VIN = 1.2V, VSHDN = VIN	3
FB pin bias current	IB		27	80	nA	l; VIN = 1.2V, VSHDN = VIN	3
Reference line regulation			0.05	0.4	%/V	1.1V ≤ VIN ≤ 2V; l; VIN = 1.2V, VSHDN = VIN	3
Reference line regulation			0.01	0.2	%/V	2V ≤ VIN ≤ 10V; l; VIN = 1.2V, VSHDN = VIN	3
Minimum input voltage			0.92	1	V		3
Switching frequency	fOSC	500	600	750	kHz	l; VIN = 1.2V, VSHDN = VIN	4
Maximum duty cycle		82	90		%	l; VIN = 1.2V, VSHDN = VIN	4
Switch current limit		2	3	4.5	A	Duty Cycle = 30% (Note 4)	4
Switch VCESAT	VCESAT		290	350	mV	ISW = 2A (25°C, -40°C), VIN = 1.5V	4
Switch VCESAT	VCESAT		330	400	mV	ISW = 2A (85°C), VIN = 1.5V	4
Shutdown pin current			2	5	μA	VSHDN = 1.1V; l	4
Shutdown pin current			20	35	μA	VSHDN = 6V; l	4
Shutdown pin current			0.01	0.1	μA	VSHDN = 0V; l	4
LBI threshold voltage		196	200	204	mV	l	4
LBI threshold voltage		193	200	207	mV	l	4
LBO output low			0.1	0.25	V	ISINK = 50μA; l	4
LBO leakage current			0.01	0.1	μA	VLBI = 250mV, VLBO = 5V; l	4
LBI input bias current			33	100	nA	VLBI = 150mV	4
Switch leakage current			0.01	10	μA	VSW = 5V; l	4
VIN, SHDN, LBO voltage				10	V		2
SW voltage		-0.4		36	V		2
VC voltage				2	V		2
LBI voltage		-0.1		1	V		2
Current into FB pin		-1		1	mA		2
Storage temperature range		-65		150	°C		2
Lead temperature (soldering)				300	°C	10 sec	2
Operating temperature range (Industrial grade)		-40		85	°C	Industrial grade (LT1308BIS8, -40°C to 85°C)	2
Input voltage range	VIN	1		10	V	Operating input voltage range stated in datasheet description	1
Thermal resistance, junction-to-ambient (S8 package)	θJA		190		°C/W	8-lead plastic SO (S8 package)	2
Maximum junction temperature	TJMAX			125	°C		2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part	Material	Colour / plating	Datasheet says	Page
contacts	copper		connected to these pins also functions as a heat sink. For the TSSOP package, connect all pins to ground copper	6

CAD (KiCad official)

Symbol: LT1308BIS8#TRPBF
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: lt1308bis8-trpbf-etched.step / lt1308bis8-trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lt1308bis8-trpbf.step / lt1308bis8-trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices datasheet (20 pp, sha256 11d1f4d87cd83de1, retrieved 2026-10-21, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF