LSM6DS3
Public Made by Adomby adom
ST 6-axis inertial module, LGA-14. 3D accelerometer + 3D gyroscope, I2C/SPI, FIFO, embedded functions. Datasheet-verified.
Also listed as LSM6DS3TR
LSM6DS3
STMicroelectronics · 6-axis IMU (accel + gyro) · LGA-14
A 6-axis inertial measurement unit in a 3 x 2.5 mm LGA-14, combining a 3D accelerometer and 3D gyroscope in one package (ST's iNEMO line). The accelerometer covers plus/minus 2 to 16 g and the gyroscope plus/minus 125 to 2000 dps, both read over I2C or SPI, with a 4 KB smart FIFO that buffers samples so the host can sleep between reads. On-chip embedded functions (pedometer, step detector and counter, tilt, and significant-motion) offload always-on motion tracking, and two interrupt pins signal events. It is a low-power staple for wearables, drones, game controllers, and gesture input. This page is sourced from the current LSM6DS3TR-C datasheet. Runs 1.71-3.6 V.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SDO/SA0 | bidirectional | SPI 4-wire serial data output (SDO) when SPI is selected. In I²C mode this pin sets the least significant bit of the 7-bit device slave address (SA0), giving two selectable I²C addresses on a single bus. |
| 2 | SDx | bidirectional | Mode 1: not used, must be tied to VDDIO or GND. Mode 2: I²C master serial data (MSDA) for the built-in sensor hub connecting external MEMS peripherals (magnetometer, etc.). |
| 3 | SCx | bidirectional | Mode 1: not used, must be tied to VDDIO or GND. Mode 2: I²C master serial clock (MSCL) for the built-in sensor hub connecting external MEMS peripherals. |
| 4 | INT1 | output | Programmable interrupt 1 output. Routes data-ready, FIFO, wake-up, free-fall, tap/double-tap, 6D/4D orientation, tilt, step-detector, significant-motion and other embedded-function events (mapping configured via INT1_CTRL / MD1_CFG). |
| 5 | VDDIO | power_in | Independent I/O supply pin (1.62 V typical, 1.71 V to 3.6 V analog VDD range allows level-shifted digital rails). A 100 nF filter capacitor is recommended. |
| 6 | GND | power_in | 0 V ground return. Both GND pins (6 and 7) must be tied to the board ground plane. |
| 7 | GND | power_in | 0 V ground return. Both GND pins (6 and 7) must be tied to the board ground plane. |
| 8 | VDD | power_in | Main analog supply, 1.71 V to 3.6 V. A 100 nF filter capacitor is recommended close to the pin. |
| 9 | INT2 | bidirectional | Programmable interrupt 2 output / data-enable (DEN) input used to timestamp external events into the FIFO. In Mode 2 this pin can alternatively act as the I²C master external synchronization signal (MDRDY) indicating a new sample from a sensor-hub slave. |
| 10 | OCS | input | Auxiliary SPI 3-wire interface enable (mode 3). Leave unconnected in modes 1 and 2 (datasheet Table 2, p.18). |
| 11 | NC | unconnected | No internal connection. Leave electrically unconnected but solder to PCB for mechanical support. |
| 12 | CS | input | I²C / SPI mode selection and SPI chip-select. CS = 1 selects I²C mode (SPI idle); CS = 0 enables SPI communication (I²C disabled). Must be driven high or tied to VDDIO if only I²C is used. |
| 13 | SCL | input | I²C serial clock (SCL) when I²C is selected, or SPI serial port clock (SPC) when SPI is selected. Muxed between the two host protocols by the CS pin. |
| 14 | SDA | bidirectional | I²C serial data (SDA) in I²C mode; SPI 4-wire serial data input (SDI) in SPI mode; SPI 3-wire bidirectional serial data (SDO) when SIM = 1 (3-wire SPI). Function selected by CS and SIM configuration. |
Key specifications
| Parameter | Value |
|---|---|
| Type | 6-axis IMU (accel + gyro) |
| Accelerometer | ±2/±4/±8/±16 g |
| Gyroscope | ±125 to ±2000 dps |
| Interface | I2C + SPI |
| FIFO | 4 KB smart FIFO |
| Embedded | pedometer, tilt, significant-motion |
| Supply voltage | 1.71-3.6 V |
| Package | LGA-14 (3 x 2.5 mm) |
Ordering variants
Same part, different packaging or reel option.
LSM6DS3TR (LGA-14)LSM6DS3 (LGA-14)
CAD (KiCad official)
- Symbol:
Sensor_Motion:LSM6DS3 - Footprint:
Package_LGA:LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y - 3D model: LGA-14 (KiCad packages3D)
- 3D model files:
lsm6ds3-etched.step/lsm6ds3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lsm6ds3.step/lsm6ds3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics LSM6DS3 datasheet, DocID026899 Rev 4 (95 pp, sha256
ec33c24904ddeeb2, retrieved 2026-11-11; ST no longer hosts this obsolete part's datasheet, so this is SparkFun's copy of ST's document). Corrected 2026-11-11: the page previously carried the LSM6DS3TR-C datasheet, a different sensor. - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).