# LRBN25GFER100

**NCT** · Current Sense Resistors/Shunt Resistors · 2512

LRBN25GFER100 from NCT, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First end electrode of the 2512 alloy current-sense resistor (LRBN25 series, 1mΩ~100mΩ, 3W max rated power, 54.78A max rated current); the element is non-polarized and 4-wire resistance is measured on the back-side electrodes. |
| 2 | 2 | passive | Second end electrode of the 2512 alloy current-sense resistor (LRBN25 series, 1mΩ~100mΩ, 3W max rated power, 54.78A max rated current); the element is non-polarized and interchangeable with the other terminal. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | NCT |
| Package | 2512 |
| Category | Resistors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Resistance range (LRBN25, 2W&3W) | R | 1 |  | 100 | mΩ | LRBN25 row, 2W&3W; printed range 1mΩ~100mΩ | 5 |
| Temperature coefficient of resistance | TCR | -50 |  | 50 | ppm/°C | 1mΩ<R≦100mΩ (printed ±50) | 5 |
| Insulation resistance |  | 100 |  |  | MΩ | 100 VDC applied 1 min between terminals and protective coat / substrate (printed >100MΩ) | 12 |
| Solderability (electrode new-solder coverage) |  | 95 |  |  | % | Immersed in 245±5°C solder bath 3±1 s; printed electrode coverage must be greater than 95% | 11 |
| Short time overload resistance change | ΔR/R | -0.5 |  | 0.5 | % | Overload 5 s at X5 rated power (3W for LRBN25); 24 h rest before measurement (printed ≦±0.5%) | 10 |
| Biased humidity resistance change | ΔR/R | -0.5 |  | 0.5 | % | 85±5°C, 85±5%RH, rated current 90 min ON / 30 min OFF, 1000 h (printed ≦±0.5%) | 11 |
| Temperature cycling resistance change | ΔR/R | -0.5 |  | 0.5 | % | -55°C to +125°C, 1000 cycles, 30 min dwell (printed ≦±0.5%) | 11 |
| Low temperature exposure resistance change | ΔR/R | -0.5 |  | 0.5 | % | -55±2°C, 1000 h (printed ≦±0.5%) | 11 |
| High temperature exposure resistance change | ΔR/R | -1 |  | 1 | % | 170°C, 1000 h (printed ≦±1.0%) | 11 |
| Load life resistance change | ΔR/R | -1 |  | 1 | % | 70±2°C, rated current 90 min ON / 30 min OFF, 1000 h (printed ≦±1.0%) | 11 |
| Resistance to solder heat resistance change | ΔR/R | -0.5 |  | 0.5 | % | 260±5°C solder bath, 10±1 s (printed ≦±0.5%) | 11 |
| Resistance to solvent resistance change | ΔR/R | -0.5 |  | 0.5 | % | Immersed in isopropanol at 20-25°C, 60±5 s, 24 h rest (printed ≦±0.5%) | 11 |
| Joint strength of solder resistance change | ΔR/R | -0.5 |  | 0.5 | % | Bend test board, force applied at board centre under load (printed ≦±0.5%) | 12 |
| Rated power | P |  |  | 2 | W | LRBN25 row printed as 2W&3W; 2W variant; derate above 70°C | 5 |
| Rated power | P |  |  | 3 | W | LRBN25 row printed as 2W&3W; 3W variant; derate above 70°C | 5 |
| Maximum rated current | I |  |  | 54.78 | A | LRBN25 row, 2W&3W; I = √(P/R) | 5 |
| Maximum overload current |  |  |  | 122.48 | A | LRBN25 row, 2W&3W | 5 |
| Operating temperature range | T | -55 |  | 170 | °C | 使用温度范围 printed for LRBN25 | 5 |
| Storage temperature range | T | 5 |  | 35 | °C | Sealed package, 40-75 %RH, no direct sunlight, shelf life 2 years | 14 |
| Storage relative humidity | RH | 40 |  | 75 | % | Sealed package, temperature 5-35°C | 14 |
| Nominal resistance (MPN suffix R100) | R |  | 0.1 |  | Ω | Decoded from MPN suffix R100 using the printed marking convention (R005 = 5mΩ) | 7 |

## CAD (KiCad official)

- Symbol: `LRBN25GFER100`
- Footprint: `Resistor_SMD:R_2512_6332Metric`
- 3D model: 2512 (KiCad packages3D, STEP)
- 3D model files: `lrbn25gfer100-etched.step` / `lrbn25gfer100-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lrbn25gfer100.step` / `lrbn25gfer100.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [NCT datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590283133808910336) (15 pp, sha256 `1c7bbc6a4c0f07fe`, retrieved 2026-10-22, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lrbn25gfer100-datasheet.pdf)