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Contents

README

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LRBN25GFER070

NCT · Current Sense Resistors/Shunt Resistors · 2512

LRBN25GFER070 from NCT, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer NCT
Package 2512
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Resistance range (LRBN25, non-S) R 1 100 mΩ Resistance range printed for LRBN25 (2W&3W) row 5
Rated power P 3 W Printed as 2W&3W for LRBN25 (non-S); 3W printed for LRBN25(S) 5
Maximum rated current I 54.78 A Printed for LRBN25 2W&3W row; I = SQRT(P/R) 5
Maximum overload current 122.48 A Printed for LRBN25 2W&3W row 5
Temperature coefficient of resistance (R≤1mΩ) TCR -275 275 ppm/°C R≤1mΩ, LRBN25 row 5
Temperature coefficient of resistance (1mΩ<R≤100mΩ) TCR -50 50 ppm/°C 1mΩ<R≤100mΩ, LRBN25 row 5
Operating temperature range T -55 170 °C 使用温度范围 as printed for LRBN25 row 5
Short time overload resistance change ΔR/R -0.5 0.5 % 5 s overload at X5 rated power (3W printed for LRBN25), rest 24 h, JIS-C5201 10
Biased humidity resistance change ΔR/R -0.5 0.5 % 85°C ±5°C, 85 ±5%RH, rated current 90 min ON / 30 min OFF, 1000 h 11
Temperature cycling resistance change ΔR/R -0.5 0.5 % -55°C to +125°C, 1000 cycles, 30 min dwell, AEC-Q200 11
Low temperature exposure resistance change ΔR/R -0.5 0.5 % -55±2°C, 1000 h 11
High temperature exposure resistance change ΔR/R -1 1 % 170°C oven, 1000 h 11
Load life resistance change ΔR/R -1 1 % 70±2°C, rated current 90 min ON / 30 min OFF, 1000 h 11
Resistance to solder heat resistance change ΔR/R -0.5 0.5 % 260±5°C solder bath, 10±1 s 11
Resistance to solvent resistance change ΔR/R -0.5 0.5 % Isopropyl alcohol 20-25°C, 60±5 s, then 24 h rest 11
Solderability (new solder coverage) 95 % 245±5°C bath, 3±1 s; electrode new-tin coverage area 11
Joint strength of solder resistance change ΔR/R -0.5 0.5 % Bend test on solder-mounted test board, under load 12
Insulation resistance IR 100 MΩ 100 VDC applied 1 min between electrodes and protective layer / substrate 12
Storage temperature T_stg 5 35 °C Sealed storage, shelf life 2 years, no direct sunlight 14
Storage relative humidity RH 40 75 % Sealed storage, shelf life 2 years 14

CAD (KiCad official)

  • Symbol: LRBN25GFER070
  • Footprint: Resistor_SMD:R_2512_6332Metric
  • 3D model: 2512 (KiCad packages3D, STEP)
  • 3D model files: lrbn25gfer070-etched.step / lrbn25gfer070-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lrbn25gfer070.step / lrbn25gfer070.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NCT datasheet (15 pp, sha256 1c7bbc6a4c0f07fe, retrieved 2026-11-04, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF