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LRBN25GFER015

NCT · Current Sense Resistors/Shunt Resistors · 2512

LRBN25GFER015 from NCT, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer NCT
Package 2512
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum rated power (LRBN25 row, printed 2W&3W) P 3 W LRBN25 row prints 2W&3W; 3W is the higher printed value 5
Maximum rated current (LRBN25 row) I 54.78 A LRBN25 2W&3W row, printed for the 1mΩ~100mΩ range; no value printed for 15mΩ 5
Maximum overload current (LRBN25 row) 122.48 A LRBN25 2W&3W row, printed for the 1mΩ~100mΩ range 5
Temperature coefficient of resistance TCR -50 50 ppm/°C 1mΩ<R≦100mΩ (LRBN25 row) 5
Operating temperature range -55 170 °C 使用温度范围, LRBN25 row 5
Resistance change, short time overload ΔR/R -0.5 0.5 % 5 s at 5× rated power (3W for LRBN25), 24 h recovery 10
Resistance change, biased humidity ΔR/R -0.5 0.5 % 85°C, 85%RH, rated current, 90 min ON/30 min OFF, 1000 h 11
Resistance change, temperature cycling ΔR/R -0.5 0.5 % -55°C to +125°C, 1000 cycles 11
Resistance change, low temperature exposure ΔR/R -0.5 0.5 % -55±2°C, 1000 h 11
Resistance change, high temperature exposure ΔR/R -1 1 % 170°C, 1000 h 11
Resistance change, load life ΔR/R -1 1 % 70±2°C, rated current, 90 min ON/30 min OFF, 1000 h 11
Resistance change, resistance to solder heat ΔR/R -0.5 0.5 % 260±5°C solder bath, 10±1 s 11
Resistance change, resistance to solvent ΔR/R -0.5 0.5 % Isopropyl alcohol 20~25°C, 60±5 s 11
Resistance change, joint strength of solder ΔR/R -0.5 0.5 % Load applied at centre of bend test board 12
Insulation resistance IR 100 MΩ 100 VDC applied for 1 min, terminals to protective layer and to substrate (printed >100MΩ) 12
Solderability (electrode area covered with new solder) 95 % Immersed 245±5°C for 3±1 s 11
Storage temperature 5 35 °C Storage in sealed condition, 40~75 %RH, up to 2 years; not an operating limit 14

CAD (KiCad official)

  • Symbol: LRBN25GFER015
  • Footprint: Resistor_SMD:R_2512_6332Metric
  • 3D model: 2512 (KiCad packages3D, STEP)
  • 3D model files: lrbn25gfer015-etched.step / lrbn25gfer015-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lrbn25gfer015.step / lrbn25gfer015.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NCT datasheet (15 pp, sha256 1c7bbc6a4c0f07fe, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF