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Contents

README

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LPW5202FDB5F21

LOWPOWER · Power Distribution Switches · SOT-23-5

LPW5202FDB5F21 from LOWPOWER, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Output of power switch.
2 GND power_in Ground.
3 FLAGB output Open-drain active-low flag pin to indicate fault condition.
4 EN input Active-high device enable pin.
5 IN power_in Power supply and input of power switch, 2.4V to 6V operating range.

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Current limit level (LPW5202xxx21, fixed 2.3A variant) ILIM 2.1 2.3 2.5 A VIN = 5V, VOUT = 4.5V, TA=25°C 6
Under voltage lockout level (IN falling) VUVLO_F 2.25 2.5 2.75 V IN voltage falling 5
Under voltage lockout level (IN rising) VUVLO_R 2.4 2.65 2.9 V IN voltage rising 5
Enable pull-down resistor RPD 1 1.4 1.8 MΩ VIN = 5V, TA=25°C 6
Output auto discharge RDIS 90 110 130 Ω VIN = 5V, EN flip from high to low 6
OCP response time tOCP 3 7 15 μs VIN = 5V, TA = 25°C, time from IOUT hits IOCP to IOUT stop rising 6
Input voltage (recommended operating) 2.4 6 V 5
Enable voltage (recommended operating) 0 6 V 5
Ambient temperature (recommended operating) TA -40 85 °C 5
IN to GND -0.3 7 V 5
OUT to GND -0.3 7 V 5
EN to GND -0.3 7 V 5
ISET to GND -0.3 7 V 5
FLAGB to GND -0.3 7 V 5
Maximum junction temperature 150 °C 5
Storage temperature range -65 150 °C 5
Maximum soldering temperature (at leads) 260 °C at leads, 10 seconds 5
ESD HBM (Human Body Model) -4000 4000 V JEDEC JS-001 5
ESD CDM (Charged Device Model) -500 500 V JEDEC JS-002 5
Maximum power dissipation (PD) PD 0.6 W TA <= 25℃ 5
Thermal resistance, junction to ambient θJA 203 °C/W Note 2: 2S2P JEDEC standard PCB 5
Thermal resistance, junction to case θJC 120 °C/W Note 2: 2S2P JEDEC standard PCB 5

CAD (KiCad official)

  • Symbol: LPW5202FDB5F21
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: lpw5202fdb5f21-etched.step / lpw5202fdb5f21-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lpw5202fdb5f21.step / lpw5202fdb5f21.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (14 pp, sha256 a2d63b77e87fdc1c, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF