# LPA2010MSF

**LOWPOWER** · Audio Amplifiers · MSOP-8

LPA2010MSF from LOWPOWER, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SD | input | Active-low shutdown input: a logic low turns the amplifier off, and the datasheet gives VSD_L max 0.4 V and VSD_H min 1 V at VDD = 5 V. |
| 2 | BYP | passive | Analog reference bypass pin, where the datasheet says to connect a 1 uF capacitor to GND; this capacitor sets the start-up rate and reduces supply noise coupling into the output. |
| 3 | INP | input | Positive input of the amplifier, fed through the input capacitor Ci and input resistor Ri in the typical application. |
| 4 | INN | input | Negative input of the amplifier, fed through Ci and Ri in the differential-input application schematic. |
| 5 | VOP | output | Positive signal output that drives the speaker directly with VON, with no LC output filter needed for speaker traces about 100 mm or shorter. |
| 6 | VDD | power_in | Supply voltage pin specified at 2.5 V to 5.5 V, where the outputs are disabled when VDD drops to 2.5 V or below. |
| 7 | GND | power_in | Ground pin; the datasheet recommends placing the VDD decoupling and bypass capacitors as close to the chip pins as possible. |
| 8 | VON | output | Negative signal output that drives the speaker differentially with VOP, with no LC output filter needed for short speaker traces. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | LOWPOWER |
| Package | MSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply power (VDD) | VDD | 2.5 |  | 5.5 | V |  | 3 |
| High-level input voltage | VSD_H | 1 |  |  | V | VDD=5.0V | 3 |
| Low-level input voltage | VSD_L |  |  | 0.4 | V | VDD=5.0V | 3 |
| Maximum VDD voltage to GND |  | -0.3 |  | 6 | V | Absolute maximum rating | 2 |
| Other pin voltage to GND |  | -0.3 |  | 5.5 | V | Absolute maximum rating | 2 |
| Maximum junction temperature |  |  |  | 125 | °C |  | 2 |
| Operating ambient temperature range | Ta | -40 |  | 85 | °C |  | 2 |
| Maximum soldering temperature |  |  |  | 260 | °C | at leads, 10 sec | 2 |
| ESD HBM (Human Body Model) |  |  |  | 2 | kV | 100pF through 1.5kΩ, JEDEC | 2 |
| ESD MM (Machine Model) |  |  |  | 200 | V | 200pF through 500nH, JEDEC | 2 |
| Maximum power dissipation | PD |  |  | 1 | W | TA=25°C | 2 |
| Thermal resistance junction to ambient | θJA |  | 120 |  | °C/W |  | 2 |
| Over-temperature protection trip point tolerance |  | -15 |  | 15 | °C | Trip point 140°C, device to device | 8 |
| Over-temperature protection trip point |  |  | 140 |  | °C | Die temperature | 8 |
| Output power | Po |  | 3 |  | W | THD+N=10%, f=1KHz, RL=4Ω, VDD=5.0V | 3 |
| Output power | Po |  | 2 |  | W | THD+N=10%, f=1KHz, RL=4Ω, VDD=4.2V | 3 |
| Output power | Po |  | 1.58 |  | W | THD+N=10%, f=1KHz, RL=4Ω, VDD=3.7V | 3 |
| Output power | Po |  | 2.3 |  | W | THD+N=1%, f=1KHz, RL=4Ω, VDD=5.0V | 3 |
| Output power | Po |  | 1.6 |  | W | THD+N=1%, f=1KHz, RL=4Ω, VDD=4.2V | 3 |
| Output power | Po |  | 1.28 |  | W | THD+N=1%, f=1KHz, RL=4Ω, VDD=3.7V | 3 |
| Output power | Po |  | 1.73 |  | W | THD+N=10%, f=1KHz, RL=8Ω, VDD=5.0V | 3 |
| Output power | Po |  | 1.2 |  | W | THD+N=10%, f=1KHz, RL=8Ω, VDD=4.2V | 3 |
| Output power | Po |  | 0.92 |  | W | THD+N=10%, f=1KHz, RL=8Ω, VDD=3.7V | 3 |
| Output power | Po |  | 1.42 |  | W | THD+N=1%, f=1KHz, RL=8Ω, VDD=5.0V | 3 |
| Output power | Po |  | 0.98 |  | W | THD+N=1%, f=1KHz, RL=8Ω, VDD=4.2V | 3 |
| Output power | Po |  | 0.75 |  | W | THD+N=1%, f=1KHz, RL=8Ω, VDD=3.7V | 3 |
| Power supply ripple rejection | PSRR |  | 75 |  | dB | f=100Hz, INPUT ac-grounded with CIN=0.47uF, VDD=5.0V | 3 |
| Power supply ripple rejection | PSRR |  | 50 |  | dB | f=1KHz, INPUT ac-grounded with CIN=0.47uF, VDD=5.0V | 3 |
| Signal-to-noise ratio | SNR |  | 88 |  | dB | VDD=5V, RL=4Ω, THD=1%, f=1KHz | 3 |
| Switching frequency | Fsw |  | 550 |  | KHz | VDD=5V | 3 |
| Output noise | VN |  | 140 |  | μV | INPUT ac-grounded with CIN=0.47uF, VDD=5.0V | 3 |
| Output offset voltage | VOS |  | 5 |  | mV | VDD=5.0V, VSD=0V | 3 |
| Shutdown current | ILEAK |  | 0.1 |  | uA | VSD=VDD=5.0V | 3 |
| Quiescent current | IQ |  | 2 |  | mA | VDD=5.0V, No load | 3 |
| Internal feedback resistor Rf (maximum setting) | Rf |  | 150 |  | kΩ | Maximum setting selected by the LPA2010 | 6 |
| Rf tolerance | Rf | -10 |  | 10 | % | Rf = 150 kΩ ±10% | 6 |

## CAD (KiCad official)

- Symbol: `LPA2010MSF`
- Footprint: `Package_SO:MSOP-8_3x3mm_P0.65mm`
- 3D model: MSOP-8 (KiCad packages3D, STEP)
- 3D model files: `lpa2010msf-etched.step` / `lpa2010msf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lpa2010msf.step` / `lpa2010msf.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [LOWPOWER datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588903999877885952) (9 pp, sha256 `377bf893a000300f`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lpa2010msf-datasheet.pdf)