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LP87334ARHDRQ1

Texas Instruments · DC-DC Converters · VQFN-28(5x5)

LP87334ARHDRQ1 from Texas Instruments, in a VQFN-28(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT_LDO0 power_out LDO0 regulator output; leave the pin floating if LDO0 is not used.
2 FB_B0 input Positive output voltage feedback input for Buck 0.
3 FB_B1 input Positive output voltage feedback for Buck 1 in two single-phase configuration, and negative (output ground) feedback for Buck 0 in dual-phase configuration.
4 AGND power_in Ground pin.
5 VANA power_in Supply voltage for analog and digital blocks; must be connected to the same node as VIN_Bx (2.8 V to 5.5 V recommended operating range).
6 EN input Programmable enable signal for the regulators and GPOs; leave floating if not used.
7 VOUT_LDO1 power_out LDO1 regulator output; leave the pin floating if LDO1 is not used.
8 VIN_LDO1 power_in Power input for LDO1 (2.5 V to 5.5 V); connect to VANA if LDO1 is not used.
9 nINT output Open-drain interrupt output, active low; connect to ground if not used.
10 CLKIN bidirectional External clock input, with alternative function as general-purpose digital output GPO2; leave floating if not used.
11 VIN_B1 power_in Input for Buck 1; VIN_Bx pins are not connected internally and must be connected together in the application and locally bypassed.
12 VIN_B1 power_in Input for Buck 1; VIN_Bx pins are not connected internally and must be connected together in the application and locally bypassed.
13 SW_B1 power_out Buck 1 switch node; leave floating if Buck 1 is not used.
14 SW_B1 power_out Buck 1 switch node; leave floating if Buck 1 is not used.
15 PGND_B1 power_in Power ground for Buck 1.
16 PGND_B1 power_in Power ground for Buck 1.
17 SCL input I2C serial interface clock input; connect a pull-up resistor, or connect to ground if the I2C interface is not used.
18 SDA bidirectional I2C serial interface data input and output; connect a pull-up resistor, or connect to ground if the I2C interface is not used.
19 SGND power_in Ground pin.
20 PGND_B0 power_in Power ground for Buck 0.
21 PGND_B0 power_in Power ground for Buck 0.
22 SW_B0 power_out Buck 0 switch node; leave floating if Buck 0 is not used.
23 SW_B0 power_out Buck 0 switch node; leave floating if Buck 0 is not used.
24 VIN_B0 power_in Input for Buck 0; VIN_Bx pins are not connected internally and must be connected together in the application and locally bypassed.
25 VIN_B0 power_in Input for Buck 0; VIN_Bx pins are not connected internally and must be connected together in the application and locally bypassed.
26 GPO output General-purpose digital output; leave floating if not used.
27 PGOOD output Power-good indication output; leave floating if not used.
28 VIN_LDO0 power_in Power input for LDO0 (2.5 V to 5.5 V); connect to VANA if LDO0 is not used.
29 THERMAL PAD passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-28(5x5)
Category Power Management (PMIC)
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage on power connections VIN_Bx, VANA (same input supply) VIN_Bx, VANA -0.3 6 V 5
Voltage on power connections VIN_LDOx VIN_LDOx -0.3 6 V 5
Voltage on logic pins SDA, SCL, nINT, EN -0.3 6 V Input or output pins 5
Junction temperature TJ-MAX -40 150 °C 5
Storage temperature Tstg -65 150 °C 5
Input voltage, VIN_Bx and VANA V(VIN_Bx), V(VANA) 2.8 5.5 V VIN_Bx and VANA must be connected to the same supply 5
Voltage on LDO inputs VIN_LDOx 2.5 5.5 V 5
Voltage on logic pins EN, nINT 0 5.5 V Input or output pins 5
Voltage on I2C interface SCL, SDA (High-Speed mode) 0 1.95 V High-Speed (3.4 MHz) modes 5
Junction temperature TJ -40 140 °C 5
Ambient temperature TA -40 125 °C 5
Junction-to-ambient thermal resistance RθJA 36.7 °C/W 6
Junction-to-case (top) thermal resistance RθJCtop 26.6 °C/W 6
Junction-to-case (bottom) thermal resistance RθJCbot 2.2 °C/W 6
Input filtering capacitance for buck regulators CIN_BUCK 1.9 10 µF Effective capacitance, from VIN_Bx to PGND_Bx 6
Output filtering capacitance for buck regulators COUT_BUCK 10 22 500 µF Effective capacitance per phase 6
Input filtering capacitance for LDO regulators CIN_LDO 0.6 2.2 µF Effective capacitance, from VIN_LDOx to AGND 6
Output filtering capacitance for LDO regulators COUT_LDO 0.4 1 2.7 µF Effective capacitance 6
Input and output capacitor ESR ESRC 2 10 mΩ [1-10] MHz 6
Inductance of the inductor L 0.47 µH 6
Inductance tolerance L -30 30 % 6
Input voltage range, buck (VIN_Bx and VANA) V(VIN_Bx), V(VANA) 2.8 3.7 5.5 V VIN_Bx and VANA pins must be connected to the same supply line 6
Programmable output voltage range, buck VOUT_Bx 0.7 1 3.36 V Programmable voltage range 6
Minimum input-output voltage difference 0.8 V Minimum voltage between V(VIN_Bx) and VOUT to fulfill the electrical characteristics 6
DC output voltage accuracy, force PWM, VOUT < 1 V VOUT_Bx_DC -20 20 mV Force PWM mode, VOUT < 1 V 7
DC output voltage accuracy, force PWM, VOUT ≥ 1 V VOUT_Bx_DC -2 2 % Force PWM mode, VOUT ≥ 1 V 7
DC line regulation DCLNR -0.05 0.05 %/V IOUT = 1 A 7
Transient load step response, single-phase output TLDSR -55 55 mV IOUT = 0.1 A to 2 A, TR = TF = 400 ns, PWM mode 7
Transient load step response, dual-phase output TLDSR -50 50 mV IOUT = 0.1 A to 4 A, TR = TF = 400 ns, PWM mode 7
Transient line response, buck TLNSR -10 10 mV V(VIN_Bx) stepping 3 V ↔ 3.5 V, TR = TF = 10 µs, IOUT = IOUT(max) 7
Forward current limit per phase, programmable range ILIM FWD 1.5 4 A Programmable range 7
Forward current limit accuracy, V(VIN_Bx) ≥ 3 V ILIM FWD -5 7.5 20 % V(VIN_Bx) ≥ 3 V, ILIM = 4 A 7
Forward current limit accuracy, 2.8 V ≤ V(VIN_Bx) < 3 V ILIM FWD -20 7.5 20 % 2.8 V ≤ V(VIN_Bx) < 3 V, ILIM = 4 A 7
Negative current limit per phase ILIM NEG 1.6 2 3 A 7
On-resistance, high-side FET RDS(ON) HS FET 50 110 mΩ Each phase, between VIN_Bx and SW_Bx pins (I = 1 A) 7
On-resistance, low-side FET RDS(ON) LS FET 45 90 mΩ Each phase, between SW_Bx and PGND_Bx pins (I = 1 A) 7
Switching frequency ƒSW 1.8 2 2.2 MHz PWM mode 7
Output pulldown resistance, buck RDIS_Bx 150 250 350 Ω Regulator disabled 8
Buck overvoltage threshold for PGOOD and power-good interrupt 39 50 64 mV V(VIN_Bx) and V(VANA) fixed 3.7 V; compared to DC output voltage level 8
Buck undervoltage threshold for PGOOD and power-good interrupt -53 -40 -29 mV V(VIN_Bx) and V(VANA) fixed 3.7 V; compared to DC output voltage level 8
Input voltage range for LDO power inputs VIN_LDOx 2.5 3.7 5.5 V VIN_LDOx can be higher or lower than V(VANA) 8
Programmable output voltage range, LDO VOUT_LDOx 0.8 3.3 V Programmable voltage range 8
DC output voltage accuracy, LDO, VOUT < 1 V VOUT_LDO_DC -20 20 mV VOUT < 1 V 8
Transient load step response, LDO TLDSR -50 40 mV IOUT = 1 mA to 300 mA, TR = TF = 1 µs 8
Transient line response, LDO TLNSR -7 7 mV V(VIN_LDOx) stepping 3 V ↔ 3.5 V, TR = TF = 10 µs, IOUT = IOUT(max) 8
LDO current limit ISHORT(LDOx) 400 500 600 mA VOUT = 0 V 8
Output pulldown resistance, LDO RDIS_LDOx 150 250 350 Ω Regulator disabled 8
LDO overvoltage monitoring threshold (voltage rising) 106 108 110 % Voltage rising, compared to VOUT_LDO_DC 9
LDO undervoltage monitoring threshold (voltage falling) 90 92 94 % Voltage falling, compared to VOUT_LDO_DC 9
Nominal frequency, external clock fEXT_CLK 1 24 MHz Nominal frequency 9
Required accuracy of external clock from nominal frequency fEXT_CLK -30 10 % 9
Thermal warning, TDIE_WARN_LEVEL = 0 115 125 135 °C Temperature rising 9
Thermal warning, TDIE_WARN_LEVEL = 1 127 137 147 °C Temperature rising 9
Thermal shutdown 140 150 160 °C Temperature rising 9
VANA overvoltage threshold, voltage rising VANAOVP 5.6 5.8 6.1 V Voltage rising 9
VANA undervoltage lockout, voltage rising VANAUVLO 2.51 2.63 2.75 V Voltage rising 9
Buck short-circuit detection threshold 280 360 440 mV 9
LDO short-circuit detection threshold 190 300 450 mV 9
Load current measurement range, maximum code 10.22 A Maximum code 9
Hysteresis of Schmitt-trigger digital inputs VHYS 10 80 200 mV 10

CAD (KiCad official)

  • Symbol: LP87334ARHDRQ1
  • Footprint: Package_DFN_QFN:QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
  • 3D model: VQFN-28(5x5) (KiCad packages3D, STEP)
  • 3D model files: lp87334arhdrq1-etched.step / lp87334arhdrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp87334arhdrq1.step / lp87334arhdrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (87 pp, sha256 5c54b6621e0847f2, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF