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LP6470B6F

LOWPOWER · DC-DC Converters · SOT-23-6

LP6470B6F from LOWPOWER, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the converter.
2 SW output Switch-mode connection to the inductor, tied to the drains of the internal main and synchronous power MOSFETs.
3 VIN power_in Voltage supply input, rated 3.5V to 16V with undervoltage lockout at 3.3V and overvoltage protection at 18V.
4 FB input Feedback input that connects to the center point of the external resistor divider, with a normal voltage of 0.8V.
5 EN input Enable control input: drive above 1.8V to turn the channel on and below 0.4V to turn it off.
6 BS passive High-side gate drive boost input; connect a 0.01uF or greater capacitor from SW to BS to power the high-side switch.

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package SOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 3.5 16 V 4
Output Voltage Range VOUT 0.8 12 V 4
Quiescent Current IQ 450 900 µA VFB=0.9V 4
Shutdown Current ISHDN 6 µA VEN=GND 4
Feedback Threshold Voltage Accuracy VFB 0.784 0.8 0.816 V 16V>VIN>4.5V 4
Maximal duty cycle DMAX 95 % 4
Enable Threshold Low VEN(L) 0.4 V 4
Enable Threshold High VEN(H) 1.8 V 4
Input voltage to GND VIN -0.3 24 V 3
SW voltage to GND -0.3 24 V 3
BS voltage to GND -0.3 24 V 3
VEN voltage to GND VEN -0.3 24 V 3
VFB voltage to GND VFB -0.3 6.5 V 3
Maximum Junction Temperature 150 ℃ 3
Storage Temperature -45 165 ℃ 3
Operating Ambient Temperature Range -40 85 ℃ 3
Maximum Soldering Temperature 260 ℃ at leads, 10 sec 3
Maximum Power Dissipation PD 0.45 W SOT23-6, TA=25℃ 3
Thermal Resistance θJA 250 ℃/W SOT23-6 3

CAD (KiCad official)

  • Symbol: LP6470B6F
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: lp6470b6f-etched.step / lp6470b6f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp6470b6f.step / lp6470b6f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (10 pp, sha256 b4974f0a48f6bf32, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF