main
History Download
Ray Publish 0.1.0 f878d70 21d ago

LP6261B6F

LOWPOWER · DC-DC Converters · SOT-23-6

LP6261B6F from LOWPOWER, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT power_out Voltage output pin of the boost converter; the datasheet gives VOUT to GND as an absolute maximum of 8V.
2 GND power_in Ground pin; the datasheet gives VIN and EN to GND, VOUT to GND and SW to GND absolute maximum ratings of 6.5V, 8V and 10V respectively.
3 EN input Chip enable: logic high enables the device and logic low disables it, with EN input low at 0.3V max and high at 1.4V min, and it must not be left floating.
4 VIN power_in Voltage supply input pin; VIN to GND absolute maximum is 6.5V.
5 NC unconnected No connect on the LP6261 (B6F, fixed 5.1V) variant; this pin is the FB feedback pin (feedback voltage 1.36V) only on the LP6261A (AB6F) variant.
6 SW output Switching pin of the boost converter; SW to GND absolute maximum is 10V.

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package SOT-23-6
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage LP6261B6F 5 5.1 5.2 V 4
Supply Voltage 1 5 V 4
Supply Current (Shutdown) 0.05 1 uA VEN=0V, VIN=5V 4
Input UVLO 0.8 V IOUT=1mA 4
Supply Current 1 uA VEN=High, VIN=5V, No load 4
Switching Frequency 1200 KHz 4
EN Input Low Voltage 0.3 V 4
EN Input High Voltage 1.4 V 4
EN Input Current 0.1 uA VEN=5V 4
Low-side Current Limit 1 A VIN=3.5V 4
Start-up Current Limit 1 A 4
High-side On Resistance 160 mΩ IDS=-100mA 4
Low-side On Resistance 220 mΩ IDS=100mA 4
Thermal Shutdown 150 ℃ 4
Thermal Shutdown Hysteresis 25 ℃ 4
VIN and EN to GND 6.5 V 3
VOUT to GND 8 V 3
SW to GND 10 V 3
Maximum Junction Temperature 150 °C 3
Operating Ambient Temperature Range (TA) TA -40 85 ℃ 3
Maximum Soldering Temperature 260 °C at leads, 10 sec 3
ESD HBM (Human Body Model) 2 KV 3
ESD MM (Machine Model) 200 V 3
Maximum Power Dissipation (SOT23-6) PD 0.45 W SOT23-6, TA=25℃ 3
Thermal Resistance (SOT23-6) JA 250 ℃/W SOT23-6 3

CAD (KiCad official)

  • Symbol: LP6261B6F
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: lp6261b6f-etched.step / lp6261b6f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp6261b6f.step / lp6261b6f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (7 pp, sha256 1d622aaf0aeb09f6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF