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Contents

README

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LP6230BMSF

LOWPOWER · DC-DC Converters · MSOP-8

LP6230BMSF from LOWPOWER, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 FB input Regulation feedback input; connect to an external resistive divider from the output to FB to set the output voltage (0.6V feedback reference).
3 EN input Regulator on/off control input; logic high (VEN>1.4V) turns on the regulator, logic low (VEN<0.4V) puts it into low current shutdown mode.
4 GND power_in Ground.
5 SW passive Switching pin connected to the internal power MOSFET (rated 22V to GND).
6 VIN power_in Power supply pin; supply input voltage range 2.2V to 6V.
7 NC unconnected No connection.
8 NC unconnected No connection.

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package MSOP-8
Category Power Management ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage 2.2 6 V VIN=3.3V, VOUT=5V, CIN=10uF, COUT=22uF, L=4.7uH, R1=110K, R2=15K 4
Output Voltage Range 2.5 18 V 4
Supply Current (Shutdown) 0.5 1 μA VEN=VOUT=0V, VSW=5V 4
Maximum Duty Cycle 85 90 % 4
EN Input Low Voltage 0.4 V 4
EN Input High Voltage 1.4 V 4
Supply Input Voltage 2.2 6 V 3
EN Input Voltage 0 5.5 V 3
Input to GND -0.3 8 V 3
SW Pin to GND 22 V 3
Other Pin to GND (VFB, VEN) 6 V 3
Operation Junction Temperature 150 ℃ 3
Operation Ambient Temperature Range -40 85 ℃ 3
Lead Temperature 260 ℃ Soldering, 10 sec. 3
Maximum Power Dissipation PD 900 mW MSOP8, TA=25℃ 3
Thermal Resistance θJA 165 ℃/W 3
Supply Current 150 μA VFB=0.8V 4
Feedback Voltage VFB 0.6 V 4
Feedback Input Current 50 nA 4
Switching Frequency 1 MHz 4
Low-side Current Limit 2.4 A 4
High-side On Resistance 160 mΩ VOUT=3.3V 4
Mosfet voltage 22 V 4

CAD (KiCad official)

  • Symbol: LP6230BMSF
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: lp6230bmsf-etched.step / lp6230bmsf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp6230bmsf.step / lp6230bmsf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (7 pp, sha256 2aaa74c24086eafa, retrieved 2026-10-30, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF