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Contents

README

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LP5910-1.8DRVT

Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · WSON-6-EP(2x2)

LP5910-1.8DRVT from Texas Instruments, in a WSON-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Voltage output; a 1-µF low-ESR capacitor must be connected from this pin to the GND pin, and the output connects to the load circuit.
2 NC unconnected No internal connection; connect to ground or leave open.
3 NC unconnected No internal connection; connect to ground or leave open.
4 EN input Enable input; the regulator is disabled when logic low and enabled when logic high, with an internal 1-MΩ pull-down resistor to ground.
5 GND power_in Common ground; the exposed thermal pad must be connected to this same ground potential and to no other potential.
6 IN power_in Voltage supply input; a 1-µF capacitor must be connected at this input.
7 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-6-EP(2x2)
Category Power Management (PMIC)
Pins 7

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage tolerance ΔVOUT -2 2 %VOUT VIN = (VOUT(NOM) + 0.5 V) to 3.3 V, IOUT = 1 mA to 300 mA 5
Input voltage absolute maximum VIN -0.3 3.6 V 4
Output voltage absolute maximum VOUT -0.3 3.6 V 4
Enable input voltage absolute maximum VEN -0.3 3.6 V 4
Electrostatic discharge HBM V(ESD) -1000 1000 V Human-body model, per ANSI/ESDA/JEDEC JS-001 4
Electrostatic discharge CDM V(ESD) -250 250 V Charged-device model, per JEDEC JESD22-C101 4
Storage temperature Tstg -65 150 °C 4
Junction temperature absolute maximum TJ(MAX) 150 °C 4
Input voltage VIN 1.3 3.3 V 4
Output voltage VOUT 0.8 2.3 V 4
Enable input voltage VEN 0 3.3 V 4
Output current IOUT 0 300 mA 4
Junction temperature TJ -40 125 °C 4
Ambient temperature TA -40 85 °C 4
Load current ILOAD 0 300 mA See note (4) 5
Dropout voltage 1.8 V <= VOUT <= 2.3 V VDO 145 220 mV IOUT = 300 mA, WSON only 5
Output current limit ILIMIT 450 mA VOUT = VOUT(NOM) - 0.1 V, VIN = VOUT(NOM) + 0.5 V 5
Output reverse current IRO -20 0 µA VOUT = 3.3 V, VIN = VEN = 0 V, VOUT > VIN 5
Output reverse current IRO 0 50 µA VOUT = 3.3 V, VIN = VEN = 1.3 V, VOUT > VIN 5
EN low threshold (Off) VIL 0.3 V VIN = 1.3 V to 3.3 V 6
EN high threshold (On) VIH 1 V 6
Line transient, rising input ΔVOUT 0 1 mV VIN = (VOUT(NOM) + 0.5 V) to (VOUT(NOM) + 1 V) in 30 µs, IOUT = 1 mA 6
Line transient, falling input ΔVOUT -1 0 mV VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 0.5 V) in 30 µs, IOUT = 1 mA 6
Load transient, load step up ΔVOUT -45 mV IOUT = 1 mA to 100 mA in 10 µs 6
Load transient, load step down ΔVOUT 45 mV IOUT = 100 mA to 1 mA in 10 µs 6
Output voltage tolerance (line regulation) 0.01 %/V VIN = (VOUT(NOM) + 0.5 V) to 3.3 V, IOUT = 1 mA 5
Load regulation 0.002 %/mA IOUT = 1 mA to 300 mA 5
Quiescent current IQ 12 25 µA VEN = 1 V, IOUT = 0 mA 5
Quiescent current at full load IQ 230 350 µA VEN = 1 V, IOUT = 300 mA 5
Quiescent current in shutdown IQ(SD) 0.02 2 µA VEN = 0.3 V, -40°C <= TJ <= 85°C 5
Ground current IG 15 µA IOUT = 0 mA (VOUT = 2.3 V) 5
Output noise voltage eN 12 µVRMS BW = 10 Hz to 100 kHz, IOUT = 300 mA 6
Thermal shutdown TSD 160 °C TJ rising until output is OFF 6
Thermal hysteresis 15 °C TJ falling from shutdown 6
Power supply rejection ratio at 100 Hz PSRR 80 dB f = 100 Hz, IOUT = 20 mA, VOUT >= 1 V 6
Power supply rejection ratio at 1 kHz PSRR 75 dB f = 1 kHz, IOUT = 20 mA, VOUT >= 1 V 6
Power supply rejection ratio at 10 kHz PSRR 65 dB f = 10 kHz, IOUT = 20 mA, VOUT >= 1 V 6
Power supply rejection ratio at 100 kHz PSRR 40 dB f = 100 kHz, IOUT = 20 mA, VOUT >= 1 V 6
Power supply rejection ratio at 2 MHz PSRR 25 dB f = 2 MHz, IOUT = 20 mA, VOUT >= 1 V 6
Overshoot on start-up 5 % 6
Turnon time tON 80 200 µs From VEN > VIH to VOUT = 95% of VOUT(NOM) 6
Output discharge pulldown resistance RAD 160 Ω VEN = 0 V, VIN = 2.3 V 6
Junction-to-ambient thermal resistance RθJA 79.2 °C/W WSON (DRV), High-K PCB 5
Junction-to-case (top) thermal resistance RθJC(top) 110.2 °C/W WSON (DRV) 5
Junction-to-board thermal resistance RθJB 48.7 °C/W WSON (DRV) 5
Junction-to-top characterization parameter ψJT 5.2 °C/W WSON (DRV) 5
Junction-to-board characterization parameter ψJB 49.1 °C/W WSON (DRV) 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 18.1 °C/W WSON (DRV) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper GND pin using as wide and as short of a copper trace as is practical. 18

CAD (KiCad official)

  • Symbol: LP5910-1.8DRVT
  • Footprint: Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
  • 3D model: WSON-6-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: lp5910-1-8drvt-etched.step / lp5910-1-8drvt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp5910-1-8drvt.step / lp5910-1-8drvt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (31 pp, sha256 43abbb31e587c156, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF