component
LP5868RKPR
Public Made by Adomby adom
TEXAS INSTRUMENTS Global Sourcing Parts, VQFN-40(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
LP5868RKPR
TEXAS INSTRUMENTS · Global Sourcing Parts · VQFN-40(5x5)
LP5868RKPR from TEXAS INSTRUMENTS, in a VQFN-40(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS0 | output | Current sink 0; must be left floating if not used. |
| 2 | CS1 | output | Current sink 1; must be left floating if not used. |
| 3 | CS2 | output | Current sink 2; must be left floating if not used. |
| 4 | CS3 | output | Current sink 3; must be left floating if not used. |
| 5 | CS4 | output | Current sink 4; must be left floating if not used. |
| 6 | CS5 | output | Current sink 5; must be left floating if not used. |
| 7 | CS6 | output | Current sink 6; must be left floating if not used. |
| 8 | CS7 | output | Current sink 7; must be left floating if not used. |
| 9 | CS8 | output | Current sink 8; must be left floating if not used. |
| 10 | SW0 | output | High-side PMOS switch output for scan line 0; must be left floating if not used. |
| 11 | SW1 | output | High-side PMOS switch output for scan line 1; must be left floating if not used. |
| 12 | SW2 | output | High-side PMOS switch output for scan line 2; must be left floating if not used. |
| 13 | SW3 | output | High-side PMOS switch output for scan line 3; must be left floating if not used. |
| 14 | SW4 | output | High-side PMOS switch output for scan line 4; must be left floating if not used. |
| 15 | SW5 | output | High-side PMOS switch output for scan line 5; must be left floating if not used. |
| 16 | VLED | power_in | Power input for high-side switches; supply range 2.7 V to 5.5 V. |
| 17 | SW6 | output | High-side PMOS switch output for scan line 6; must be left floating if not used. |
| 18 | SW7 | output | High-side PMOS switch output for scan line 7; must be left floating if not used. |
| 19 | NC | unconnected | No internal connection. |
| 20 | NC | unconnected | No internal connection. |
| 21 | NC | unconnected | No internal connection. |
| 22 | CS9 | output | Current sink 9; must be left floating if not used. |
| 23 | CS10 | output | Current sink 10; must be left floating if not used. |
| 24 | CS11 | output | Current sink 11; must be left floating if not used. |
| 25 | CS12 | output | Current sink 12; must be left floating if not used. |
| 26 | CS13 | output | Current sink 13; must be left floating if not used. |
| 27 | CS14 | output | Current sink 14; must be left floating if not used. |
| 28 | CS15 | output | Current sink 15; must be left floating if not used. |
| 29 | CS16 | output | Current sink 16; must be left floating if not used. |
| 30 | CS17 | output | Current sink 17; must be left floating if not used. |
| 31 | AGND | power_in | Analog ground; must be connected to the exposed thermal pad and common ground plane. |
| 32 | VCAP | power_out | Internal LDO output; a 1-µF capacitor must be connected between this pin and GND, placed as close to the device as possible. |
| 33 | IFS | input | Interface type select: I2C when low, SPI when high; a resistor must be connected between VIO and this pin. |
| 34 | VSYNC | input | External synchronize signal for display mode 2 and mode 3. |
| 35 | SCL_SCLK | input | I2C clock input or SPI clock input; pull up to VIO when configured as I2C. |
| 36 | SDA_MOSI | bidirectional | I2C data input/output or SPI leader output/follower input; pull up to VIO when configured as I2C. |
| 37 | ADDR0_MISO | bidirectional | I2C address select 0 or SPI leader input/follower output. |
| 38 | ADDR1_SS | input | I2C address select 1 or SPI follower select. |
| 39 | VIO_EN | power_in | Power supply for digital circuits and chip enable; a 1-nF capacitor must be connected between this pin and GND, placed as close to the device as possible. |
| 40 | VCC | power_in | Power supply for device; a 1-µF capacitor must be connected between this pin and GND, placed as close to the device as possible. |
| 41 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | VQFN-40(5x5) |
| Category | Global Sourcing Parts |
| Pins | 41 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Voltage on VCC / VLED / VIO / EN / CS / SW / SDA / SCL / SCLK / MOSI / MISO / SS / ADDR0 / ADDR1 / VSYNC / IFS | -0.3 | 6 | V | 6 | |||
| Voltage on VCAP | -0.3 | 2 | V | 6 | |||
| Junction temperature | TJ | -55 | 150 | °C | 6 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| Input voltage on VCC (supply voltage) | VCC | 2.7 | 5.5 | V | 6 | ||
| Input voltage on VLED (LED supply voltage) | VLED | 2.7 | 5.5 | V | 6 | ||
| Input voltage on VIO_EN | VIO_EN | 1.65 | 5.5 | V | 6 | ||
| Operating ambient temperature | TA | -40 | 85 | °C | 6 | ||
| Constant current sink output range (CS0, CS17) | ICS | 0.1 | 40 | mA | 2.7 <= VCC < 3.3V, PWM = 100% | 7 | |
| Constant current sink output range (CS0, CS17) | ICS | 0.1 | 50 | mA | VCC >= 3.3V PWM = 100% | 7 | |
| Device to device current error | IERR_DD | -7 | 7 | % | All channels ON. Current set to 0.1 mA. MC = 0 CC = 42 DC = 25 PWM = 100% | 7 | |
| Device to device current error | IERR_DD | -5 | 5 | % | All channels ON. Current set to 1 mA. MC = 2 CC = 127 DC = 25 PWM = 100% | 7 | |
| Device to device current error | IERR_DD | -3.5 | 3.5 | % | All channels ON. Current set to 10 mA. MC = 2 CC = 127 DC = 255 PWM = 100% | 7 | |
| Device to device current error | IERR_DD | -3 | 3 | % | All channels ON. Current set to 50 mA. MC = 7 CC = 127 DC = 255 PWM = 100% | 7 | |
| Channel to channel current error | IERR_CC | -5.5 | 5.5 | % | All channels ON. Current set to 0.1 mA. MC = 0 CC = 42 DC = 25 PWM = 100% | 7 | |
| Channel to channel current error | IERR_CC | -5 | 5 | % | All channels ON. Current set to 1 mA. MC = 2 CC = 127 DC = 25 PWM = 100% | 7 | |
| Channel to channel current error | IERR_CC | -4 | 4 | % | All channels ON. Current set to 10 mA. MC = 2 CC = 127 DC = 255 PWM = 100% | 7 | |
| Channel to channel current error | IERR_CC | -3.5 | 3.5 | % | All channels ON. Current set to 25 mA. MC = 7 CC = 64 DC = 255 PWM = 100% | 7 | |
| Channel to channel current error | IERR_CC | -3 | 3 | % | All channels ON. Current set to 50 mA. MC = 7 CC = 127 DC = 255 PWM = 100% | 7 | |
| VVIO VIO supply voltage | VVIO | 1.65 | 5.5 | V | 7 | ||
| Shutdown supply current | ISHUTDOWN | 0.1 | 1 | µA | VEN = 0V, CHIP_EN = 0 (bit), measure the total current from VCC and VLED | 7 | |
| Standby supply current | ISTANDBY | 5.5 | 10 | µA | VEN = 3.3V, CHIP_EN = 0 (bit), measure the total current from VCC and VLED | 7 | |
| Active mode supply current | INORMAL | 4.3 | 6 | mA | VEN = 3.3V, CHIP_EN = 1 (bit), all channels IOUT = 5 mA (MC = 1, CC = 127, DC = 256), measure the current from VCC | 7 | |
| Leakage current (CS0, CS17) | ILKG | 0.1 | 1 | µA | channels off, up_deghost = 0, VCS=5V | 7 | |
| High-side PMOS ON resistance | RSW | 450 | 550 | mΩ | VLED = 2.7 V, ISW = 200 mA | 8 | |
| High-side PMOS ON resistance | RSW | 380 | 500 | mΩ | VLED = 3.8 V, ISW = 200mA | 8 | |
| High-side PMOS ON resistance | RSW | 310 | 450 | mΩ | VLED = 5 V, ISW = 200 mA | 8 | |
| Output saturation voltage | VSAT | 0.45 | V | IOUT = 50mA, decreasing output voltage, when the LED current has dropped 5% | 8 | ||
| Output saturation voltage | VSAT | 0.4 | V | IOUT = 30mA, decreasing output voltage, when the LED current has dropped 5% | 8 | ||
| Output saturation voltage | VSAT | 0.35 | V | IOUT = 10mA, decreasing output voltage, when the LED current has dropped 5% | 8 | ||
| Low-level input voltage of EN | VEN_IL | 0.4 | V | 8 | |||
| High-level input voltage of EN | VEN_IH | 1.4 | V | When VCAP powered up | 8 | ||
| Input current, SDA, SCL, SCLK, MOSI, SS, ADDRx | ILOGIC_I | -1 | 1 | µA | 8 | ||
| Low-level output voltage, SDA, MISO | VLOGIC_OL | 0.4 | V | IPULLUP = 3 mA | 8 | ||
| Undervoltage restart | VUVR | 2.5 | V | VCC rising, Test mode | 7 | ||
| Undervoltage shutdown | VUVF | 1.9 | V | VCC falling, Test mode | 7 | ||
| Undervoltage shutdown hysteresis | VUV_HYS | 0.3 | V | 7 | |||
| Internal LDO output | VCAP | 1.78 | V | VCC = 2.7V to 5.5V | 7 | ||
| VIO supply current | IVIO | 5 | µA | Interface idle | 7 | ||
| LED PWM frequency | fPWM | 62.5 | KHz | PWM_Fre = 1, PWM = 100% | 7 | ||
| LED PWM frequency | fPWM | 125 | KHz | PWM_Fre = 0, PWM = 100% | 7 | ||
| Thershold for channel open detection | VLOD_TH | 0.25 | V | 8 | |||
| Thermal-shutdown junction temperature | TTSD | 150 | °C | 8 | |||
| Thermal shutdown temperature hysteresis | THYS | 15 | °C | 8 | |||
| Junction-to-ambient thermal resistance | RθJA | 31.4 | °C/W | 6 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 22.9 | °C/W | 6 | |||
| Junction-to-board thermal resistance | RθJB | 12 | °C/W | 6 | |||
| Junction-to-top characterization parameter | ΨJT | 0.3 | °C/W | 6 | |||
| Junction-to-board characterization parameter | ΨJB | 12 | °C/W | 6 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 3.5 | °C/W | 6 | |||
| Internal oscillator frequency | fOSC | 31.2 | MHz | 8 | |||
| Device to device oscillator frequency error | fOSC_ERR | -3 | 3 | % | 8 | ||
| Wait time from UVLO disactive to device NORMAL | tPOR_H | 500 | µs | 8 | |||
| Wait time from setting Chip_EN (Register) =1 to device NORMAL | tCHIP_EN | 100 | µs | 8 | |||
| LED output rise time | tRISE | 10 | ns | 8 | |||
| LED output fall time | tFALL | 15 | ns | 8 | |||
| The minimum high-level pulse width of VSYNC | tVSYNC_H | 200 | µs | 8 | |||
| SPI Clock frequency | fSCLK | 12 | MHz | 9 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | possible. GND plane connections to CVLED and GND pins must be on the TOP layer copper with multiple vias | 47 |
CAD (KiCad official)
- Symbol:
LP5868RKPR - Footprint:
Package_DFN_QFN:QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm - 3D model: VQFN-40(5x5) (KiCad packages3D, STEP)
- 3D model files:
lp5868rkpr-etched.step/lp5868rkpr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lp5868rkpr.step/lp5868rkpr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TEXAS INSTRUMENTS datasheet (56 pp, sha256
1af4cf028d736334, retrieved 2026-11-02, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# LP5868RKPR
**TEXAS INSTRUMENTS** · Global Sourcing Parts · VQFN-40(5x5)
LP5868RKPR from TEXAS INSTRUMENTS, in a VQFN-40(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS0 | output | Current sink 0; must be left floating if not used. |
| 2 | CS1 | output | Current sink 1; must be left floating if not used. |
| 3 | CS2 | output | Current sink 2; must be left floating if not used. |
| 4 | CS3 | output | Current sink 3; must be left floating if not used. |
| 5 | CS4 | output | Current sink 4; must be left floating if not used. |
| 6 | CS5 | output | Current sink 5; must be left floating if not used. |
| 7 | CS6 | output | Current sink 6; must be left floating if not used. |
| 8 | CS7 | output | Current sink 7; must be left floating if not used. |
| 9 | CS8 | output | Current sink 8; must be left floating if not used. |
| 10 | SW0 | output | High-side PMOS switch output for scan line 0; must be left floating if not used. |
| 11 | SW1 | output | High-side PMOS switch output for scan line 1; must be left floating if not used. |
| 12 | SW2 | output | High-side PMOS switch output for scan line 2; must be left floating if not used. |
| 13 | SW3 | output | High-side PMOS switch output for scan line 3; must be left floating if not used. |
| 14 | SW4 | output | High-side PMOS switch output for scan line 4; must be left floating if not used. |
| 15 | SW5 | output | High-side PMOS switch output for scan line 5; must be left floating if not used. |
| 16 | VLED | power_in | Power input for high-side switches; supply range 2.7 V to 5.5 V. |
| 17 | SW6 | output | High-side PMOS switch output for scan line 6; must be left floating if not used. |
| 18 | SW7 | output | High-side PMOS switch output for scan line 7; must be left floating if not used. |
| 19 | NC | unconnected | No internal connection. |
| 20 | NC | unconnected | No internal connection. |
| 21 | NC | unconnected | No internal connection. |
| 22 | CS9 | output | Current sink 9; must be left floating if not used. |
| 23 | CS10 | output | Current sink 10; must be left floating if not used. |
| 24 | CS11 | output | Current sink 11; must be left floating if not used. |
| 25 | CS12 | output | Current sink 12; must be left floating if not used. |
| 26 | CS13 | output | Current sink 13; must be left floating if not used. |
| 27 | CS14 | output | Current sink 14; must be left floating if not used. |
| 28 | CS15 | output | Current sink 15; must be left floating if not used. |
| 29 | CS16 | output | Current sink 16; must be left floating if not used. |
| 30 | CS17 | output | Current sink 17; must be left floating if not used. |
| 31 | AGND | power_in | Analog ground; must be connected to the exposed thermal pad and common ground plane. |
| 32 | VCAP | power_out | Internal LDO output; a 1-µF capacitor must be connected between this pin and GND, placed as close to the device as possible. |
| 33 | IFS | input | Interface type select: I2C when low, SPI when high; a resistor must be connected between VIO and this pin. |
| 34 | VSYNC | input | External synchronize signal for display mode 2 and mode 3. |
| 35 | SCL_SCLK | input | I2C clock input or SPI clock input; pull up to VIO when configured as I2C. |
| 36 | SDA_MOSI | bidirectional | I2C data input/output or SPI leader output/follower input; pull up to VIO when configured as I2C. |
| 37 | ADDR0_MISO | bidirectional | I2C address select 0 or SPI leader input/follower output. |
| 38 | ADDR1_SS | input | I2C address select 1 or SPI follower select. |
| 39 | VIO_EN | power_in | Power supply for digital circuits and chip enable; a 1-nF capacitor must be connected between this pin and GND, placed as close to the device as possible. |
| 40 | VCC | power_in | Power supply for device; a 1-µF capacitor must be connected between this pin and GND, placed as close to the device as possible. |
| 41 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | VQFN-40(5x5) |
| Category | Global Sourcing Parts |
| Pins | 41 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Voltage on VCC / VLED / VIO / EN / CS / SW / SDA / SCL / SCLK / MOSI / MISO / SS / ADDR0 / ADDR1 / VSYNC / IFS | | -0.3 | | 6 | V | | 6 |
| Voltage on VCAP | | -0.3 | | 2 | V | | 6 |
| Junction temperature | TJ | -55 | | 150 | °C | | 6 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 6 |
| Input voltage on VCC (supply voltage) | VCC | 2.7 | | 5.5 | V | | 6 |
| Input voltage on VLED (LED supply voltage) | VLED | 2.7 | | 5.5 | V | | 6 |
| Input voltage on VIO_EN | VIO_EN | 1.65 | | 5.5 | V | | 6 |
| Operating ambient temperature | TA | -40 | | 85 | °C | | 6 |
| Constant current sink output range (CS0, CS17) | ICS | 0.1 | | 40 | mA | 2.7 <= VCC < 3.3V, PWM = 100% | 7 |
| Constant current sink output range (CS0, CS17) | ICS | 0.1 | | 50 | mA | VCC >= 3.3V PWM = 100% | 7 |
| Device to device current error | IERR_DD | -7 | | 7 | % | All channels ON. Current set to 0.1 mA. MC = 0 CC = 42 DC = 25 PWM = 100% | 7 |
| Device to device current error | IERR_DD | -5 | | 5 | % | All channels ON. Current set to 1 mA. MC = 2 CC = 127 DC = 25 PWM = 100% | 7 |
| Device to device current error | IERR_DD | -3.5 | | 3.5 | % | All channels ON. Current set to 10 mA. MC = 2 CC = 127 DC = 255 PWM = 100% | 7 |
| Device to device current error | IERR_DD | -3 | | 3 | % | All channels ON. Current set to 50 mA. MC = 7 CC = 127 DC = 255 PWM = 100% | 7 |
| Channel to channel current error | IERR_CC | -5.5 | | 5.5 | % | All channels ON. Current set to 0.1 mA. MC = 0 CC = 42 DC = 25 PWM = 100% | 7 |
| Channel to channel current error | IERR_CC | -5 | | 5 | % | All channels ON. Current set to 1 mA. MC = 2 CC = 127 DC = 25 PWM = 100% | 7 |
| Channel to channel current error | IERR_CC | -4 | | 4 | % | All channels ON. Current set to 10 mA. MC = 2 CC = 127 DC = 255 PWM = 100% | 7 |
| Channel to channel current error | IERR_CC | -3.5 | | 3.5 | % | All channels ON. Current set to 25 mA. MC = 7 CC = 64 DC = 255 PWM = 100% | 7 |
| Channel to channel current error | IERR_CC | -3 | | 3 | % | All channels ON. Current set to 50 mA. MC = 7 CC = 127 DC = 255 PWM = 100% | 7 |
| VVIO VIO supply voltage | VVIO | 1.65 | | 5.5 | V | | 7 |
| Shutdown supply current | ISHUTDOWN | | 0.1 | 1 | µA | VEN = 0V, CHIP_EN = 0 (bit), measure the total current from VCC and VLED | 7 |
| Standby supply current | ISTANDBY | | 5.5 | 10 | µA | VEN = 3.3V, CHIP_EN = 0 (bit), measure the total current from VCC and VLED | 7 |
| Active mode supply current | INORMAL | | 4.3 | 6 | mA | VEN = 3.3V, CHIP_EN = 1 (bit), all channels IOUT = 5 mA (MC = 1, CC = 127, DC = 256), measure the current from VCC | 7 |
| Leakage current (CS0, CS17) | ILKG | | 0.1 | 1 | µA | channels off, up_deghost = 0, VCS=5V | 7 |
| High-side PMOS ON resistance | RSW | | 450 | 550 | mΩ | VLED = 2.7 V, ISW = 200 mA | 8 |
| High-side PMOS ON resistance | RSW | | 380 | 500 | mΩ | VLED = 3.8 V, ISW = 200mA | 8 |
| High-side PMOS ON resistance | RSW | | 310 | 450 | mΩ | VLED = 5 V, ISW = 200 mA | 8 |
| Output saturation voltage | VSAT | | 0.45 | | V | IOUT = 50mA, decreasing output voltage, when the LED current has dropped 5% | 8 |
| Output saturation voltage | VSAT | | 0.4 | | V | IOUT = 30mA, decreasing output voltage, when the LED current has dropped 5% | 8 |
| Output saturation voltage | VSAT | | 0.35 | | V | IOUT = 10mA, decreasing output voltage, when the LED current has dropped 5% | 8 |
| Low-level input voltage of EN | VEN_IL | | | 0.4 | V | | 8 |
| High-level input voltage of EN | VEN_IH | 1.4 | | | V | When VCAP powered up | 8 |
| Input current, SDA, SCL, SCLK, MOSI, SS, ADDRx | ILOGIC_I | -1 | | 1 | µA | | 8 |
| Low-level output voltage, SDA, MISO | VLOGIC_OL | | | 0.4 | V | IPULLUP = 3 mA | 8 |
| Undervoltage restart | VUVR | | 2.5 | | V | VCC rising, Test mode | 7 |
| Undervoltage shutdown | VUVF | | 1.9 | | V | VCC falling, Test mode | 7 |
| Undervoltage shutdown hysteresis | VUV_HYS | | 0.3 | | V | | 7 |
| Internal LDO output | VCAP | | 1.78 | | V | VCC = 2.7V to 5.5V | 7 |
| VIO supply current | IVIO | | 5 | | µA | Interface idle | 7 |
| LED PWM frequency | fPWM | | 62.5 | | KHz | PWM_Fre = 1, PWM = 100% | 7 |
| LED PWM frequency | fPWM | | 125 | | KHz | PWM_Fre = 0, PWM = 100% | 7 |
| Thershold for channel open detection | VLOD_TH | | 0.25 | | V | | 8 |
| Thermal-shutdown junction temperature | TTSD | | 150 | | °C | | 8 |
| Thermal shutdown temperature hysteresis | THYS | | 15 | | °C | | 8 |
| Junction-to-ambient thermal resistance | RθJA | | 31.4 | | °C/W | | 6 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 22.9 | | °C/W | | 6 |
| Junction-to-board thermal resistance | RθJB | | 12 | | °C/W | | 6 |
| Junction-to-top characterization parameter | ΨJT | | 0.3 | | °C/W | | 6 |
| Junction-to-board characterization parameter | ΨJB | | 12 | | °C/W | | 6 |
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | | 3.5 | | °C/W | | 6 |
| Internal oscillator frequency | fOSC | | 31.2 | | MHz | | 8 |
| Device to device oscillator frequency error | fOSC_ERR | -3 | | 3 | % | | 8 |
| Wait time from UVLO disactive to device NORMAL | tPOR_H | | 500 | | µs | | 8 |
| Wait time from setting Chip_EN (Register) =1 to device NORMAL | tCHIP_EN | | 100 | | µs | | 8 |
| LED output rise time | tRISE | | 10 | | ns | | 8 |
| LED output fall time | tFALL | | 15 | | ns | | 8 |
| The minimum high-level pulse width of VSYNC | tVSYNC_H | 200 | | | µs | | 8 |
| SPI Clock frequency | fSCLK | | | 12 | MHz | | 9 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | possible. GND plane connections to CVLED and GND pins must be on the TOP layer copper with multiple vias | 47 |
## CAD (KiCad official)
- Symbol: `LP5868RKPR`
- Footprint: `Package_DFN_QFN:QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm`
- 3D model: VQFN-40(5x5) (KiCad packages3D, STEP)
- 3D model files: `lp5868rkpr-etched.step` / `lp5868rkpr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lp5868rkpr.step` / `lp5868rkpr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TEXAS INSTRUMENTS datasheet](https://www.ti.com/cn/lit/gpn/lp5868) (56 pp, sha256 `1af4cf028d736334`, retrieved 2026-11-02, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/lp5868rkpr-datasheet.pdf)