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LP5861TRSMR

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TI(德州仪器) , VQFN-32-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LP5861TRSMR

TI(德州仪器) · IC · VQFN-32-EP(4x4)

LP5861TRSMR from TI(德州仪器), in a VQFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Device supply (2.7 V to 5.5 V); a 1 µF capacitor to GND must be placed as close to the device as possible.
2 CS0 output Current sink 0; can be left floating when not used.
3 CS1 output Current sink 1; can be left floating when not used.
4 CS2 output Current sink 2; can be left floating when not used.
5 CS3 output Current sink 3; can be left floating when not used.
6 CS4 output Current sink 4; can be left floating when not used.
7 CS5 output Current sink 5; can be left floating when not used.
8 CS6 output Current sink 6; can be left floating when not used.
9 CS7 output Current sink 7; can be left floating when not used.
10 CS8 output Current sink 8; can be left floating when not used.
11 NC unconnected No connect; this pin must be left floating.
12 NC unconnected No connect; this pin must be left floating.
13 NC unconnected No connect; this pin must be left floating.
14 NC unconnected No connect; this pin must be left floating.
15 VLED power_in Power supply input for the high-side switches (2.7 V to 5.5 V).
16 CS9 output Current sink 9; can be left floating when not used.
17 CS10 output Current sink 10; can be left floating when not used.
18 CS11 output Current sink 11; can be left floating when not used.
19 CS12 output Current sink 12; can be left floating when not used.
20 CS13 output Current sink 13; can be left floating when not used.
21 CS14 output Current sink 14; can be left floating when not used.
22 CS15 output Current sink 15; can be left floating when not used.
23 CS16 output Current sink 16; can be left floating when not used.
24 CS17 output Current sink 17; can be left floating when not used.
25 VCAP power_out Internal LDO output; a 1 µF capacitor to GND must be connected, placed as close to the device as possible.
26 IFS input Interface select: low selects I2C, high selects SPI; a resistor must be connected between VIO and this pin.
27 VSYNC input External synchronization signal for display modes 2 and 3.
28 SCL_SCLK input I2C clock input or SPI clock input; pulled up to VIO when configured as I2C.
29 SDA_MOSI bidirectional I2C data or SPI leader-output follower-input; pulled up to VIO when configured as I2C.
30 ADDR0_MISO bidirectional I2C address select 0 or SPI leader-input follower-output.
31 ADDR1_SS input I2C address select 1 or SPI follower select.
32 VIO_EN power_in Digital circuit supply (1.65 V to 5.5 V) and chip enable; a 1 nF capacitor to GND must be placed as close to the device as possible.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer TI(德州仪器)
Package VQFN-32-EP(4x4)
Category
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC/VLED/VIO/EN/CS/SW/SDA/SCL/SCLK/MOSI/MISO/SS/ADDR0/ADDR1/VSYNC/IFS voltage -0.3 6 V 6
VCAP voltage -0.3 2 V 6
Junction temperature TJ -55 150 °C 6
Storage temperature Tstg -65 150 °C 6
Supply voltage VCC 2.7 5.5 V 6
LED supply voltage VLED 2.7 5.5 V 6
VIO_EN input voltage VIO_EN 1.65 5.5 V 6
Operating ambient temperature TA -40 85 °C 6
Junction-to-ambient thermal resistance RθJA 32.9 °C/W RSM (VQFN) 32 pin 6
Junction-to-case (top) thermal resistance RθJC(top) 29.2 °C/W 6
Junction-to-board thermal resistance RθJB 12.3 °C/W 6
Junction-to-top characterization parameter ΨJT 0.4 °C/W 6
Junction-to-board characterization parameter ΨJB 12.3 °C/W 6
Junction-to-case (bottom) thermal resistance RθJC(bot) 3.7 °C/W 6
Device supply voltage VCC 2.7 5.5 V 7
Shutdown supply current ISHUTDOWN 0.1 1.5 µA VEN = 0, CHIP_EN = 0 (bit), ADDx = 0; total current from VCC and VLED 7
Standby supply current ISTANDBY 5.5 12 µA VEN = 3.3V, CHIP_EN = 0 (bit), total current from VCC and VLED 7
Normal mode supply current INORMAL 4.3 6 mA VEN = 3.3V, CHIP_EN = 1, all channels IOUT = 12.5mA (MC=1, CC=127, DC=256), current from VCC 7
LED supply voltage VLED 2.7 5.5 V 7
VIO supply voltage VVIO 1.65 5.5 V 7
VIO supply current IVIO 5 µA Interface idle 7
Current sink output range ICS 0.1 75 mA 2.7 <= VCC < 3.3V, PWM = 100% 7
Current sink output range ICS 0.1 125 mA VCC >= 3.3V, PWM = 100% 7
Leakage current (CS0-CS17) ILKG 0.1 1 µA Channel off, up_deghost = 0, VCS = 5V 7
Device-to-device current error IERR_DD -5 5 % All channels on, 1mA, MC=0, CC=17, DC=255, PWM=100% 7
Device-to-device current error IERR_DD -7 7 % All channels on, 125mA, MC=7, CC=127, DC=255, PWM=100% 7
Channel-to-channel current error IERR_CC -5 5 % All channels on, 1mA, MC=0, CC=17, DC=255, PWM=100% 7
Channel-to-channel current error IERR_CC -7 7 % All channels on, 125mA, MC=7, CC=127, DC=255, PWM=100% 7
Output saturation voltage VSAT 1 V IOUT = 125mA, lower output voltage until LED current drops 5% 8
Output saturation voltage VSAT 0.7 V IOUT = 100mA, lower output voltage until LED current drops 5% (LP5861TRSMR only) 8
Output saturation voltage VSAT 0.6 V IOUT = 75mA, lower output voltage until LED current drops 5% 8
Output saturation voltage VSAT 0.5 V IOUT = 25mA, lower output voltage until LED current drops 5% 8
Low-level input voltage VLOGIC_IL 0.3 V SDA, SCL, SCLK, MOSI, SS, ADDRx, VSYNC, IFS; printed as 0.3 x VIO (value is multiple of VIO) 8
High-level input voltage VLOGIC_IH 0.7 V SDA, SCL, SCLK, MOSI, SS, ADDRx, VSYNC, IFS; printed as 0.7 x VIO (value is multiple of VIO) 8
EN low-level input voltage VEN_IL 0.4 V 8
EN high-level input voltage VEN_IH 1.4 V When VCAP is powered 8
Input current ILOGIC_I -1 1 µA SDA, SCL, SCLK, MOSI, SS, ADDRx 8
Low-level output voltage VLOGIC_OL 0.4 V IPULLUP = 3mA, SDA, MISO 8
High-level output voltage VLOGIC_OH 0.7 V IPULLUP = -3mA, MISO; printed as 0.7 x VIO (value is multiple of VIO) 8
Oscillator frequency error device-to-device fOSC_ERR -3 3 % 8
Wait time from UVLO deactivation tPOR_H 500 µs 8
Wait time after Chip_EN = 1 tCHIP_EN 100 µs 8
VSYNC minimum high pulse width tVSYNC_H 200 µs 8
SPI clock frequency fSCL 12 MHz 8
Undervoltage restart VUVR 2.5 V VCC rising, test mode 7
Undervoltage shutdown VUVF 1.9 V VCC falling, test mode 7
Undervoltage shutdown hysteresis VUV_HYS 0.3 V 7
Internal LDO output VCAP 1.78 V VCC = 2.7V to 5.5V 7
LED PWM frequency fPWM 62.5 KHz PWM_Fre = 1 8
LED PWM frequency fPWM 125 KHz PWM_Fre = 0 8
Internal oscillator frequency fOSC 31.2 MHz 8
Open detection threshold VLOD_TH 0.25 V 8
Thermal shutdown junction temperature TTSD 150 °C 8

CAD (KiCad official)

  • Symbol: LP5861TRSMR
  • Footprint: Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
  • 3D model: VQFN-32-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: lp5861trsmr-etched.step / lp5861trsmr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp5861trsmr.step / lp5861trsmr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TI(德州仪器) datasheet (74 pp, sha256 057b471a08863cbb, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF