component
LP5310B3F
Public Made by Adomby adom
LOWPOWER Power Distribution Switches, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 17d ago |
| viewers | 17d ago |
| lp5310b3f-etched.glb | 17d ago |
| lp5310b3f-etched.step | 17d ago |
| lp5310b3f-hero.glb | 17d ago |
| lp5310b3f-hero.overlay.json | 17d ago |
| lp5310b3f.glb | 17d ago |
| lp5310b3f.kicad_mod | 17d ago |
| lp5310b3f.kicad_sym | 17d ago |
| lp5310b3f.lbr | 17d ago |
| lp5310b3f.step | 17d ago |
| package.json | 17d ago |
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| README.md | 17d ago |
LP5310B3F
LOWPOWER · Power Distribution Switches · SOT-23-3
LP5310B3F from LOWPOWER, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Power supply and input of the power switch, with a recommended input voltage of 3.0V to 5.5V, an absolute maximum of 36V to GND, and an over-voltage protection threshold of 6.05V (rising). |
| 2 | GND | power_in | Ground reference for the device. |
| 3 | OUT | power_out | Output of the power switch, with an absolute maximum of -0.3V to 7V to GND and a maximum output current of 1.5A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LOWPOWER |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage | 3 | 5.5 | V | 3 | |||
| Maximum of Output current | 1.5 | A | 3 | ||||
| Ambient Temperature | -40 | 85 | °C | 3 | |||
| VIN to GND | -0.3 | 36 | V | 3 | |||
| VOUT to GND | -0.3 | 7 | V | 3 | |||
| Maximum Junction Temperature (TA) | 150 | °C | 3 | ||||
| Maximum Soldering Temperature | 260 | °C | at leads, 10 seconds | 3 | |||
| ESD HBM (Human Body Model) | -8000 | 8000 | V | JEDEC JS-001 | 3 | ||
| ESD CDM (Charged Device Model) | -2000 | 2000 | V | JEDEC JS-002 | 3 | ||
| Maximum Power Dissipation (PD) | PD | 0.3 | W | TA <= 25℃ | 3 | ||
| Quiescent current | IQ | 50 | 65 | 80 | μA | VIN = 5V, OUT floating | 4 |
| Under-Voltage Lockout level (falling) | VUVLO_F | 2.85 | 2.95 | 3.05 | V | VIN voltage falling | 4 |
| Under-Voltage Lockout level (rising) | VUVLO_R | 3 | 3.1 | 3.2 | V | VIN voltage rising | 4 |
| Over-Voltage Protection level (falling) | VOVP_F | 5.85 | 5.95 | 6.05 | V | VIN voltage falling | 4 |
| Over-Voltage Protection level (rising) | VOVP_R | 5.95 | 6.05 | 6.15 | V | VIN voltage rising | 4 |
| Output auto discharge | RDIS | 400 | 500 | 600 | Ω | VIN = 5V, VEN = 0V | 4 |
| Load switch turned on delay | tDON | 12 | 16 | 20 | ms | VIN = 5V, ROUT = 100Ω, COUT = 22μF, time from enabled to VOUT = 0.5V | 4 |
| Output rising time | tR | 100 | 150 | 200 | μs | VIN = 5V, ROUT = 100Ω, COUT = 22μF, time from VOUT = 0.1×VIN to 0.9×VIN | 4 |
| Over-Voltage Protection response time | tOVP | 30 | 50 | ns | VIN rising from 5V with 30V/μs, ROUT = 100Ω, COUT = 0, time from VIN > VOVP_R to OUT voltage stop rising | 4 | |
| On-resistance | RDS(ON) | 270 | mΩ | VIN = 5V, IOUT=200mA, TA=25°C | 4 | ||
| Over current protection level | IOCP | 4 | A | VIN = 5V, TA=25°C | 4 | ||
| OCP qualification time | tOCP_QUAL | 150 | μs | VIN = 5V, TA = 25°C, qualification time from IOUT hits IOCP to switch turned off | 4 | ||
| Load switch turned off delay | tOFF | 10 | μs | VIN = 5V, ROUT = 500Ω, COUT = 0.1μF, time from disabled to VOUT = 0.9×VIN | 4 | ||
| Thermal shutdown trigger | TSD | 150 | °C | Temperature rising | 4 | ||
| Thermal shutdown release | TSD_REL | 130 | °C | Temperature falling | 4 | ||
| Thermal Resistance (θJA) | θJA | 400 | °C/W | 2S2P JEDEC standard PCB (Note 2) | 3 |
CAD (KiCad official)
- Symbol:
LP5310B3F - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
lp5310b3f-etched.step/lp5310b3f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lp5310b3f.step/lp5310b3f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LOWPOWER datasheet (10 pp, sha256
7a2246a2bafc1aa3, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).