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LP5309B3F
Public Made by Adomby adom
LOWPOWER(微源半导体) Power Distribution Switches, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLP5309B3F
LOWPOWER(微源半导体) · Power Distribution Switches · SOT-23
LP5309B3F from LOWPOWER(微源半导体), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Power supply and input of the power switch, tolerating up to 32V (absolute max) with over-voltage protection at 6V and under-voltage lockout at 2.7V. |
| 2 | GND | power_in | Ground. |
| 3 | VOUT | power_out | Output of the power switch, rated -0.3V to 7V to GND with an integrated output discharge. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LOWPOWER(微源半导体) |
| Package | SOT-23 |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN to GND | -0.3 | 32 | V | 3 | |||
| VOUT to GND | -0.3 | 7 | V | 3 | |||
| Maximum Junction Temperature (TA) | 150 | °C | 3 | ||||
| Maximum Soldering Temperature | 260 | °C | at leads, 10 seconds | 3 | |||
| Input Voltage | 3 | 5.5 | V | 3 | |||
| Output Current | 0 | 1.5 | A | 3 | |||
| Ambient Temperature | -40 | 85 | °C | 3 | |||
| Maximum Power Dissipation (PD) | PD | 0.6 | W | TA <= 25℃ | 3 | ||
| Thermal Resistance (θJA) | θJA | 203 | °C/W | 2S2P JEDEC standard PCB (Note 2) | 3 | ||
| ESD HBM (Human Body Model, JEDEC JS-001) | -4000 | 4000 | V | JEDEC JS-001 | 3 | ||
| ESD CDM (Charged Device Model, JEDEC JS-002) | -500 | 500 | V | JEDEC JS-002 | 3 | ||
| On-resistance | RDS(ON) | 145 | 175 | mΩ | VIN = 5V, IOUT=200mA, TA=25°C | 4 | |
| Input quiescent current | IQ | 90 | 150 | μA | VIN = 5V, OUT floating, VENB = 0V | 4 | |
| Under-Voltage Lockout level (falling) | VUVLO_F | 2.6 | 2.7 | 2.8 | V | VIN voltage falling | 4 |
| Under-Voltage Lockout level (rising) | VUVLO_R | 2.7 | 2.8 | 2.9 | V | VIN voltage rising | 4 |
| Over current protection level | IOCP | 2.53 | A | VIN = 5V, TA=25°C | 4 | ||
| OCP accuracy (IOCP > 150mA) | ACCOCP | 15 | % | VIN = 5V, TA=25°C, IOCP > 150mA | 4 | ||
| OCP accuracy (IOCP < 150mA) | ACCOCP | 25 | % | VIN = 5V, TA=25°C, IOCP < 150mA | 4 | ||
| Over-Voltage Protection response time | tOVP | 30 | 50 | ns | VIN rising from 5V with 30V/μs, ROUT = 100Ω, COUT = 0, time from VIN > VOVP_R to OUT voltage stop rising | 4 | |
| Input shutdown current | ISD | 1 | μA | VIN = 5V, OUT grounded, VENB = 5V | 4 | ||
| Over-Voltage Protection level (falling) | VOVP_F | 5.9 | V | VIN voltage falling | 4 | ||
| Over-Voltage Protection level (rising) | VOVP_R | 6 | V | VIN voltage rising | 4 | ||
| Short circuit protection level | ISHORT | 5 | A | VIN = 5V, TA=25°C | 4 | ||
| Output auto discharge | RDIS | 3 | kΩ | VIN = 5V, VEN = 0V | 4 | ||
| Enable logic high voltage level | VIH | 1.4 | V | VIN = 2.4V to 6V | 4 | ||
| Enable logic high voltage level (VIL row, printed name) | VIL | 0.4 | V | VIN = 2.4V to 6V | 4 | ||
| OCP qualification time | tOCP_QUAL | 150 | μs | VIN = 5V, TA = 25°C, qualification time from IOUT hits IOCP to switch turned off | 4 | ||
| Load switch turned on delay | tDON | 10 | ms | VIN = 5V, ROUT = 100Ω, COUT = 22μF, time from enabled to VOUT = 0.5 | 4 | ||
| Output rising time | tR | 450 | μs | VIN = 5V, ROUT = 100Ω, COUT = 22μF, time from VOUT = 0.1×VIN to 0.9×VIN | 4 | ||
| Load switch turned off delay | tOFF | 10 | μs | VIN = 5V, ROUT = 500Ω, COUT = 0.1μF, time from disabled to VOUT = 0.9×VIN | 4 | ||
| Thermal shutdown trigger | TSD | 150 | °C | Temperature rising | 4 | ||
| Thermal shutdown release | TSD_REL | 130 | °C | Temperature falling | 4 |
CAD (KiCad official)
- Symbol:
LP5309B3F - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
lp5309b3f-etched.step/lp5309b3f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lp5309b3f.step/lp5309b3f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LOWPOWER(微源半导体) datasheet (8 pp, sha256
92bf10761ea8bfde, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).