# LP5301QVF

**LOWPOWER** · Battery Management ICs · DFN-8-EP(2x2)

LP5301QVF from LOWPOWER, in a DFN-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Input pin; a 1uF low ESR ceramic capacitor or larger must be connected as close as possible to this pin, with a 50V capacitor recommended or as the application requires. |
| 2 | GND | power_in | Ground pin. |
| 3 | NC | unconnected | No connect; this pin must be left floating without connecting to GND or a high voltage. |
| 4 | NC | unconnected | No connect; this pin must be left floating without connecting to GND or a high voltage. |
| 5 | EN | input | Chip enable pin, active low; VEN(L) maximum is 0.4 V and VEN(H) minimum is 1.4 V. |
| 6 | NC | unconnected | No connect; this pin must be left floating without connecting to GND or a high voltage. |
| 7 | ISET | passive | Current program pin; connect a resistor to ground to set the OCP threshold (RSET options 51K, 82K, 150K or NC). |
| 8 | VOUT | power_out | Output pin that connects to VIN through the internal MOSFET, which is switched off on OVP or OCP events. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | LOWPOWER |
| Package | DFN-8-EP(2x2) |
| Category | Power Management ICs |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage to GND |  |  |  | 36 | V |  | 3 |
| Output Voltage to GND |  |  |  | 6.5 | V |  | 3 |
| Other Pin to GND |  |  |  | 6 | V |  | 3 |
| Maximum Junction Temperature |  |  |  | 150 | °C |  | 3 |
| Operating Ambient Temperature Range (TA) | TA | -40 |  | 85 | °C |  | 3 |
| HBM (Human Body Model) ESD |  |  |  | 2 | KV | Human Body Model | 3 |
| MM (Machine Model) ESD |  |  |  | 200 | V | Machine Mode | 3 |
| Thermal Resistance (DFN-8, θJA) | θJA |  |  | 46 | ℃/W | DFN-8 | 3 |
| Maximum Power Dissipation (DFN-8, PD) | PD |  |  | 1.5 | W | DFN-8, TA=25°C | 3 |
| VIN Input Voltage | VIN | 3.5 |  | 36 | V |  | 4 |
| Enable Threshold Low | VEN(L) |  | 0.4 |  | V | Chip enable | 4 |
| Enable Threshold High | VEN(H) | 1.4 |  | 5 | V | Chip shutdown | 4 |
| Under voltage lock out threshold | UVLO | 2.6 | 2.8 | 3 | V | VIN increasing from 0~5V | 4 |
| Under voltage lock out hysteresis | VHYS-UVLO |  | 500 |  | mV | VIN decreasing from 5~0V | 4 |
| OVP threshold | VOVP | 5.8 | 6.1 | 6.4 | V | VIN increasing from 5~7V | 4 |
| OVP hysteresis | VHYS-OVP |  | 300 |  | mV | VIN decreasing from 7~5V | 4 |
| IOCP Limit Current | IOCPLIMIT | 2.1 |  | 2.5 | A | RSET=NC | 4 |
| Input quiescent current | IQ |  | 110 |  | μA | EN=LOW, IOUT=0A | 4 |
| Input shutdown current | ISD |  | 1 |  | μA | EN=HIGH, IOUT=0A | 4 |
| IN-to-OUT ON resistance | RON |  | 130 |  | mΩ | IOUT=1A | 4 |
| Output discharge resistance | RDISCHARGE |  | 4.3 |  | kΩ |  | 4 |
| Output power-on time | TON |  | 9 |  | ms | EN=LOW, VIN=0->5V to output ON | 4 |
| Turn on through EN | TON |  | 9 |  | ms | EN=HIGH->LOW to output ON | 4 |
| OVP active time | TOVP |  | 1 |  | μs | VIN=5→10V | 4 |
| OVP recovery time | TON(OVP) |  | 9 |  | ms | VIN=10→5V to output ON | 4 |
| OCP threshold | IOCP |  | 1.9 |  | A | RSET=51K | 4 |
| OCP threshold | IOCP |  | 1.3 |  | A | RSET=82K | 4 |
| OCP threshold | IOCP |  | 0.85 |  | A | RSET=150K | 4 |
| OCP active time | TOCP |  | 30 |  | ms |  | 4 |
| ISET Voltage | VISET |  | 0.8 |  | V |  | 4 |
| OCP recovery time | TON(OCP) |  | 1 |  | s |  | 4 |
| OTP threshold | TOTP |  | 150 |  | ℃ |  | 4 |
| OTP hysteresis | TOTP_HYS |  | 20 |  | ℃ |  | 4 |

## CAD (KiCad official)

- Symbol: `LP5301QVF`
- Footprint: `Package_DFN_QFN:DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm`
- 3D model: DFN-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `lp5301qvf-etched.step` / `lp5301qvf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lp5301qvf.step` / `lp5301qvf.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [LOWPOWER datasheet](docs/lp5301qvf-datasheet.pdf) (8 pp, sha256 `61dd519d2eabc92b`, retrieved 2026-10-28, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lp5301qvf-datasheet.pdf)