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Contents

README

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LP2997MX

Texas Instruments · Power Management - Specialized · SOIC-8

LP2997MX from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin for the regulator.
2 SD input Active-low shutdown pin for suspend-to-RAM: pulling it low tri-states VTT while VREF stays active, with a minimum high level of 1.9V and a maximum low level of 0.8V; it has an internal pull-up, so it can be tied to AVIN or left open to keep the part on.
3 VSENSE input Feedback input for regulating VTT, intended to be connected to the middle of the termination bus for improved remote load regulation, and it must still be connected to VTT if remote sensing is not used.
4 VREF power_in Buffered output of the internal reference VDDQ/2 for the chipset and memory, which stays active during shutdown and thermal shutdown and is recommended to be bypassed with a 0.1 µF to 0.01 µF ceramic capacitor.
5 VDDQ input Input used to generate the internal reference for VTT (VDDQ/2), presenting about 100 kΩ impedance; for SSTL-18 it is a 1.8V signal and can be sensed remotely at the DIMM.
6 AVIN power_in Supply input for the internal control circuitry, specified at 2.2V to 5.5V and required to be greater than or equal to PVIN.
7 PVIN power_in Supply rail for the VTT output stage, recommended at 1.8V or 2.5V and never allowed to exceed AVIN.
8 VTT power_out Regulated termination output equal to VDDQ/2 that sources and sinks up to ±0.5A continuous and tri-states in shutdown or thermal shutdown.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Power Management (PMIC)
Pins 8

CAD (KiCad official)

  • Symbol: LP2997MX
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: lp2997mx-etched.step / lp2997mx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp2997mx.step / lp2997mx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (28 pp, sha256 db63c8b8af1fb897, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF