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Contents

README

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LP103SB6F

LOWPOWER · USB Converters · SOT-23-6

LP103SB6F from LOWPOWER, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D+ bidirectional USB D+ data line input/output. Used for BC1.2 handshake and for driving the DCP/QC/SFCP/FCP protocol voltages (0.325V/0.6V/1V/2V/3V/3.3V) via internal switches and detectors.
2 GND power_in Device ground reference for all internal circuitry, analog and power return.
3 FBO output Feedback loop drive output. Connects to the reference/feedback input of the external power-supply error amplifier to set the VBUS output voltage. FBO sources current in ~2µA steps to program 5V/9V/12V/20V (QC2.0) or continuous mode with ±0.2V steps (QC3.0). Typical divider uses a fixed 100kΩ high-side resistor: VBUS = (100k/RLS + 1) x VFB.
4 QC_EN input High-Voltage Quick Charge enable. Drive low to disable HVQC (Qualcomm QC2.0/3.0) for high-current low-voltage applications. Drive high (or leave floating) to enable HVQC operation. Internally pulled high by a 2µA current source. VIH = VPS-1V, VIL = 1V max.
5 PS power_in Power Source pin for the internally generated supply. Fed from VBUS through a series resistor (~2.2kΩ recommended) so the internal shunt regulator sees <8mA; also requires a decoupling capacitor to GND. VPS operating range 3.1V to 6.3V (typ 4.3V), shunt clamp ~6.2V, UVLO threshold ~2.7V.
6 D- bidirectional USB D- data line input/output. Used for BC1.2 short-detect handshake and for driving/monitoring the DCP/QC/SFCP protocol voltages. Internal ~19.53kΩ pull-down (RDM(DWN)) is switched in during QC handshake.

Key specifications

Parameter Value
Manufacturer LOWPOWER
Package SOT-23-6
Category Interface
Pins 6

Ordering variants

Same part, different packaging or reel option.

  • LP103SB6F
  • LP103SB6FSOF

CAD (KiCad official)

  • Symbol: LP103SB6F
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: lp103sb6f-etched.step / lp103sb6f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lp103sb6f.step / lp103sb6f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LOWPOWER datasheet (9 pp, sha256 59508ad8558dfa87, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF