LNK364PN

{
 "schema": "adom.pads/1",
 "slug": "lnk364pn",
 "footprint": "DIP-8_W7.62mm",
 "generated_from": {
  "footprint": "DIP-8_W7.62mm@sha256:222fb44370968119",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   0.0,
   0.0
  ],
  "corner": "bottom-right",
  "source": "fab-chamfer",
  "derived_from": "DIP-8_W7.62mm@sha256:222fb44370968119"
 },
 "pad_count": 8,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8"
 ],
 "paste_apertures": 0,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "thru_hole",
   "shape": "roundrect",
   "at": [
    0.0,
    0.0
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "1",
   "name": "S",
   "type": "power_in",
   "description": "Power MOSFET source connection. Also the ground reference for the BYPASS and FEEDBACK pins. Multiple SOURCE pins are tied together internally and should be soldered to a sufficient copper area for thermal dissipation (kept at or below 100 °C).",
   "is_pin1": true,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "thru_hole",
   "shape": "circle",
   "at": [
    0.0,
    2.54
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "2",
   "name": "S",
   "type": "power_in",
   "description": "Power MOSFET source connection (tied to other SOURCE pins internally). Serves as the ground reference for the BP and FB pins and as the primary thermal path.",
   "is_pin1": false,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "thru_hole",
   "shape": "circle",
   "at": [
    0.0,
    5.08
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "3",
   "name": "BP",
   "type": "power_in",
   "description": "BYPASS pin. Connection point for a 0.1 µF external bypass capacitor to the internally generated 5.8 V supply. Undervoltage disables the MOSFET below 4.8 V; a 6.3 V shunt clamps the pin. If an external bias winding is used, current into BP must not exceed 1 mA.",
   "is_pin1": false,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "thru_hole",
   "shape": "circle",
   "at": [
    0.0,
    7.62
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "4",
   "name": "FB",
   "type": "input",
   "description": "FEEDBACK pin. ON/OFF control input; MOSFET switching for the next cycle is disabled when the current delivered into this pin exceeds the ~49 µA logic-high threshold (V_FB ≈ 1.63 V for LNK363/364). Sampled at the start of each oscillator cycle.",
   "is_pin1": false,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "thru_hole",
   "shape": "circle",
   "at": [
    7.62,
    7.62
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "5",
   "name": "D",
   "type": "power_in",
   "description": "DRAIN pin. High-voltage (700 V BV_DSS) power MOSFET drain connection to the transformer primary. Also supplies internal operating current for both startup and steady-state via an integrated high-voltage current source, eliminating the need for a bias winding.",
   "is_pin1": false,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "thru_hole",
   "shape": "circle",
   "at": [
    7.62,
    5.08
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "6",
   "name": "S",
   "type": "power_in",
   "description": "Power MOSFET source connection (tied to other SOURCE pins internally). Note: on the DIP-8B outline, pin 6 is often omitted on Power Integrations parts to provide HV creepage between DRAIN (pin 5) and SOURCE; verify against the package drawing.",
   "is_pin1": false,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "thru_hole",
   "shape": "circle",
   "at": [
    7.62,
    2.54
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "7",
   "name": "S",
   "type": "power_in",
   "description": "Power MOSFET source connection (tied to other SOURCE pins internally). Ground reference for BP/FB and primary thermal path.",
   "is_pin1": false,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "thru_hole",
   "shape": "circle",
   "at": [
    7.62,
    0.0
   ],
   "rot": 0.0,
   "size": [
    1.6,
    1.6
   ],
   "layers": [],
   "thermal": false,
   "pin": "8",
   "name": "S",
   "type": "power_in",
   "description": "Power MOSFET source connection (tied to other SOURCE pins internally). Ground reference for BP/FB and primary thermal path.",
   "is_pin1": false,
   "source": {
    "geometry": "DIP-8_W7.62mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}