component

LN2670TZHG

Public Made by Adom

by adom

LRC MOSFETs, SOT-89. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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LN2670TZHG

LRC · MOSFETs · SOT-89

LN2670TZHG from LRC, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input MOSFET gate terminal; the datasheet rates gate-to-source voltage VGS at ±20 V.
2 Drain passive MOSFET drain terminal; the datasheet rates drain-to-source voltage VDSS at 60 V.
3 Source passive MOSFET source terminal, the reference for gate drive and the drain-source rating (VDSS 60 V).

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-89
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-Source Threshold Voltage VGS(th) 1 2 3.2 V VDS = VGS, ID = 250 uA 2
Gate-Body Leakage IGSS -100 100 nA VDS = 0 V, VGS = ±20 V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 48 V, VGS = 0 V 2
Drain-Source On-Resistance RDS(on) 70 mΩ VGS = 10 V, ID = 3 A 2
Drain-Source On-Resistance RDS(on) 85 mΩ VGS = 5 V, ID = 2 A 2
Drain-Source Breakdown Voltage V(BR)DSS 60 V VGS = 0 V, ID = 250 µA 2
Drain-to-Source Voltage VDSS 60 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 4.6 A TA = 25°C 1
Continuous Drain Current ID 3.5 A TA = 70°C 1
Pulsed Drain Current IDM 18 A Pulse width limited by maximum junction temperature (Note 1) 1
Total Device Dissipation PD 1.5 W 1
Junction and Storage Temperature TJ,Tstg -55 150 ºC 1
Avalanche Current IAS 12 A L = 0.1 mH 1
Avalanche Energy EAS 7.2 mJ L = 0.1 mH 1
Thermal Resistance, Junction-to-Ambient RΘJA 85 ºC/W Surface mounted on 1.5 x 1.5 in FR4 board, 1 sq in pad, 2 oz Cu (Note 2) 1
Thermal Resistance, Junction-to-Case RΘJC 35 ºC/W 1
Thermal Resistance, Junction-to-Ambient RΘJA 163 ºC/W Surface mounted on 30.0mm×25.0mm×1.6mm FR4, 1 oz Cu (Note 3) 1

CAD (KiCad official)

  • Symbol: LN2670TZHG
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: ln2670tzhg-etched.step / ln2670tzhg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ln2670tzhg.step / ln2670tzhg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (7 pp, sha256 681ec68f51716d48, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF