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Ray Publish 0.1.0 27a3b7f 7d ago

LMV722MT

UMW · Operational Amplifier · TSSOP-8

LMV722MT from UMW, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUTA output Amplifier A output, rail-to-rail.
2 INA- input Amplifier A inverting input; voltage range can go from (VS- - 0.1V) to (VS+ + 0.1V).
3 INA+ input Amplifier A non-inverting input; same voltage range as the inverting input, (VS- - 0.1V) to (VS+ + 0.1V).
4 VSS power_in Negative power supply, normally tied to ground; VS+ to VS- must be 2.5V to 5.5V, bypass with 0.1µF close to the part if not grounded.
5 INB+ input Amplifier B non-inverting input; same voltage range as the inverting input, (VS- - 0.1V) to (VS+ + 0.1V).
6 INB- input Amplifier B inverting input; voltage range can go from (VS- - 0.1V) to (VS+ + 0.1V).
7 OUTB output Amplifier B output, rail-to-rail.
8 VDD power_in Positive power supply, 2.5V to 5.5V between VS+ and VS-; bypass with 0.1µF capacitor as close to the part as possible.

Key specifications

Parameter Value
Manufacturer UMW
Package TSSOP-8
Category Amplifiers/Comparators
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating supply voltage VS 2.5 5.5 V 6
Operating temperature range TA -40 125 °C 7
Supply voltage, VS+ to VS- VS+, VS- 7 V TA=25°C 3
Junction temperature TJ 160 °C 3
Storage temperature range TSTG -65 150 °C 3
Lead temperature range (soldering) TJL 260 °C 10 sec 3
Electrostatic discharge, HBM ESD -4000 4000 V HBM 3
Electrostatic discharge, CDM ESD -1000 1000 V CDM 3
Package thermal resistance, TSSOP-8 θJA 153 °C/W TSSOP-8 package, as listed in order of the package table 7
Input offset voltage VOS -3.5 3.5 mV VS=5.0V, TA=+25°C, VCM=VS/2, VO=VS/2, RL=10kΩ connected to VS/2 4

CAD (KiCad official)

  • Symbol: LMV722MT
  • Footprint: Package_SO:TSSOP-8_3x3mm_P0.65mm
  • 3D model: TSSOP-8 (KiCad packages3D, STEP)
  • 3D model files: lmv722mt-etched.step / lmv722mt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmv722mt.step / lmv722mt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (25 pp, sha256 9ce2559f30e9d28e, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF