component

LMV602M

Public Made by Adom

by adom

HGSEMI Operational Amplifier, SOP-8. Datasheet-verified pinout, KiCad symbol/footprint/3D.

componentop-amp-cmplmv602m
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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

markdown

LMV602M

HGSEMI · Operational Amplifier · SOP-8

LMV602M from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUTA output Output of amplifier A. Rail-to-rail output; typical short-circuit source current 84 mA and sink 75 mA into a 10 Ω load referenced to VS/2.
2 INA- input Inverting input of amplifier A. Rail-to-rail input; common-mode range extends 100 mV beyond supply rails (VSS-0.1 V to VDD+0.1 V). Input bias current ~1 pA typ.
3 INA+ input Non-inverting input of amplifier A. Rail-to-rail input with embedded RF anti-EMI filter. Input common-mode range VSS-0.1 V to VDD+0.1 V.
4 VSS power_in Negative supply / ground. For single-supply use, connect to GND; for dual-supply operation (±1.05 V to ±2.75 V) bypass to ground with a 0.1 µF ceramic capacitor.
5 INB+ input Non-inverting input of amplifier B. Rail-to-rail input with embedded RF anti-EMI filter. Common-mode range VSS-0.1 V to VDD+0.1 V.
6 INB- input Inverting input of amplifier B. Rail-to-rail input; input bias current ~1 pA typ, offset voltage 3.5 mV max.
7 OUTB output Output of amplifier B. Rail-to-rail output; slew rate 0.6 V/µs typ, gain-bandwidth product 1 MHz.
8 VDD power_in Positive supply. Operating range 2.1 V to 5.5 V (absolute max VDD-VSS = 7.5 V). Bypass with 0.1 µF ceramic capacitor placed close to the pin.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • LMV602MM/TR
  • LMV602MN
  • LMV602MMM/TR
  • LMV602MDQ2/TR

CAD (KiCad official)

  • Symbol: LMV602M
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: lmv602m-etched.step / lmv602m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmv602m.step / lmv602m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (11 pp, sha256 4be0fad7aa5cc110, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF