# LMV358IDRG

**HANSCHIP semiconductor** · Operational Amplifier · SOP-8

LMV358IDRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Amplifier A output. Rail-to-rail output stage; short-circuit current ~30 mA typical at Vs=5V; can drive 100kΩ load to within ~8 mV of the supply rails. |
| 2 | -INA | input | Inverting input of amplifier A. Rail-to-rail common-mode range (-0.1V to +5.6V at Vs=5.5V); input bias current ~10 pA typical. |
| 3 | +INA | input | Non-inverting input of amplifier A. Rail-to-rail common-mode range; input bias current ~10 pA typical; input offset voltage ~0.8 mV typical. |
| 4 | -Vs | power_in | Negative supply / ground (V-). Tie to GND for single-supply operation. Total supply (V+ to V-) range 2.1V to 5.5V (absolute max 7.5V). |
| 5 | +INB | input | Non-inverting input of amplifier B. Rail-to-rail common-mode range; input bias current ~10 pA typical. |
| 6 | -INB | input | Inverting input of amplifier B. Rail-to-rail common-mode range; input bias current ~10 pA typical. |
| 7 | OUTB | output | Amplifier B output. Rail-to-rail output stage; short-circuit current ~30 mA typical at Vs=5V. |
| 8 | +Vs | power_in | Positive supply (V+). Operating range 2.1V to 5.5V referenced to -Vs. Quiescent current ~45 μA per amplifier. Bypass to -Vs with a 0.1 μF ceramic capacitor near the pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Op-amp/Cmp |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `LMV358IDRG`
- `LMV358IDRG4`
- `LMV358IDRGIDGKRG`
- `LMV358IDRGIPG`

## CAD (KiCad official)

- Symbol: `LMV358IDRG`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `lmv358idrg-etched.step` / `lmv358idrg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lmv358idrg.step` / `lmv358idrg.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HANSCHIP semiconductor datasheet](docs/lmv358idrg-datasheet.pdf) (14 pp, sha256 `89f5cafab2edefe2`, retrieved 2026-08-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lmv358idrg-datasheet.pdf)