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Contents

README

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LMV324IDT

STMicroelectronics · Operational Amplifier · SOIC-14

LMV324IDT from STMicroelectronics, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT1 output Output of amplifier 1, rail-to-rail output stage capable of approximately 48 mA source/sink current.
2 IN1- input Inverting input of amplifier 1.
3 IN1+ input Non-inverting input of amplifier 1, rail-to-rail input with extended common-mode range from VDD-0.2V to VCC+0.2V.
4 VCC power_in Positive supply voltage pin, operating range 2.7 V to 6 V (absolute maximum 7 V).
5 IN2+ input Non-inverting input of amplifier 2, rail-to-rail input with extended common-mode range from VDD-0.2V to VCC+0.2V.
6 IN2- input Inverting input of amplifier 2.
7 OUT2 output Output of amplifier 2, rail-to-rail output stage capable of approximately 48 mA source/sink current.
8 OUT3 output Output of amplifier 3, rail-to-rail output stage capable of approximately 48 mA source/sink current.
9 IN3- input Inverting input of amplifier 3.
10 IN3+ input Non-inverting input of amplifier 3, rail-to-rail input with extended common-mode range from VDD-0.2V to VCC+0.2V.
11 VDD power_in Negative supply/ground reference pin; input common-mode and output range are referenced from this rail (VDD-0.2V minimum).
12 IN4+ input Non-inverting input of amplifier 4, rail-to-rail input with extended common-mode range from VDD-0.2V to VCC+0.2V.
13 IN4- input Inverting input of amplifier 4.
14 OUT4 output Output of amplifier 4, rail-to-rail output stage capable of approximately 48 mA source/sink current.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOIC-14
Category Amplifiers/Comparators
Pins 14

CAD (KiCad official)

  • Symbol: LMV324IDT
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: lmv324idt-etched.step / lmv324idt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmv324idt.step / lmv324idt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (17 pp, sha256 b37d4ed84d29e6bc, retrieved 2026-09-29, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF