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LMSZ5260BT1G

Public Made by Adom

by adom

LRC Zener Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LMSZ5260BT1G

LRC · Zener Diodes · SOD-123

LMSZ5260BT1G from LRC, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode, identified by the polarity band on the SOD-123 package, per the datasheet's Style 1 pin assignment (Pin 1 = Cathode).
2 Anode passive Anode, the opposite terminal to the cathode per the SOD-123 Style 1 pin assignment (Pin 2 = Anode).

Key specifications

Parameter Value
Manufacturer LRC
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 40.85 43 45.15 V @ IZT = 3.0 mA (Notes 3 and 4) 3
Maximum Zener Impedance ZZT 93 @ IZT = 3.0 mA; IZ(AC) = 0.1 IZ(dc), f = 1 kHz (Note 5) 3
Maximum Zener Impedance ZZK 900 @ IZK = 0.25 mA; IZ(AC) = 0.1 IZ(dc), f = 1 kHz (Note 5) 3
Reverse Leakage Current IR 0.1 A @ VR = 33 V 3
Forward Voltage VF 0.9 V @ IF = 10 mA 3
Zener voltage standard tolerance on nominal VZ VZ -5 5 % Standard tolerance on nominal Zener voltage (Note 3) 3
Total Power Dissipation on FR-5 Board PD 500 mW FR-5 board, minimum recommended footprint (Note 1) @ TL = 75°C 1
Derating above 75°C PD 6.7 mW/°C Derated above TL = 75°C 1
Thermal Resistance, Junction-to-Ambient RJA 340 °C/W Note 2 (infrared scan method) 1
Thermal Resistance, Junction-to-Lead RJL 150 °C/W Note 2 (infrared scan method) 1
Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Case Temperature for Soldering 260 °C For 10 seconds 1
ESD Rating (Human Body Model) 16 kV Class 3, Human Body Model (stated as >16 kV) 1

CAD (KiCad official)

  • Symbol: LMSZ5260BT1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: lmsz5260bt1g-etched.step / lmsz5260bt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmsz5260bt1g.step / lmsz5260bt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (6 pp, sha256 9dcd48ce1826b714, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF