# LMSZ5236BT1G

**LRC** · Zener Diodes · SOD-123

LMSZ5236BT1G from LRC, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode, marked by the polarity band on the package; for the LMSZ5236BT1G the nominal Zener voltage is 7.5 V (min 7.13 V, max 7.88 V) at IZT = 20 mA, with 500 mW total power dissipation rating on FR-5 board. |
| 2 | Anode | passive | Anode, the opposite terminal to the cathode band; the device junction and storage temperature range is -55 °C to +150 °C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | LRC |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Zener voltage | VZ | 7.13 | 7.5 | 7.88 | Volts | @ IZT = 20 mA (Notes 3 and 4) | 3 |
| Maximum Zener impedance | ZZT |  |  | 6 |  | @ IZT = 20 mA | 3 |
| Maximum Zener impedance | ZZK |  |  | 500 |  | @ IZK = 0.25 mA | 3 |
| Reverse leakage current | IR |  |  | 3 | A | @ VR = 6 V | 3 |
| Forward voltage | VF |  |  | 0.9 | V | @ IF = 10 mA | 3 |
| Zener voltage tolerance on nominal VZ | VZ | -5 |  | 5 | % | standard tolerance on nominal Zener voltage (Note 3) | 3 |
| Total power dissipation on FR-5 board | PD |  |  | 500 | mW | @ TL = 75°C (Note 1, FR-5 board) | 1 |
| Thermal resistance, junction-to-ambient | RJA |  |  | 340 | °C/W | Note 2 (infrared scan method) | 1 |
| Thermal resistance, junction-to-lead | RJL |  |  | 150 | °C/W | Note 2 (infrared scan method) | 1 |
| Junction and storage temperature range | TJ, Tstg | -55 |  | 150 | °C |  | 1 |
| ESD rating, Human Body Model |  | 16 |  |  | kV | Class 3, Human Body Model (printed as >16 kV) | 1 |
| Maximum case temperature for soldering purposes |  |  |  | 260 | °C | for 10 seconds | 1 |
| Derating above 75°C | PD |  | 6.7 |  | mW/°C | derated above TL = 75°C (Note 1) | 1 |

## CAD (KiCad official)

- Symbol: `LMSZ5236BT1G`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files: `lmsz5236bt1g-etched.step` / `lmsz5236bt1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lmsz5236bt1g.step` / `lmsz5236bt1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [LRC datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586186983194701824) (6 pp, sha256 `9dcd48ce1826b714`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lmsz5236bt1g-datasheet.pdf)