component
LMR51610YDBVR
Public Made by Adomby adom
TI(德州仪器) , SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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LMR51610YDBVR
TI(德州仪器) · IC · SOT-23-6
LMR51610YDBVR from TI(德州仪器), in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CB | passive | Bootstrap capacitor connection for the high-side FET driver; connect a high quality 100-nF capacitor from this pin to the SW pin. |
| 2 | GND | power_in | Power ground connected to the source of the low-side FET internally; connect to system ground and the ground side of CIN and COUT, with the path to CIN as short as possible. |
| 3 | FB | input | Feedback input to the converter; connect a resistor divider to set the output voltage and never short this terminal to ground during operation. |
| 4 | EN | input | Precision enable input (high = on, low = off); do not float, can be tied to VIN, and allows an adjustable UVLO via an external resistor divider. |
| 5 | VIN | power_in | Supply input to the internal bias LDO and high-side FET (4-V to 65-V operating range); connect to the input supply and input bypass capacitors CIN directly between this pin and GND. |
| 6 | SW | passive | Switching output of the converter, internally connected to the source of the high-side FET and drain of the low-side FET; connect to the power inductor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TI(德州仪器) |
| Package | SOT-23-6 |
| Category | |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN quiescent current (non-switching) | IQ(VIN) | 26.5 | 40 | µA | VEN = 3 V, PFM Variant Only | 5 | |
| VIN shutdown supply current | ISD(VIN) | 0.8 | 3 | µA | VEN = 0 V | 5 | |
| VIN UVLO rising threshold | VINUVLO(R) | 3.82 | 4 | V | VIN rising | 5 | |
| VIN UVLO falling threshold | VINUVLO(F) | 3.4 | 3.56 | V | VIN falling | 5 | |
| EN voltage rising threshold | VEN(R) | 1.1 | 1.227 | 1.36 | V | EN rising, enable switching | 5 |
| EN voltage falling threshold | VEN(F) | 0.85 | 1 | 1.15 | V | EN falling, disable switching | 5 |
| EN pin sourcing current post EN rising threshold | IEN(P2) | 10 | 50 | nA | VEN = 3 V | 5 | |
| Reference voltage | Vfb | 0.788 | 0.8 | 0.812 | V | 5 | |
| Switching frequency, CCM operation, Y version | fSW(CCM) | 0.935 | 1.1 | 1.265 | Mhz | "Y" Version | 5 |
| High-side peak current limit | IHS_PK(OC) | 1.25 | 1.6 | 1.95 | A | LMR51610 | 6 |
| Low-side valley current limit | ILS_V(OC) | 0.9 | 1.1 | 1.3 | A | LMR51610 TJ = -40°C to 105°C | 6 |
| Adjustable output voltage regulation | VOUT | -1.5 | 2.5 | % | PFM operation | 6 | |
| Operating input voltage range (system) | VIN | 4 | 65 | V | 6 | ||
| Maximum switch duty cycle | DMAX | 98 | % | 6 | |||
| VIN quiescent current, FPWM | IQ(VIN) | 420 | µA | VEN = 3 V, FPWM Operation | 5 | ||
| VIN UVLO hysteresis | VINUVLO(H) | 0.25 | V | 5 | |||
| FB input leakage current | IFB(LKG) | 0.2 | nA | VFB = 0.8 V | 5 | ||
| Internal fixed soft-start time | tSS | 2.3 | ms | 5 | |||
| High-side MOSFET on-resistance | RDSON(HS) | 0.7 | Ω | VIN = 12 V, TJ = 25°C | 5 | ||
| Low-side MOSFET on-resistance | RDSON(LS) | 0.36 | Ω | VIN = 12 V, TJ = 25°C | 5 | ||
| Minimum ON pulse width | tON(min) | 80 | ns | VIN = 12 V, IOUT = 0.1A | 5 | ||
| Maximum ON pulse width | tON(max) | 5 | µs | VIN = 12 V, IOUT = 0.5A | 5 | ||
| Minimum OFF pulse width | tOFF(min) | 200 | ns | VIN = 5 V | 6 | ||
| Low-side negative current limit | ILS(NOC) | -0.66 | A | LMR51610 FPWM Only | 6 | ||
| Zero-cross detection current threshold | IZC | 0 | A | 6 | |||
| Thermal shutdown threshold | TJ(SD) | 165 | °C | Temperature rising | 6 | ||
| Thermal shutdown hysteresis | TJ(HYS) | 20 | °C | 6 | |||
| Input supply current when in regulation | ISUPPLY | 38 | µA | VIN = 24 V, VOUT = 5 V, IOUT = 0 A, RFBT = 22.1kΩ, PFM variant | 6 | ||
| FB pin voltage to trip hiccup | VHC | 0.32 | V | 6 | |||
| Switch voltage dead time | tD | 5 | ns | 6 | |||
| VIN to GND | VIN | -0.3 | 70 | V | 4 | ||
| FB to GND | FB | -0.3 | 5.5 | V | 4 | ||
| SW to GND | SW | -0.3 | 70 | V | 4 | ||
| SW to GND transients | SW | -5 | 70 | V | less than 10-ns transients | 4 | |
| CBOOT to SW | CBOOT | -0.3 | 5.5 | V | 4 | ||
| Junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | -2500 | 2500 | V | Human-body model, ANSI/ESDA/JEDEC JS-001 | 4 | |
| ESD CDM | V(ESD) | -750 | 750 | V | Charged-device model, ANSI/ESDA/JEDEC JS-002 | 4 | |
| Input voltage VIN to GND | VIN | 4 | 65 | V | 4 | ||
| EN voltage | EN | 0 | 65 | V | max printed as VIN | 4 | |
| FB voltage | FB | 0 | 4.5 | V | 4 | ||
| Output voltage | VOUT | 0.8 | 28 | V | 4 | ||
| Output current LMR51610 | Iout | 1 | A | 4 | |||
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 147.8 | °C/W | DBV (SOT-23-6), 6 pins | 5 | ||
| Junction-to-ambient thermal resistance with EVM | RθJA(Effective) | 95 | °C/W | 5 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 71.1 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 36.6 | °C/W | 5 | |||
| Junction-to-top characterization parameter | ψJT | 14.2 | °C/W | 5 | |||
| Junction-to-board characterization parameter | ψJB | 36.4 | °C/W | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | The SW pin connecting to the inductor must be as short as possible, and just wide enough to carry the load current without excessive heating. Short, thick traces or copper pours (shapes) must be used | 23 |
CAD (KiCad official)
- Symbol:
LMR51610YDBVR - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
lmr51610ydbvr-etched.step/lmr51610ydbvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lmr51610ydbvr.step/lmr51610ydbvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TI(德州仪器) datasheet (35 pp, sha256
3bcfb87d2af56a09, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).