component
LMR51606XDBVR
Public Made by Adomby adom
TEXAS INSTRUMENTS Global Sourcing Parts, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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LMR51606XDBVR
TEXAS INSTRUMENTS · Global Sourcing Parts · SOT-23-6
LMR51606XDBVR from TEXAS INSTRUMENTS, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CB | passive | Bootstrap capacitor connection for the high-side FET driver; connect a high quality 100-nF capacitor from this pin to the SW pin (CBOOT to SW abs max 5.5 V). |
| 2 | GND | power_in | Power ground, connected internally to the source of the low-side FET; connect to system ground and the ground side of CIN and COUT with the shortest possible path to CIN. |
| 3 | FB | input | Feedback input to the converter; connect a resistor divider to set the output voltage and never short this pin to ground during operation (recommended 0 to 4.5 V). |
| 4 | EN | input | Precision enable input (high = on, low = off) that must not be floated, can be tied to VIN, and allows an adjustable UVLO via an external resistor divider. |
| 5 | VIN | power_in | Supply input to the internal bias LDO and high-side FET, operating from 4 V to 65 V; connect to the input supply with input bypass capacitors CIN directly at this pin and GND. |
| 6 | SW | passive | Switching output of the converter, internally connected to the source of the high-side FET and drain of the low-side FET; connect to the power inductor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | SOT-23-6 |
| Category | Global Sourcing Parts |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN quiescent current (non-switching) | IQ(VIN) | 26.5 | 40 | µA | VEN = 3 V, PFM Variant Only | 5 | |
| VIN shutdown supply current | ISD(VIN) | 0.8 | 3 | µA | VEN = 0 V | 5 | |
| VIN UVLO rising threshold | VINUVLO(R) | 3.82 | 4 | V | VIN rising | 5 | |
| VIN UVLO falling threshold | VINUVLO(F) | 3.4 | 3.56 | V | VIN falling | 5 | |
| EN voltage rising threshold | VEN(R) | 1.1 | 1.227 | 1.36 | V | EN rising, enable switching | 5 |
| EN voltage falling threshold | VEN(F) | 0.85 | 1 | 1.15 | V | EN falling, disable switching | 5 |
| EN pin sourcing current post EN rising threshold | IEN(P2) | 10 | 50 | nA | VEN = 3 V | 5 | |
| Reference voltage | Vfb | 0.788 | 0.8 | 0.812 | V | 5 | |
| Switching frequency, CCM operation | fSW(CCM) | 340 | 400 | 460 | KHz | "X" Version | 5 |
| High-side peak current limit | IHS_PK(OC) | 0.8 | 1.1 | 1.4 | A | LMR51606 | 6 |
| Low-side valley current limit | ILS_V(OC) | 0.62 | 0.8 | 0.98 | A | LMR51606 | 6 |
| Adjustable output voltage regulation | VOUT | -1.5 | 2.5 | % | PFM operation | 6 | |
| Operating input voltage range (system) | VIN | 4 | 65 | V | 6 | ||
| VIN quiescent current FPWM | IQ(VIN) | 420 | µA | VEN = 3 V, FPWM Operation | 5 | ||
| VIN UVLO hysteresis | VINUVLO(H) | 0.25 | V | 5 | |||
| FB input leakage current | IFB(LKG) | 0.2 | nA | VFB = 0.8 V | 5 | ||
| Internal fixed soft-start time | tSS | 2.3 | ms | 5 | |||
| High-side MOSFET on-resistance | RDSON(HS) | 0.7 | Ω | VIN = 12 V, TJ = 25°C | 5 | ||
| Low-side MOSFET on-resistance | RDSON(LS) | 0.36 | Ω | VIN = 12 V, TJ = 25°C | 5 | ||
| Minimum ON pulse width | tON(min) | 80 | ns | VIN = 12 V, IOUT = 0.1A | 5 | ||
| Maximum ON pulse width | tON(max) | 5 | µs | VIN = 12 V, IOUT = 0.5A | 5 | ||
| Minimum OFF pulse width | tOFF(min) | 200 | ns | VIN = 5 V | 6 | ||
| Low-side negative current limit | ILS(NOC) | -0.36 | A | LMR51606 FPWM Only | 6 | ||
| Thermal shutdown threshold | TJ(SD) | 165 | °C | Temperature rising | 6 | ||
| Thermal shutdown hysteresis | TJ(HYS) | 20 | °C | 6 | |||
| Input voltage VIN to GND | VIN | -0.3 | 70 | V | 4 | ||
| EN to GND | EN | -0.3 | 70 | V | Max printed as VIN + 0.3 V | 4 | |
| FB to GND | FB | -0.3 | 5.5 | V | 4 | ||
| SW to GND | SW | -0.3 | 70 | V | 4 | ||
| SW to GND less than 10-ns transients | SW | -5 | 70 | V | 4 | ||
| CBOOT to SW | CBOOT | -0.3 | 5.5 | V | 4 | ||
| Junction Temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 4 | ||
| ESD HBM | V(ESD) | -2500 | 2500 | V | Human-body model, ANSI/ESDA/JEDEC JS-001 | 4 | |
| ESD CDM | V(ESD) | -750 | 750 | V | Charged-device model, ANSI/ESDA/JEDEC JS-002 | 4 | |
| Input voltage VIN to GND | VIN | 4 | 65 | V | 4 | ||
| EN | EN | 0 | V | Max printed as VIN | 4 | ||
| FB | FB | 0 | 4.5 | V | 4 | ||
| Output voltage | VOUT | 0.8 | 28 | V | 4 | ||
| Output current LMR51606 | Iout | 0.6 | A | 4 | |||
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 147.8 | °C/W | DBV (SOT-23, 6 pins) | 5 | ||
| Junction-to-ambient thermal resistance with EVM | RθJA(Effective) | 95 | °C/W | 5 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 71.1 | °C/W | 5 | |||
| Junction-to-board thermal resistance | RθJB | 36.6 | °C/W | 5 | |||
| Junction-to-top characterization parameter | ψJT | 14.2 | °C/W | 5 | |||
| Junction-to-board characterization parameter | ψJB | 36.4 | °C/W | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | The SW pin connecting to the inductor must be as short as possible, and just wide enough to carry the load current without excessive heating. Short, thick traces or copper pours (shapes) must be used | 23 |
CAD (KiCad official)
- Symbol:
LMR51606XDBVR - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
lmr51606xdbvr-etched.step/lmr51606xdbvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lmr51606xdbvr.step/lmr51606xdbvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TEXAS INSTRUMENTS datasheet (35 pp, sha256
3bcfb87d2af56a09, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).