component
LMR33630BDDAR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, SOIC-8-EP. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLMR33630BDDAR
Texas Instruments · DC-DC Converters · SOIC-8-EP
LMR33630BDDAR from Texas Instruments, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground terminal; connect to system ground and AGND, and to the bypass capacitor with short wide traces. |
| 2 | VIN | power_in | Input supply to the regulator; connect a high-quality bypass capacitor or capacitors directly to this pin and PGND. |
| 3 | EN | input | Enable input to the regulator; high = ON, low = OFF, can be connected directly to VIN, must not be left floating. |
| 4 | PG | output | Open-drain power-good flag output; connect to a suitable voltage supply through a current-limiting resistor, high = power OK, low = power bad, pulls low when EN is low, can be left open when not used. |
| 5 | FB | input | Feedback input to the regulator; connect to the tap point of the feedback voltage divider, must not be left floating or grounded. |
| 6 | VCC | power_out | Internal 5-V LDO output used as supply to internal control circuits; do not connect to external loads other than the power-good pull-up, connect a high-quality 1-µF capacitor from this pin to GND. |
| 7 | BOOT | power_in | Bootstrap supply voltage for the internal high-side driver; connect a high-quality 100-nF capacitor from this pin to the SW pin. |
| 8 | SW | power_out | Regulator switch node; connect to the power inductor. |
| 9 | AGND | power_in | Analog ground for the regulator and system, ground reference for internal references and logic; on the HSOIC package the bottom thermal pad serves as both the AGND connection and a thermal connection to the heat-sink ground plane and must be soldered to a ground plane for good electrical and thermal performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
LMR33630BDDAR - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOIC-8-EP (KiCad packages3D, STEP)
- 3D model files:
lmr33630bddar-etched.step/lmr33630bddar-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lmr33630bddar.step/lmr33630bddar.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (57 pp, sha256
71bca20c1f8dd624, retrieved 2026-09-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).