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Contents

README

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LMR33630BDDAR

Texas Instruments · DC-DC Converters · SOIC-8-EP

LMR33630BDDAR from Texas Instruments, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND power_in Power ground terminal; connect to system ground and AGND, and to the bypass capacitor with short wide traces.
2 VIN power_in Input supply to the regulator; connect a high-quality bypass capacitor or capacitors directly to this pin and PGND.
3 EN input Enable input to the regulator; high = ON, low = OFF, can be connected directly to VIN, must not be left floating.
4 PG output Open-drain power-good flag output; connect to a suitable voltage supply through a current-limiting resistor, high = power OK, low = power bad, pulls low when EN is low, can be left open when not used.
5 FB input Feedback input to the regulator; connect to the tap point of the feedback voltage divider, must not be left floating or grounded.
6 VCC power_out Internal 5-V LDO output used as supply to internal control circuits; do not connect to external loads other than the power-good pull-up, connect a high-quality 1-µF capacitor from this pin to GND.
7 BOOT power_in Bootstrap supply voltage for the internal high-side driver; connect a high-quality 100-nF capacitor from this pin to the SW pin.
8 SW power_out Regulator switch node; connect to the power inductor.
9 AGND power_in Analog ground for the regulator and system, ground reference for internal references and logic; on the HSOIC package the bottom thermal pad serves as both the AGND connection and a thermal connection to the heat-sink ground plane and must be soldered to a ground plane for good electrical and thermal performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8-EP
Category Power Management (PMIC)
Pins 9

CAD (KiCad official)

  • Symbol: LMR33630BDDAR
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: SOIC-8-EP (KiCad packages3D, STEP)
  • 3D model files: lmr33630bddar-etched.step / lmr33630bddar-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lmr33630bddar.step / lmr33630bddar.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (57 pp, sha256 71bca20c1f8dd624, retrieved 2026-09-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF